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(11)

EP 4 817 185 A1

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(43) Date of publication: 07.10.2026 Bulletin 2026/41 (21) Application number: 23959705.7 (22) Date of filing: 28.11.2023

(51) International Patent Classification (IPC):  H03M 13/13(2006.01) (52) Cooperative Patent Classification (CPC): H03M 13/31; H04L 1/0042; H04L 1/0058; H04L 1/0071; H04L 1/007 (86) International application number: PCT/CN2023/134610 (87) International publication number: WO 2025/111780 (05.06.2025 Gazette 2025/23)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: WU, Liangming San Diego, CA 92121-1714 (US) LIU, Wei San Diego, CA 92121-1714 (US) JIA, Yinhua San Diego, CA 92121-1714 (US) XU, Changlong San Diego, CA 92121-1714 (US) LI, Jian San Diego, CA 92121-1714 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)