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(11)

EP 4 817 224 A1

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(43) Date of publication: 07.10.2026 Bulletin 2026/41 (21) Application number: 24804644.3 (22) Date of filing: 23.10.2024

(51) International Patent Classification (IPC):  H04L 5/00(2006.01) H04W 52/02(2009.01) H04W 48/12(2009.01) H04W 72/23(2023.01) (52) Cooperative Patent Classification (CPC): H04L 5/0053; H04W 48/12; H04L 5/0094; H04W 52/0229; H04W 72/23 (86) International application number: PCT/US2024/052543 (87) International publication number: WO 2025/117096 (05.06.2025 Gazette 2025/23)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: GE KH MA MD TN (30) Priority: 27.11.2023 US 202318519916 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: XU, Huilin San Diego, California 92121-1714 (US) SUN, Jing San Diego, California 92121-1714 (US) WANG, Xiao Feng San Diego, California 92121-1714 (US) LIU, Le San Diego, California 92121-1714 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)