(19)
(11) EP 4 817 293 A1

(12)

(43) Date of publication:
07.10.2026 Bulletin 2026/41

(21) Application number: 24801446.6

(22) Date of filing: 21.10.2024
(51) International Patent Classification (IPC): 
H04N 23/51(2023.01)
H01L 23/38(2006.01)
H01L 23/36(2006.01)
H01L 23/34(2006.01)
H04N 23/52(2023.01)
H04N 23/54(2023.01)
(52) Cooperative Patent Classification (CPC):
H04N 23/52; H04N 23/51; H04N 23/54; H10F 39/804; H10W 40/28
(86) International application number:
PCT/US2024/052285
(87) International publication number:
WO 2025/117086 (05.06.2025 Gazette 2025/23)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 28.11.2023 US 202318521523

(71) Applicant: Microsoft Technology Licensing, LLC
Redmond, Washington 98052-6399 (US)

(72) Inventors:
  • JIN, Rui
    Redmond, Washington 98052-6399 (US)
  • OH, Minseok
    Redmond, Washington 98052-6399 (US)
  • HOLLOWAY, Frank C
    Redmond, Washington 98052-6399 (US)
  • KIRLOSKAR, Mohan Arvind
    Redmond, Washington 98052-6399 (US)

(74) Representative: CMS Cameron McKenna Nabarro Olswang LLP 
Cannon Place 78 Cannon Street
London EC4N 6AF
London EC4N 6AF (GB)

   


(54) THERMAL ISOLATION FOR HARDWARE COMPONENT PACKAGE