(19)
(11) EP 4 823 971 A1

(12)

(43) Date of publication:
21.10.2026 Bulletin 2026/43

(21) Application number: 24801427.6

(22) Date of filing: 18.10.2024
(51) International Patent Classification (IPC): 
B81B 7/00(2006.01)
(52) Cooperative Patent Classification (CPC):
B81B 7/0061; B81B 7/0064; B81B 2201/0257; B81B 2201/0264; B81C 2203/0154; B81B 2207/012; B81C 2203/019
(86) International application number:
PCT/US2024/051976
(87) International publication number:
WO 2025/128204 (19.06.2025 Gazette 2025/25)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 15.12.2023 US 202318542156

(71) Applicant: QUALCOMM INCORPORATED
San Diego, California 92121-1714 (US)

(72) Inventors:
  • TOPAL, Emre
    San Diego, California 92121-1714 (US)
  • FRANZ, Andreas
    San Diego, California 92121-1714 (US)
  • KREFFT, Anna Katharina
    San Diego, California 92121-1714 (US)
  • PACHER FERNANDES, Rodrigo
    San Diego, California 92121-1714 (US)

(74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte 
Prinzregentenplatz 7
81675 München
81675 München (DE)

   


(54) PACKAGING FOR MICRO-ELECTROMECHANICAL SYSTEM (MEMS) DEVICE