(19)
(11) EP 4 824 129 A1

(12)

(43) Date of publication:
21.10.2026 Bulletin 2026/43

(21) Application number: 24794550.4

(22) Date of filing: 01.10.2024
(51) International Patent Classification (IPC): 
C08G 18/10(2006.01)
C08G 18/50(2006.01)
C08K 3/013(2018.01)
 C08G 18/20(2006.01)
C08G 18/80(2006.01)
(52) Cooperative Patent Classification (CPC):
C08G 18/5024; C08G 18/8067; C08G 18/2063; C08G 18/10; C08K 2201/001; C08K 2003/222; C08K 2201/006; C08K 2201/005; C08K 2003/2227; C08K 2201/014; C08K 5/5419
 
C-Sets:
  1. C08G 18/10, C08G 18/48;
  2. C08K 3/22, C08L 75/08;
  3. C08K 5/103, C08L 75/08;
(86) International application number:
PCT/US2024/049425
(87) International publication number:
WO 2025/128179 (19.06.2025 Gazette 2025/25)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 11.12.2023 US 202363608427 P

(71) Applicant: Dow Global Technologies LLC
Midland, MI 48674 (US)

(72) Inventors:
  • AGARWAL, Praveen
    Lake Jackson, Texas 77566 (US)
  • GAMBOA, Rogelio
    Lake Jackson, Texas 77566 (US)
  • DIAZ, Omar
    Freeport, Texas 77541 (US)

(74) Representative: Beck Greener LLP 
Fulwood House 12 Fulwood Place
London WC1V 6HR
London WC1V 6HR (GB)

   


(54) THERMALLY CONDUCTIVE GAP FILLER COMPOSITIONS WITH STORAGE STABILITY