(19)
(11) EP 4 824 313 A1

(12)

(43) Date of publication:
21.10.2026 Bulletin 2026/43

(21) Application number: 24838147.7

(22) Date of filing: 13.12.2024
(51) International Patent Classification (IPC): 
C23C 14/14(2006.01)
C23C 14/34(2006.01)
C22C 9/04(2006.01)
(52) Cooperative Patent Classification (CPC):
C23C 14/3407; C23C 14/3414; C22C 9/04; C23C 14/14; H01J 37/3435
(86) International application number:
PCT/US2024/060157
(87) International publication number:
WO 2025/129091 (19.06.2025 Gazette 2025/25)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 15.12.2023 US 202363610738 P

(71) Applicant: Materion Corporation
Mayfield Heights, OH 44124 (US)

(72) Inventors:
  • SMATHERS, David Bird
    Mayfield Heights, Ohio 44124 (US)
  • ZENG, Qi
    Mayfield Heights, Ohio 44124 (US)
  • FISHER, Matthew
    Mayfield Heights, Ohio 44124 (US)
  • ZHANG, Qi
    Mayfield Heights, Ohio 44124 (US)
  • GOACHER, Robyn E.
    Mayfield Heights, Ohio 44124 (US)

(74) Representative: Kador & Partner Part mbB 
Corneliusstraße 15
80469 München
80469 München (DE)

   


(54) SPUTTERING TARGET ASSEMBLIES, BACKING PLATE FOR SAME, AND PROCESSES FOR MAKING