(19)
(11) EP 4 824 315 A1

(12)

(43) Date of publication:
21.10.2026 Bulletin 2026/43

(21) Application number: 24904972.7

(22) Date of filing: 13.12.2024
(51) International Patent Classification (IPC): 
C23C 16/22(2006.01)
H01L 21/02(2006.01)
C23C 16/24(2006.01)
(52) Cooperative Patent Classification (CPC):
C07F 9/06; C23C 16/345; C23C 16/45553; C23C 16/45542; C23C 16/452; C23C 16/308; C23C 16/505; C23C 16/4554; C23C 16/24
(86) International application number:
PCT/US2024/060065
(87) International publication number:
WO 2025/129020 (19.06.2025 Gazette 2025/25)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 15.12.2023 US 202363610434 P
01.03.2024 US 202463560233 P
01.03.2024 US 202463560276 P
01.03.2024 US 202463560303 P

(71) Applicant: ASM IP Holding B.V.
1322 AP Almere (NL)

(72) Inventors:
  • VERVUURT, RenĂ© Henricus Jozef
    1322 AP Almere (NL)
  • DEZELAH, Charles
    1322 AP Almere (NL)
  • ROMERO, Patricio
    1322 AP Almere (NL)
  • PORE, Viljami
    1322 AP Almere (NL)

(74) Representative: V.O. 
P.O. Box 87930
2508 DH Den Haag
2508 DH Den Haag (NL)

   


(54) METHODS AND SYSTEMS FOR FORMING A LAYER COMPRISING SILICON