(19)
(11) EP 4 824 614 A1

(12)

(43) Date of publication:
21.10.2026 Bulletin 2026/43

(21) Application number: 23837136.3

(22) Date of filing: 14.12.2023
(51) International Patent Classification (IPC): 
G03F 7/004(2006.01)
C08G 73/10(2006.01)
G03F 7/42(2006.01)
(52) Cooperative Patent Classification (CPC):
G03F 7/0048; G03F 7/425; C08G 73/1032; C08G 73/1071; C08G 73/1053; C08G 73/1039
(86) International application number:
PCT/CN2023/138692
(87) International publication number:
WO 2025/123268 (19.06.2025 Gazette 2025/25)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(71) Applicants:
  • Dow Global Technologies LLC
    Midland, MI 48674 (US)
  • DOW CHEMICAL KOREA LIMITED
    Seoul 06170 (KR)

(72) Inventors:
  • GUI, Qinyuan
    Shanghai 201203 (CN)
  • SHEN, Cheng
    Shanghai 201203 (CN)
  • REN, Hua
    Shanghai 201203 (CN)
  • KIM, Jongcheol
    Seoul 06170 (KR)
  • SHIN, Tsukishima
    Yokohama-shi, Kanagawaken 221-0024 (JP)
  • CHEN, Jitao
    Shanghai 201203 (CN)
  • HE, Meijia
    Shanghai 201203 (CN)

(74) Representative: Beck Greener LLP 
Fulwood House 12 Fulwood Place
London WC1V 6HR
London WC1V 6HR (GB)

   


(54) DEEP EUTECTIC SOLVENT COMPOSITIONS FOR ELECTRONIC APPLICATIONS