(19)
(11) EP 4 824 636 A1

(12)

(43) Date of publication:
21.10.2026 Bulletin 2026/43

(21) Application number: 24813298.7

(22) Date of filing: 10.11.2024
(51) International Patent Classification (IPC): 
G06F 1/20(2006.01)
H05K 7/20(2006.01)
H05K 7/14(2006.01)
(52) Cooperative Patent Classification (CPC):
G06F 1/20; G06F 2200/201; H05K 7/1492; H05K 7/20818; G06F 13/409; G06F 13/4045; G06F 13/4068
(86) International application number:
PCT/US2024/055291
(87) International publication number:
WO 2025/128246 (19.06.2025 Gazette 2025/25)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 13.12.2023 US 202363609759 P
21.03.2024 US 202418613021

(71) Applicant: Microsoft Technology Licensing, LLC
Redmond, Washington 98052-6399 (US)

(72) Inventor:
  • ADRIAN, Jason David
    Redmond, Washington 98052-6399 (US)

(74) Representative: CMS Cameron McKenna Nabarro Olswang LLP 
Cannon Place 78 Cannon Street
London EC4N 6AF
London EC4N 6AF (GB)

   


(54) SIGNAL CONDITIONING CONNECTOR ASSEMBLY WITH THERMAL MANAGEMENT