(19)
(11) EP 4 824 714 A1

(12)

(43) Date of publication:
21.10.2026 Bulletin 2026/43

(21) Application number: 24821414.0

(22) Date of filing: 09.12.2024
(51) International Patent Classification (IPC): 
G06N 10/40(2022.01)
H01L 23/544(2006.01)
(52) Cooperative Patent Classification (CPC):
G06N 10/40; H10W 46/00; H10W 72/07227; H10W 46/301
(86) International application number:
PCT/EP2024/085208
(87) International publication number:
WO 2025/125129 (19.06.2025 Gazette 2025/25)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 12.12.2023 US 202318537506

(71) Applicant: International Business Machines Corporation
Armonk, New York 10504 (US)

(72) Inventors:
  • NAH, Jae-Woong
    Yorktown Heights, New York 10598 (US)
  • ABRAHAM, David
    Yorktown Heights, New York 10598 (US)
  • COTTE, John
    Yorktown Heights, New York 10598 (US)
  • KUMPH, Muir
    Yorktown Heights, New York 10598 (US)

(74) Representative: IBM Deutschland GmbH 
Intellectual Property Law IBM Campus 1
71139 Ehningen
71139 Ehningen (DE)

   


(54) MODULAR PACKAGE STRUCTURES WITH INTERPOSERS HAVING ALIGNMENT FEATURES