(19)

(11)

EP 4 824 839 A1

(12)

(43) Date of publication: 21.10.2026 Bulletin 2026/43 (21) Application number: 24827544.8 (22) Date of filing: 27.11.2024

(51) International Patent Classification (IPC):  H01G 4/38(2006.01) H01L 25/065(2023.01) H10D 1/68(2025.01) (52) Cooperative Patent Classification (CPC): H01G 4/38; H01G 4/33; H01G 4/228; H01G 4/005; H01G 4/012; H10D 1/047; H10W 90/00; H10W 90/20; H10W 72/01; H10W 72/834 (86) International application number: PCT/US2024/057717 (87) International publication number: WO 2025/128335 (19.06.2025 Gazette 2025/25)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: GE KH MA MD TN (30) Priority: 15.12.2023 US 202318542052 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: CHEN, Yujen San Diego, California 92121-1714 (US) SUN, Yangyang San Diego, California 92121-1714 (US) (74) Representative: Wagner & Geyer  Partnerschaft mbB Patent- und Rechtsanwälte Gewürzmühlstrasse 5 80538 München 80538 München (DE)