(19)
(11) EP 4 824 862 A1

(12)

(43) Date of publication:
21.10.2026 Bulletin 2026/43

(21) Application number: 24820818.3

(22) Date of filing: 18.11.2024
(51) International Patent Classification (IPC): 
H01L 21/283(2006.01)
H10D 30/01(2025.01)
H01L 21/768(2006.01)
H10D 64/23(2025.01)
B82Y 10/00(2011.01)
H01L 23/528(2006.01)
H10D 30/00(2025.01)
H10D 64/01(2025.01)
H10D 84/01(2026.01)
(52) Cooperative Patent Classification (CPC):
B82Y 10/00; H10D 30/501; H10D 30/0198; H10D 84/832; H10D 64/251; H10D 64/017; H10D 84/0149; H10D 62/116; H10D 62/822; H10D 84/0151; H10W 20/069; H10W 20/023; H10W 20/427; H10W 20/0242; H10W 20/481; H10W 20/0253
(86) International application number:
PCT/IB2024/061521
(87) International publication number:
WO 2025/125947 (19.06.2025 Gazette 2025/25)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 13.12.2023 US 202318537943

(71) Applicant: International Business Machines Corporation
Armonk, New York 10504 (US)

(72) Inventors:
  • MUKESH, Sagarika
    ALBANY, New York 12203 (US)
  • LI, Tao
    ALBANY, New York 12203 (US)
  • XIE, Ruilong
    ALBANY, New York 12203 (US)
  • LOUBET, Nicolas
    ALBANY, New York 12203 (US)

(74) Representative: IBM United Kingdom Limited 
Intellectual Property Law Hursley Park
Winchester, Hampshire SO21 2JN
Winchester, Hampshire SO21 2JN (GB)

   


(54) SEMICONDUCTOR STRUCTURE WITH CONTACTS HAVING SIDEWALL SPACERS