(19)
(11) EP 4 824 871 A1

(12)

(43) Date of publication:
21.10.2026 Bulletin 2026/43

(21) Application number: 24790027.7

(22) Date of filing: 23.09.2024
(51) International Patent Classification (IPC): 
H01L 23/373(2006.01)
(52) Cooperative Patent Classification (CPC):
H10W 40/251; H10W 40/258; H10W 40/70
(86) International application number:
PCT/US2024/047946
(87) International publication number:
WO 2025/128172 (19.06.2025 Gazette 2025/25)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 13.12.2023 US 202363609440 P
22.03.2024 US 202463568584 P
04.06.2024 US 202463655731 P

(71) Applicant: Arieca Inc.
Pittsburgh, PA 15208 (US)

(72) Inventors:
  • FELLER, Keyton D.
    Pittsburgh, Pennsylvania 15207 (US)
  • MONDAL, Swagata
    Pittsburgh, Pennsylvania 15221 (US)
  • DORAU, Benjamin
    Monroeville, Pennsylvania 15146 (US)
  • MEA, Hing Jii
    Pittsburgh, Pennsylvania 15221 (US)
  • KAZEM, Navid
    Pittsburgh, Pennsylvania 15212 (US)

(74) Representative: Forresters IP LLP 
Skygarden Erika-Mann-Straße 11
80636 München
80636 München (DE)

   


(54) THERMAL INTERFACE MATERIALS COMPRISING LIQUID METAL DROPLETS AND SOLID THERMALLY CONDUCTIVE PARTICLES, CIRCUIT ASSEMBLIES FORMED THEREFROM, AND METHODS OF MANUFACTURE THEREOF