(19)

(11)

EP 4 824 872 A1

(12)

(43) Date of publication: 21.10.2026 Bulletin 2026/43 (21) Application number: 24822058.4 (22) Date of filing: 20.11.2024

(51) International Patent Classification (IPC):  H01L 23/433(2006.01) H01L 23/498(2006.01) (52) Cooperative Patent Classification (CPC): H10W 40/778; H10W 70/635; H10W 90/701 (86) International application number: PCT/US2024/056670 (87) International publication number: WO 2025/128296 (19.06.2025 Gazette 2025/25)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: GE KH MA MD TN (30) Priority: 13.12.2023 US 202318538738 (71) Applicant: QUALCOMM Incorporated San Diego, CA 92121-1714 (US)	(72) Inventors: LAN, Je-Hsiung San Diego, California 92121 (US) KIM, Jonghae San Diego, California 92121 (US) DUTTA, Ranadeep San Diego, California 92121 (US) (74) Representative: Wagner & Geyer  Partnerschaft mbB Patent- und Rechtsanwälte Gewürzmühlstrasse 5 80538 München 80538 München (DE)