(19)
(11) EP 4 824 873 A1

(12)

(43) Date of publication:
21.10.2026 Bulletin 2026/43

(21) Application number: 24828569.4

(22) Date of filing: 26.11.2024
(51) International Patent Classification (IPC): 
H01L 23/49(2006.01)
H10D 88/00(2026.01)
H01L 23/00(2006.01)
 H01L 23/50(2006.01)
H01L 23/498(2006.01)
(52) Cooperative Patent Classification (CPC):
H10W 90/701; H10W 72/00; H10W 72/20
(86) International application number:
PCT/US2024/057482
(87) International publication number:
WO 2025/128321 (19.06.2025 Gazette 2025/25)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 14.12.2023 US 202318540542

(71) Applicant: QUALCOMM INCORPORATED
San Diego, California 92121-1714 (US)

(72) Inventors:
  • LI, Yue
    San Diego, California 92121-1714 (US)
  • HUANG, Ching-Liou
    San Diego, California 92121-1714 (US)
  • LANE, Ryan
    San Diego, California 92121-1714 (US)
  • PAYNTER, Charles David
    San Diego, California 92121-1714 (US)
  • GUPTA, Piyush
    San Diego, California 92121-1714 (US)

(74) Representative: Wagner & Geyer 
Partnerschaft mbB Patent- und Rechtsanwälte Gewürzmühlstrasse 5
80538 München
80538 München (DE)

   


(54) PACKAGE COMPRISING INTEGRATED DEVICES AND A PASSIVE DEVICE