(19)

(11)

EP 4 824 948 A1

(12)

(43) Date of publication: 21.10.2026 Bulletin 2026/43 (21) Application number: 24827514.1 (22) Date of filing: 26.11.2024

(51) International Patent Classification (IPC):  H03K 19/003(2006.01) G06F 1/12(2006.01) G01R 31/3185(2006.01) H03K 21/02(2006.01) (52) Cooperative Patent Classification (CPC): H03K 19/00361; H03K 21/023; G06F 1/08; G01R 31/318541 (86) International application number: PCT/US2024/057534 (87) International publication number: WO 2025/128326 (19.06.2025 Gazette 2025/25)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: GE KH MA MD TN (30) Priority: 12.12.2023 US 202318537583 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: PENG, Yimai San Diego, California 92121 (US) VACHON, Robert Joseph San Diego, California 92121 (US) YINGLING, Daniel San Diego, California 92121 (US) BOWMAN, Keith Alan San Diego, California 92121 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)