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(11)

EP 4 824 974 A1

(12)

(43) Date of publication: 21.10.2026 Bulletin 2026/43 (21) Application number: 23961180.9 (22) Date of filing: 15.12.2023

(51) International Patent Classification (IPC):  H04L 1/1607(2023.01) (52) Cooperative Patent Classification (CPC): H04L 1/1825; H04L 1/1822; H04L 1/0026; H04L 1/0045; H04L 1/0061; H04L 5/0055 (86) International application number: PCT/CN2023/139083 (87) International publication number: WO 2025/123320 (19.06.2025 Gazette 2025/25)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: HAO, Chenxi San Diego California 92121-1714 (US) YOO, Taesang San Diego California 92121-1714 (US) BALEVI, Eren San Diego California 92121-1714 (US) HU, Rui San Diego California 92121-1714 (US) XU, Hao San Diego California 92121-1714 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)