Technical Field
[0001] This invention relates to control porosity dispenser cathodes and methods for making
the same.
Background of the Invention
[0002] This invention is a further advance pertaining to the structure of and the method
for fabricating controlled porosity dispenser cathodes.
[0003] Thermionic emission cathodes of the type that can be used in microwave tubes such
as traveling wave tubes are, in many applications, required to have high reliability
and long life. It is also desirable that all areas of the cathode surface be operated
in a space charge limited mode for more stable operation.
[0004] Conventional cathodes, such as the "B", the "S" and the "M" types, are made of random
porosity structures impregnated with barium calcium aluminate compounds and generally
tend to provide a non-uniform emission over the surface of the cathode. The result
is that excessive temperatures are required to assure that space charge limited emission
is achieved in less active areas of the cathode surface. Consequently, the more active
areas become excessively hot resulting in decreased reliability and shortened life.
The end result is that emission is gradually reduced as the pores become depleted
of the impregnant. Examples of these types of cathodes are disclosed in U.S. Patent
No. 2,700,000, issued on January 18, 1955 to R. Levi et al. and U.S. Patent No. 2,722,626,
issued on November 1, 1955 to P. P. Coppola et al.
[0005] In order to attain the goals of long life and reliability, a number of approaches
have-heretofore been used. Previously, a thin layer of porous metal was formed directly
on the emitting surface of the reservoir of activating material such as by evaporation
in a vacuum, by electroplating or by vapor deposition. These approaches are disclosed
in U.S. Patent No. 3,155,864, issued to P. P. Coppola on November 3,1964 and in U.S.
Patents Nos. 3,243,637 and 3,243,638 issued to J. H. Affleck III on March 29, 1966.
[0006] Shortcomings in these approaches are that the porosity of the emitter surface is
random rather than precise and coating directly to the activating material could block
many of the pores.
[0007] One of these more recent approaches is disclosed in U.S. Patent No. 4,101,800, issued
on July 18,1978 to R. E. Thomas wherein a reservoir of activating material is covered
by a perforated metal foil. The perforations enable migration of electron emitting
material from the reservoir of activating material to the foil surface to coat the
surface thereby providing a cathode surface of somewhat uniform emissivity.
[0008] Subsequently, an advance was made in the fabrication of such structures as disclosed
in U.S. Patent No. 4,310,603, issued on January 12, 1982 to L. R. Falce. In this approach,
a perforated metal foil having an appropriate pattern of pore size apertures therein
is formed. Thereafter, this foil is bonded to a generally cylindrical housing such
as by brazing, welding or diffusion bonding.
[0009] Several disadvantages of this last approach are that: the high temperatures associated
with the bonding process cause recrystallisation of the foil material; the use of
dissimilar brazing materials subject the foil surface to contaminates whereupon the
foil has a non-uniform work function; and the braze material can block some of the
apertures in the emitter surface. On top of this, the brazing or welding with unlike
materials creates a distinct possibility that the bond will fail during thermal cycling.
Moreover, fabrication of this kind of device requires a large number of hand processing
steps.
[0010] According to the present invention, there is provided a method for fabricating a
dispenser-reservoir housing for a controlled porosity dispenser cathode characterised
by the steps of:
coating the side surface and adjacent end surface of a mandrel with a layer of a material
to form a monolithic coating of said material by means of crystalline growth;
removing the mandrel to obtain a housing of said material having a side wall and an
end wall which define a reservoir; and
forming an array of apertures through the end wall in open communication with the
reservoir to form an emitter-dispenser surface.
[0011] Preferably, the step of coating is by chemical vapor deposition and the coating material
is tungsten.
[0012] After some additional machining the mandrel is removed such as by etching it away,
thereby leaving the hollow housing of tungsten which will serve as a reservoir for
an activating material. This housing then has an array of apertures drilled in the
top surface such as by a pulsed laser thereby creating a controlled porosity emitter-dispenser
surface.
[0013] At this time, the reservoir of the structure can be filled from the open end with
a barium calcium aluminate compound or other barium bearing compound that will decompose
when heated, thereby supplying activating material to the emitter-dispenser surface
through the array of apertures.
[0014] The filled housing can then be attached to a heater structure to make a complete
dispenser cathode.
[0015] This housing is featured in that it is constructed of a single material wherein the
crystalline-atomic bonding of the top surface and the side walls of the housing forms
an essentially monolithic or single piece. Several advantages include control over
the crystalline orientation in the top surface member which becomes the emitter-dispenser
surface and the fact that there is little likelihood of contaminates forming on the
emission-dispenser surface during fabrication. Consequently, the work function of
the surface is generally uniform whereupon there is a high degree of emission uniformity
across this surface.
[0016] Another advantage is that the dispenser cathode can be operated at a lower temperature
than other dispenser cathodes of the controlled porosity type as a result of the feature
of the support-thermal cross members which tend to distribute the heat more deeply
and uniformly into the activating material and to the emitter-dispenser surface. As
a consequence, it is able to produce a higher emission density for a given temperature
than was heretofore obtained and a more stable emission at these lower temperatures.
Moreover, at these lower temperatures there is a lower evaporation rate thereby resulting
in a reduced loss of the activating material barium and barium oxide (Ba + BO).
[0017] Still another advantage is that the structure is not likely to delaminate or fail
during thermal cycling as a result of its unitary and single material construction.
[0018] In addition, there is dimensional stability and lack of distortion in the emitter-dispenser
surface which might otherwise result from thermal cycling.
[0019] The process and structure has the added manufacturing advantages that it: reduces
the number of manufacturing steps; reduces the hand work required; is suitable for
large scale production; allows very thin wall structures to be readily fabricated;
and results in an easily replicated, precision structure.
[0020] Further purposes and advantages of this invention will become apparent from the study
of the following detailed description, the attached drawings and the claims.
[0021] A preferred embodiment of the invention will now be described by way of example,
with reference to the accompanying drawings, in which:-
FIG. 1 is a schematic perspective view of a mandrel onto which a thin layer of tungsten
or other metal to be coated.
FIG. 2 is a schematic perspective view illustrating the cross member thermal-mechanical
support brazed in place in the mandrel.
FIG. 3 is a schematic perspective view illustrating the mandrel machined to a configuration
for chemical vapor deposition.
FIG. 4 is a cross-sectional side view taken along the line 4-4 of FIG. 3 showing the
mandrel having a thin layer of metal deposited thereon.
FIG. 5 is a cross-sectional view with the mandrel end surface contoured in a spherical
radius, concave configuration.
FIG. 6 is a cross-sectional view illustrating a second thin layer of metal deposited
thereon to form the emitter-dispenser surface and to thicken the side wall of the
emitter-reservoir housing.
FIG. 7 is a cross-sectional view of the hollow emitter-reservoir housing with the
mandrel removed.
FIG. 8 is a cross-sectional view representing the housing of FIG. 7 with the emitter-dispenser
surface thereof drilled to form an array of apertures.
FIG. 9 is a cross-sectional schematic illustration of a control porosity dispenser
cathode including the housing filled with activating material and a heater assembly
attached thereto.
[0022] Referring now to the drawings in more detail, FIG. 1 is illustrative of a first step
of fabrication in which a mandrel is formed having a configuration generally similar
to the configuration of the final emitter-reservoir housing. In this particular embodiment,
the mandrel 20 is cylindrical and is made of molybdenum. It should be understood that
the mandrel could be made of other materials which are capable of withstanding the
temperatures at which the subsequent fabrication steps take place and which are otherwise
compatible with these steps.
[0023] The end face 22 of the mandrel 20 is slotted with two intersecting slots 24 and 26
which extend into the body of the material at right angles to each other and are preferably
both in a plane coextensive with or collateral with the axis of the mandrel. In this
particular embodiment, the slots 24 and 26 extend across the diameter of the mandrel.
[0024] As illustrated in FIG. 2, intersecting strips 28 and 30 of tungsten 0.0508 mm (0.002
inches) thick, which will eventually form thermal-support members, are slotted (not
shown) to interlock together at their crossing point and are inserted into the slots
24 and 26. These strips are of the same material that the remainder of the emitter-reservoir
housing will be made from. While tungsten is used in the preferred embodiment, it
could be of any other material which has an attractive work function and which is
capable of withstanding the operating temperature of the control porosity dispenser
cathode over extended periods of time. These strips 28 and 30 are brazed together
and in place by copper brazing material 32.
[0025] Thereafter, as illustrated by FIG. 3, the mandrel 20 is machined down to remove the
surplus brazing material 32 and the edges of the strips 28 and 30 which protrude beyond
the side and end surfaces of the mandrel 20 so that the strip edges are flush with
the surface of the mandrel. In addition, in this particular embodiment, a shoulder
34 is formed.
[0026] As illustrated by FIG. 4, the mandrel 20 is subjected to chemical vapor deposition
process in which a tungsten coating 36 (not drawn to scale) 0.1016 mm (0.004 of an
inch) thick is formed on the mandrel surface. During this chemical vapor deposition
step, the edges of the strips 28 and 30 atomically bond to the tungsten coating 36.
[0027] This vapor deposition step can be accomplished in a quartz reaction chamber in which
reactive gases of the tungsten metal compound will flow across the heated mandrel
to form the deposited layer. Generally the heat for the mandrel can be supplied by
an inductive type power supply and the flow rate of the gases can be controlled.
[0028] Thereafter, as illustrated by FIG. 5, end surface 22 of the mandrel is machined into
a spherical- radius concave surface 38 such as by electrical discharge machining.
The particular radius and shape of this surface 38 is dependent upon the end application
of the cathode and the type of beam focusing to be used. Thus, this surface 38 could
have been left flat or have other configurations for certain types of applications
and beam focusing.
[0029] As illustrated by FIG. 6, another thin layer of tungsten 40 is formed upon the exposed
surface of the first tungsten coating 36 and the exposed mandrel concave surface 38
by means of the chemical vapor deposition process. The term "thin" as used herein
is about 0.0254 mm (0.001 of an inch) thick in the preferred embodiment. However,
it could also be somewhat less or somewhat greater depending upon the structural integrity
of the layer or upon the ease at which the electron emitting material is to migrate
to the emitting surface. For example, the range could be between about 0.0127 mm (0.0005
of an inch) and 0.127 mm (0.005 of an inch) or, in some cases, more. Care must be
taken to be sure that this layer is not so thin that the activating material will
readily evaporate or so thick that the activating material will not readily migrate
to the emitter surface through the pores to be formed.
[0030] During the vapor deposition, the two layers of tungsten 36 and 40 bond together by
atomic crystalline growth to form a monolithic or single piece of a single material
with a somewhat thickened side wall. In addition, the tungsten coating which forms
the concave emitter-dispenser 42 atomically bonds to the exposed edges of the strips
28 and 30 which form the mechanical- thermal supports. These strips serve to hold
the thin wall emitter-dispenser 42 in its precise configuration and will subsequently
serve to distribute heat into an activating material as well as to the emitter surface.
[0031] As illustrated by FIG. 7, the end segment of the mandrel 20 holding the configured
tungsten coating is cut off at about a plane coextensive with the lower edges of strips
28 and 30, and the molybdenum mandrel 20 is removed such as by a differential solvent
thereby forming a hollow housing with a reservoir 44 formed therein. One differential
solvent which has been found to be effective is nitric acid which etches the molybdenum
and any remaining copper brazing material 32 but does not significantly affect the
tungsten.
[0032] Of course, if, as previously stated, other materials are used for the mandrel 20,
or the housing 48, it may be necessary to use another differential solvent. In addition,
it would be possible to configure the mandrel 20 such that it can be readily withdrawn
from the assembled housing. One way that this could be accomplished would be by tapering
the side wall of the mandrel and coating it with graphite thereby enabling the mandrel
to be easily withdrawn. Moreover, there are other possible approaches that can be
used.
[0033] As illustrated by FIG. 8, an array of apertures 46 is formed through the emitter-dispenser
42 in open communication with the reservoir 44. It is preferable that these apertures
be of small diameter, closely spaced and in a precise pattern. Accordingly, one way
that these apertures have been formed is by laser drilling in which apertures 5.0
microns in diameter on centers spaced 15.0 microns apart have been formed. This results
in a controlled porosity emitter-dispenser 42.
[0034] Thereafter, as further illustrated in FIG. 9 the reservoir 44 of the hollow emitter-dispenser
housing 48 is filled with an activating material 50 through the open end thereof.
One activating material 50 which has been found to be particularly useful is a mixture
of 80% by weight of barium calcium aluminate having a 5:3:2 mole ratio and 20% by
weight of tungsten powder. Of course, other barium bearing compounds that will decompose
when heated to supply activating material to the emitter surface of the emitter-dispenser
42 can be used.
[0035] As further illustrated in FIG. 9, a controlled
' porosity dispenser cathode is formed by attaching the filled emitter-dispenser housing
48 to a heater assembly 54.
[0036] The heater assembly 54 includes a hollow support member 56 made of a high temperature
resistant material such as tungsten which encloses a heater coil 58 potted in a thermally
conductive material 60 such as aluminum oxide AI
20
3. The emitter-reservoir housing 48 is affixed to the end thereof such as by brazing.
Thereafter, heat from the heater coil 58 is conducted to the activating material 50
thereby causing barium and barium oxide to migrate both along the interspace between
the emitter-dispenser 42 and the activating material 50 and directly through the apertures
46 to the emitter surface of the emitter-dispenser 42 thereby continuously replenishing
the activating material on the surface as it is used up during electron emission.
As previously stated, the strips 28 and 30 also provide thermal conductivity into
the activating material 50 and to the emitter surface thereby providing for efficient
operation of the overall device.
1. A method for fabricating a dispenser-reservoir housing (48) for a controlled porosity
dispenser cathode (52) characterised by the steps of:
coating the side surface and adjacent end surface (22) of a mandrel (20) with a layer
(36) of a material to form a monolithic coating of said material by means of crystalline
growth;
removing the mandrel (20) to obtain a housing (48) of said material having a side
wall (36, 40) and an end wall (42) which define a reservoir (44); and
forming an array of apertures (46) through the end wall (42) in open communication
with the reservoir (44) to form an emitter-dispenser surface.
2. The method of claim 1 in which the step of coating the mandrel (20) includes:
coating the mandrel (20) with a first layer (36) of said material;
removing the first layer (36) of said material from said end surface (22) of the mandrel
(20);
configuring the end surface (38) of the mandrel into a desired shape; and
coating said side surface and said end surface of the mandrel (20) with a second layer
(40) of said material which bonds to the first layer (36) of said material by atomic-crystalline
growth.
3. The method of claim 1 or 2 in which the step of coating is by chemical vapor deposition.
4. The method of claims 1, 2 or 3 in which the coating material is tungsten.
5. The method of any one of the previous claims in which the coating material (40)
on the end surface (38) of the mandrel (20) has a crystalline orientation which enhances
uniform electron emission.
6. The method of any one of the previous claims including the step of positioning
at least two intersecting strips (28, 30) of a material that is the same as the coating
material within slots in the surface of the configured mandrel (20) such that their
edges, which are exposed but do not protrude from the side and end surfaces, atomically
bond to the coating material to form an integral piece therewith extending transversely
across the reservoir (44).
7. The method of any one of the previous claims in which the end surface of the mandrel
(20) is configured into a concave spherical surface (38).
8. The method of any one of the previous claims in which the array of apertures (46)
are laser drilled.
9. The method of any one of the previous claims in which the step of removing the
mandrel (20) is by differential etching which dissolves the material of the mandrel
(20) but does not significantly etch the material of the housing (48).
1. Verfahren zum Herstellen eines Vorratsbehälters (48) für eine Vorratskathode (52)
mit geregelter Porosität gekennzeichnet durch die Schritte von:
Überziehen der Seitenoberfläche und angrenzender Endoberfläche (22) eines Dornes (20)
mit einer Schicht (36) aus Material, um mittels Kristallwachstum einen monolitischen
Überzug aus diesem Material zu formen;
Entfernen des Dornes (20), um aus diesem Material ein Gehäuse (48) zu erhalten, das
eine Seitenwand (36, 40) und eine Endwand (42) hat, welche einen Behälter (44) bilden;
und
Formen eines Feldes von Öffnungen (46) durch die Endwand (42) in offener Verbindung
mit dem Behälter (44), um eine Emitter-Vorrats-Oberfläche zu formen.
2. Verfahren nach Anspruch 1, bei dem der Schritt des Überziehens des Domes (20) aufweist:
Überziehen des Dornes (20) mit einer ersten Schicht (36) des Materials;
Entfernen der ersten Schicht (36) des Materials von der Endoberfläche (22) des Dornes
(20),
Konfigurieren der Endoberfläche (38) des Dornes in eine bestimmte Form; und
Überziehen der Seitenoberfläche und der Endoberfläche des Dornes (20) mit einer zweiten
Schicht (40) des Materials, das sich an die erste Schicht (36) des Materials durch
atomares Kristallwachstum bindet.
3. Verfahren nach Anspruch 1 oder 2, in dem der Schritt des Überziehens durch chemische
Dampfabscheidung erfolgt.
4. Verfahren nach Anspruch 1, 2 oder 3, in dem das Überzugsmaterial Wolfram ist.
5. Verfahren nach einem der vorhergehenden Ansprüche, in dem das Überzugsmaterial
(40) auf der Endoberfläche (38)- des Dornes (20) eine Kristall-Ausrichtung hat, die
die einheitliche Elektronenemission erhöht.
6. Verfahren nach einem der vorhergehenden Ansprüche mit dem Schritt des Anordnens
von wenigstens zwei sich schneidenden Streifen (28, 30) aus einem Material, welches
dasselbe wie das Überzugsmaterial ist, innerhalb von Schlitzen in der Oberfläche des
konfigurierten Dornes (20) derart, daß deren Enden freiliegend sind, aber nicht von
der Seiten- und Endoberfläche hervorstehen und welche atomar mit dem Überzugsmaterial
verbunden sind, um ein einstückiges Teil zu formen, das sich quer über den Behälter
(44) erstreckt.
7. Verfahren nach einem der vorhergehenden Ansprüche, in dem die Endoberfläche des
Dornes (20) in eine konkave kugelförmige Oberfläche (38) konfiguriert ist.
8. Verfahren nach einem der vorhergehenden Ansprüche, in dem das Feld der Öffnungen
(46) lasergebohrt ist.
9. Verfahren nach einem der vorhergehenden Ansprüche, in dem der Schritt des Entfernens
des Dornes (20) durch differenziertes Ätzen erfolgt, welches das Material des Dornes
(20) auflöst, aber nicht wesentlich das Material des Gehäuses (48) ätzt.
1. Procédé de fabrication d'un boîtier (48) de réservoir pour une cathode à réserve
(52) de porosité contrôlée, caractérisé par les étapes qui consistent:
à revêtir la surface latérale et la surface extrême adjacente (22) d'un mandrin (20)
d'une couche (36) d'une matière pour former un revêtement monolithique de ladite matière
par croissance cristalline;
à retirer le mandrin (20) pour obtenir un boîtier (48) de ladite matière, ayant une
paroi latérale (36, 40) et une paroi extrême (42) qui définissent un réservoir (44);
et
à former un réseau d'ouvertures (46) à travers la paroi extrême (42) en communication
ouverte avec le réservoir (44) pour former une surface de réserve émissive.
2. Procédé selon la revendication 1, dans lequel l'étape de revêtement du mandrin
(20) consiste:
à revêtir le mandrin (20) d'une première couche (36) de ladite matière;
à retirer la première couche (36) de ladite matière de ladite surface extrême (22)
du mandrin (20);
à configurer la surface extrême (38) du mandrin en une forme souhaitée; et
à revêtir ladite surface latérale et ladite surface extrême du mandrin (20) d'une
seconde couche (40) de ladite matière qui se lie à la première couche (36) de ladite
matière par croissance atomique-cristalline.
3. Procédé selon la revendication 1 ou 2, dans lequel l'étape de revêtement s'effectue
par dépôt chimique en phase vapeur.
4. Procédé selon les revendications 1, 2 ou 3, dans lequel la matière de revêtement
est du tungstène.
5. Procédé selon l'une quelconque des revendications précédentes, dans lequel la matière
(40) de revêtement sur la surface extrême (38) du mandrin (20) possède une orientation
cristalline qui favorise une émission électronique uniforme.
6. Procédé selon l'une quelconque des revendications précédents comprenant l'étape
qui consiste à positionner au moins deux lamelles croisées (28, 30) d'une matière
qui est la même que la matière de revêtement dans des rainures de la surface du mandrin
configuré (20) afin que leurs bords, qui sont à découvert mais qui ne dépassent pas
des surfaces latérale et extrême, se lient atomiquement à la matière de revêtement
pour former une seule pièce avec elle, s'étendant transversalement au réservoir (44).
7. Procédé selon l'une quelconque des revendications précédentes, dans lequel la surface
extrême du mandrin (20) est configurée en une surface concave sphérique (38).
8. Procédé selon l'une quelconque des revendications précédentes, dans lequel le réseau
d'ouvertures (46) est foré au laser.
9. Procédé selon l'une quelconque des revendications précédentes, dans lequel l'étape
consistant à enlever le mandrin (20) s'effectue par attaque chimique différentielle
qui dissout la matière du mandrin (20), mais n'attaque pas notablement la matière
du boîtier (48).