| (19) |
 |
|
(11) |
EP 0 265 056 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
|
25.01.1989 Bulletin 1989/04 |
| (43) |
Date of publication A2: |
|
27.04.1988 Bulletin 1988/17 |
| (22) |
Date of filing: 01.09.1987 |
|
|
| (84) |
Designated Contracting States: |
|
AT BE CH DE FR GB IT LI NL SE |
| (30) |
Priority: |
16.10.1986 US 919523
|
| (71) |
Applicant: LORD CORPORATION |
|
Erie
Pennsylvania 16514-0038 (US) |
|
| (72) |
Inventor: |
|
- Shah, Dilipkumar Nandlal
Erie
Pennsylvania 16506 (US)
|
| (74) |
Representative: Dunlop, Brian Kenneth Charles et al |
|
c/o Wynne-Jones, Lainé & James
22 Rodney Road
Cheltenham
Gloucestershire GL50 1JJ
Cheltenham
Gloucestershire GL50 1JJ (GB) |
|
| |
|
| (54) |
Rubber-modified epoxy adhesives |
(57) Epoxy adhesive compositions which are suitable for use in bonding metal and SMC parts
to other metal and SMC parts comprise, in admixture, an epoxy resin, the adduct of
an epoxy resin and a reactive (meth)acrylonitrile/butadiene rubber and a mixture of
Lewis acid complexes having different cure times. The adhesive can be cured at elevated
temperatures in 5 minutes or less.