BACKGROUND OF THE INVENTION
[0001] The present invention relates to a crimp terminal which provides secure connection,
both mechanical and electrical, between it and a conductor.
Prior Art
[0002] Figure 6A and 6B show a conventional crimp or solderless terminal. Reference numeral
1 designates a crimp terminal;
2 indicates a tongue, a connecting portion of the terminal that is connected to a mating
terminal;
3 a grip portion that holds the wire insulation; and
4 another grip portion that firmly holds the bare portion of a copper conductor. Denoted
5 is an insulated wire and
6 is a copper conductor. The end portion of the wire
5 is stripped of insulation to expose the bare copper conductor
6, and then the wire end is inserted into the grip portions
3,
4 of the terminal that are crimped against the bare conductor and insulation.
[0003] To improve the electrical characteristic of the connecting portion (in other words,
to reduce contact resistance), it is preferred to increase the crimping force and
thereby produce plastic deformation in the grip portion
4 and the copper conductor
6 to securely hold them together. But, too large a crimping force will result in an
excessive deformation in the copper conductor
6, which can easily break. In other words its mechanical strength is reduced. That
is, as the electrical characteristic is improved, the mechanical strength reduces.
Conversely, as the mechanical strength is increased, the electrical characteristic
deteriorates. Hence it has been impossible to meet the both requirements at the same
time.
[0004] This invention has been accomplished to overcome the above drawback, and its objective
is to provide a crimp terminal whose electrical and mechanical characteristics are
improved and also provide a crimping structure for securely connecting the crimp terminal
and the copper conductor.
SUMMARY OF THE INVENTION
[0005] To achieve the above objective, the crimp terminal and its wire crimping structure
according to this invention comprises: a crimp terminal having at one end thereof
a first grip portion for holding a wire insulation and a second grip portion for
holding a bare copper conductor, said second grip portion being divided in two sections
and crimped against the bare conductor in such a manner that the copper conductor
deformation ratio at one of said two sections is different from the other, said copper
conductor deformation ratio being obtained by first calculating a difference between
copper conductor cross sections before and after crimping and then dividing said difference
by said copper conductor cross section before the crimping, said two sections being
crimped against the bare conductor in such a manner that at one of said two sections
the copper conductor deformation ratio is more than 40% and that at the other section
said copper deformation ratio is 10 to 30%.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006]
Figure 1 shows a crimp terminal of this invention and a wire crimped together, Figure
1A being a front view and Figure 1B a top view;
Figures 2 to 4 are graphs showing the relationship between the copper conductor deformation
factor, electrical characteristic, and bonding force of the crimp terminal;
Figure 5 shows the relationship between the cross-sectional area of wires (wire size)
and the average bonding force required for the wires; and
Figure 6 shows a conventional crimp terminal and a wire crimped together, Figure 1A
being a front view and Figure 1B a top view.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0007] Referring to the accompanying drawings one embodiment of this invention will be
described. Figure 1A and 1B show the crimp terminal according to this invention that
is connected with a wire.
[0008] As shown in these drawings, the crimp terminal
1 is formed by punching and bending a metal sheet. Denoted
2 is a tongue formed at one end of the terminal that is to be connected with a mating
terminal. The other end of the terminal is formed with a grip portion
3 that grips the wire insulation and with two other grip portions
4a,
4b that grip a bare copper conductor
6. These gripping portions are formed by first punching from a metal sheet strips that
extend from both sides of the terminal
1 and bending these strips in circle from both sides toward the center. Designated
5 and
6 are an insulation-covered wire and a copper conductor, respectively.
[0009] Our experiments have found that there is a relationship, as shown in Figures 2 to
4, between the deformation factor of the crimped copper conductor in the crimp terminal
and the electrical and mechanical characteristics of the terminal. In the graph,
for a certain size of crimp terminal, the abscissa represents a copper conductor deformation
factor (%), the ordinate on the left-hand side indicates a residual resistance ratio
as an electrical characteristic (no dimension), and the ordinate on the right-hand
side designates a bonding force (kgf) between the wire and the terminal as a mechanical
characteristic.
[0010] The copper conductor deformation factor is defined as follows.
[0011] Copper conductor deformation factor
= [(A - A′)/A] x 100%
where A = S x N
S : cross sectional area of a single core wire of the conductor before being crimped
N : number of core wires in the conductor
A : cross sectional area of the conductor before being crimped
A′ : true cross sectional area of the conductor after being crimped (measured by using
a microscope)
The larger the value of the copper conductor deformation factor, the smaller the height
of the crimped terminal will be.
[0012] The residual resistance ratio (R.R.R) is defined as R
293K/R
4.2K, where R
293K is the electrical resistance of the crimped portion at 20°C and R
4.2K is the resistance of the crimped portion when placed in liquid helium. The greater
the residual resistance ratio, the better the condition of the boundary surface of
the crimped portion and its electrical characteristic. This invention has been achieved
by utilizing the fact that there is a definite relationship between the copper conductor
deformation ratio and the residual resistance ratio.
[0013] The greater the bonding force (kgf) represented by the vertical axis on the right,
the larger the tensile strength of the crimped portion and the better its mechanical
characteristic.
[0014] Figures 2 to 4 show the characteristics of the crimped portion of the terminal connected
with copper conductors, which are 3, 0.5 and 1.25 mm² in cross section and are made
up of 41, 7 and 16 core wires, respectively, each wire being 0.32 mm in diameter.
In these figures, curves (1) indicate the residual resistance ratio and curves (2)
the bonding force.
[0015] The residual resistance ratio increases as the copper conductor deformation ratio
increases, as indicated by the curves (1), and the electrical characteristic is improved.
The residual resistance ratio becomes sufficiently high for the copper conductor deformation
ratio of 40% and its rate of increase reduces from that point forward. From this it
is seen that when the copper conductor deformation ratio is set higher than 40%, the
crimped portion will have a good and stable electrical characteristic.
[0016] As for the bonding force, it remains high for the copper conductor deformation ratio
range between 10% and 30%, as indicated by the curves (2). Figure 5 is a graph showing
the relationship between the wire size and the average bonding force required for
the wire. The bonding forces in the above range in Figures 2 to 4 satisfy the required
value. Making use of this fact, this invention divides the bare conductor grip portion
into two parts
4a,
4b, so that when they are crimped their heights or the copper conductor deformation
ratios differ from each other. This is illustrated in Figure 1.
[0017] Next, we will explain how the invention works. As shown in Figure 1, the end of the
wire
5 is stripped of insulation to expose its bare conductor
6 and the wire end is inserted into the crimp terminal
1. Then the grip portions
3,
4a,
4b are crimped against the wire to connect them together. At this time, the grip portion
4a is crimped with a force strong enough so that the copper conductor deformation ratio
for this portion will be 40% or more. This will increase the residual resistance ratio,
as seen from Figures 2 to 4, and thereby improve the electrical characteristic.
[0018] Then, the grip portion
4b is crimped with a less force than that applied to the grip portion
4a so that the copper conductor deformation ratio for the portion
4b will be 10 to 30%. The bonding force of the grip portion
4b is maintained at high level, i.e., the mechanical strength of the crimped portion
is high. With the above structure, the grip portion
4a provides an improved electrical characteristic and the grip portion
4b provides a strong mechanical strength.
[0019] As explained above, the crimp terminal of this invention has its conductor gripping
portion divided in two. One of the divided grip portions provides a strong mechanical
connection and the other portion ensures a good electrical contact.