(19)
(11) EP 0 914 957 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
20.10.1999 Bulletin 1999/42

(43) Date of publication A2:
12.05.1999 Bulletin 1999/19

(21) Application number: 98204412.5

(22) Date of filing: 25.10.1995
(51) International Patent Classification (IPC)6: B41J 2/335
(84) Designated Contracting States:
DE FR IT

(30) Priority: 31.10.1994 JP 267474/94

(62) Application number of the earlier application in accordance with Art. 76 EPC:
95935562.9 / 0737588

(71) Applicant: SEIKO INSTRUMENTS INC.
Chiba-shi, Chiba 261 (JP)

(72) Inventors:
  • Nakamura, Yuji, c/o Seiko Instruments Inc.
    Chiba-shi, Chiba 261 (JP)
  • Sato, Yoshinori, c/o Seiko Instruments Inc.
    Chiba-shi, Chiba 261 (JP)
  • Saita, Yoshiaki, c/o Seiko Instruments Inc.
    Chiba-shi, Chiba 261 (JP)

(74) Representative: Sturt, Clifford Mark et al
Miller Sturt Kenyon 9 John Street
London WC1N 2ES
London WC1N 2ES (GB)

 
Remarks:
This application was filed on 22 - 12 - 1998 as a divisional application to the application mentioned under INID code 62.
 


(54) Thermal head and method for manufacturing same


(57) The invention provides a method for manufacturing a thermal head, the method comprising a step of forming a heat generating resistor (3), a step of forming a wiring electrode (4, 4a, 12) that is electrically connected to the heat generating resistor, and a step of forming a protective film (9) for clothing the heat generating resistor and the wiring electrode in the vicinity thereof, characterised in that

the wiring electrode forming step includes at least one sub-step wherein the contour of a resist pattern is made smaller midway during a wiring electrode etching process than in an earlier sub-step, whereby

the section configuration of the peripheral edge portion of the wiring electrode is formed into a tapered or stepped configuration through execution of each sub-step.






Search report