[0001] The present invention relates to an abrasive tape for finish lapping or polishing
with high precision to a mirror-surface finish such surfaces as those of floppy disks,
magnetic heads, precision electronic components, and end surfaces of optical fibers.
[0002] As abrasive tapes of the above stated kind, in general, there are those of a structural
organization wherein, on a substrate material, a coating comprising a polishing abrasive
material and a binder component is applied to form a polishing film. An abrasive tape
of this character has a simple structural organization and can be readily produced.
During its use, however, debris formed from the workpiece being polished tends to
infiltrate between the abrasive polishing film of the abrasive tape and the workpiece.
If the polishing process is continued in this state, the surface of the workpiece
will be damaged by this polishing debris, or the polishing debris will adhere to the
film surface and cause its pores or recesses to become clogged. As a result, the polishing
capacity of the abrasive tape has dropped considerably heretofore.
[0003] Furthermore, an abrasive tape provided with grooves in its polishing layer has been
proposed. In the process of forming the polishing layer of this tape, a paint containing
a large quantity of an inorganic ingredient in a coating compound is applied. Then
the concavities and convexities of the Bernard cell due a "convection cell phenomenon"
which occurs in the coating layer at the time when the solvent is dried are utilized
as groove forms of the polishing layer. (Reference: Japanese Pat. Laid-Open Publn.
No. 62-255069.) In the case of this abrasive tape, however, the shape as viewed in
plan view of the grooved parts thus formed becomes restricted to an approximately
hexagonal shape for reasons due to the production method. Moreover, it has been difficult
to form recesses consistently of the same pattern, and products of stable quality
could not be easily obtained. Furthermore, the control of conditions such as the composition
of the solvent of the coating material for forming the polishing layer, the coating
quantity, and the drying conditions in the production process for uniformity and stabilization
of the pattern of the grooved parts to be thus formed has been difficult. Consequently,
there has been the problem of extremely complicated production procedures. Furthermore,
the concavities and convexities that can be formed on this abrasive tape is limited,
in terms of the number of the polishing abrasive, to between #6,000 and #7,000. Polishing
abrasives of numbers higher than this (i.e., concavities and convexities of dimensions
less than this) could not be obtained.
[0004] Furthermore, in the method described in the above mentioned Japanese Pat. Laid-Open
Publn. No. 62-255069 and other known methods (Japanese Utility Model Laid-Open Publn.
Nos. 55-89564 and 59-39168), the forming of polishing layers into concave-convex pattern
forms by using a printing process such as gravure printing and screen printing is
disclosed. Furthermore, in Japanese Pat. Laid-Open Publn. No. 2-83172, the forming
of a concave/convex pattern by applying a coating of a resin liquid in which polishing
abrasive particles have been dispersed on a film substrate and laminating thereon
by pressing a film for imparting concavities/convexities is disclosed. By this method,
it has not been possible to prevent completely the formation of projections of independent
polishing abrasive material on the surface of the polishing layer thus obtained. When
such projections are present, the workpiece undergoing polishing is damaged by scratching
or scoring. Thus this method becomes unsuitable especially for polishing requiring
precision.
[0005] Furthermore, because of friction between the abrasive tape and the workpiece being
polished, the abrasive tape and the workpiece become electrostatically charged at
the time of polishing. For this reason the removal of polishing debris from the polish
parts becomes difficult, and residual polishing debris becomes entrapped between the
abrasive tape and the workpiece, whereby scratch damage occurs, or dust in the air
or polishing debris is adsorbed on the surface after polishing and must be subsequently
cleaned off.
[0006] Furthermore, depending on the conditions, sparking may occur between the abrasive
tape and the workpiece and damage the surface of the workpiece in some cases.
[0007] US-A-5,152,917 describes a coated abrasive article comprising a backing bearing on
at least one major surface thereof abrasive composites comprising a plurality of abrasive
grains dispersed in a binder. The binder serves as a medium for dispersing abrasive
grains, and it may also bond the abrasive composites to the backing. The abrasive
composites have a predetermined shape, e.g. pyramidal. The dimensions of a given shape
can be made substantially uniform. The composites are disposed in a predetermined
array. A predetermined array can exhibit some degree of repetitiveness. A repeating
pattern of a predetermined array can be in linear form or in the form of a matrix.
The coated abrasive article can be prepared by a method comprising the steps of: (1)
introducing a slurry containing a mixture of a binder and a plurality of abrasive
grains onto the production tool, (2) introducing a backing to the outer surface of
the production tool such that the slurry wets one major surface of the backing to
form an intermediate article, (3) at least partially curing or gelling the binder
before the intermediate article departs from the outer surface of the production tool
to form a coated abrasive article, and (4) removing said coated abrasive article from
the production tool.
[0008] Accordingly, it is an object of the present invention to obtain an abrasive tape
of high quality which is capable of solving the above described problems of the prior
art.
[0009] The present invention provides an abrasive tape having a film substrate (2) and an
abrasive layer (10) laminated on one surface of said film substrate (2), said abrasive
layer (10) having on the outer surface thereof a plurality of recessed parts (9) and
comprises a binder of a crosslinked type cured resin (3) and polishing abrasive material
particles dispersed therewithin, wherein the density of said abrasive material particles
increases in the direction away from the film substrate (2).
[0010] A preferred embodiment of the present invention is an abrasive tape, wherein said
crosslinked type cured resin (3) has a three-dimensional network molecular structure
in which surface-active agent molecules are chemically bonded.
[0011] A further preferred embodiment of the present application is an abrasive tape, wherein
said abrasive layer (10)contains an antistatic agent.
[0012] The present invention further provides an abrasive tape, wherein said polishing abrasive
material particles in said abrasive layer (10) are in the form of either flaky fish
scales or short fibers.
FIG. 1 is a view for describing the fundamental principle of the method of producing
an abrasive tape;
FIG. 2 is a partial sectional view of an abrasive tape obtained by the method of FIG.
1;
FIG. 3 is a partial perspective view of the abrasive tape of FIG. 2;
FIG. 4 is a sectional view showing one example of concave parts of a roll formplate;
FIG. 5 is a sectional view showing-another example of concave parts of a roll formplate;
FIGS. 6 through 10 are views sequentially indicating the process steps for forming
concave parts of a roll formplate;
FIG. 11 is a graph indicating a curve of cumulative frequency distribution of surface
roughness of a roll formplate;
FIGS. 12 through 14 are sectional views respectively showing various shapes of concave
parts of roll formplates;
FIGS. 15A, 16A, 17A, 18A, 19A, and 20A are graphs respectively indicating various
examples of cumulative frequency distributions of depths of concave parts of roll
formplates;
FIGS. 15B, 16B, 17B, 18B, 19B, and 20B are sectional views showing shapes of various
different concave parts of roll formplate corresponding respectively to the curves
of the graphs of FIGS. 15A, 16A, 17A, 18A, 19A, and 20A;
FIGS. 21 through 25 are partial perspective views respectively showing various different
examples of concave/convex shapes of surfaces of polishing layers of abrasive tapes;
FIG. 26 is an enlarged sectional view indicating a state of polishing of an article
by an abrasive tape;
FIG. 27 is a sectional view showing the state of entry of polishing debris into recessed
parts of a polishing layer of an abrasive tape at the time of polishing;
FIG. 28 is a view for describing the method of producing an abrasive tape according
to this invention;
FIG. 29 is an explanatory view showing still another example of the method of producing
an abrasive tape according to the invention;
FIG. 30 is a partial view from the left of FIG. 29;
FIGS. 31 through 33 are enlarged sectional views indicating successive steps in the
process of forming the polishing layer of an abrasive tape;
FIGS. 34 through 37 are enlarged sectional views indicating successively the steps
of another process of forming the polishing layer of an abrasive tape;
FIG. 38 is an enlarged sectional view indicating an undesirable state occurring in
a polishing layer;
FIG. 39 is a diagram indicating an example of a desirable positional layout of apparatus
for irradiating a roll formplate with radiation rays; and
FIGS. 40 and 41 are diagrams respectively indicating different examples of positional
layouts of apparatus for irradiation with radiation rays.
[0013] FIG. 1 is a view for describing a process for producing an abrasive tape. In the
figure, 1 is a roll formplate (intaglio printing plate). Around the peripheral surface
of this roll formplate 1, a film substrate 2 is partially wrapped and is fed in the
arrow direction. Below the roll formplate 1, a pan 4 containing an ionizing radiation
curable resin containing an abrasive material is provided.
[0014] Plate concavities 5 having a shape for imparting shapes of recessed parts to the
polishing layer of the abrasive tape are formed on the outer surface of the roll formplate
1. The film substrate 2 is sent from a supply roll 2a, past a pressing roll 6a, to
the outer surface of the roll formplate 1 and, passing around a feed-out roll 6b,
is fed out. Clearance adjustments, etc., of both rolls with the roll formplate 1 are
made possible.
[0015] The ionizing radiation curable resin 3 containing an abrasive material is supplied
from within the pan 4 by coating rolls 7 so as to fill at least the plate concavities
5. Then, while the substrate 2 is contacting the formplate 1, ionizing radiation rays
R are irradiated toward the substrate 2 by an ionizing radiation irradiating device
8 thereby curing the above mentioned resin 3 interposed between the substrate 2 and
the formplate 1 and simultaneously causing the same to adhere securely to the side
of the substrate 2. Finally, at a feed-out roll 6b, the substrate 2 is peeled off
from the formplate 1.
[0016] By thus peeling the substrate 2 off from the formplate 1, an abrasive tape 11 having
on the substrate 2 a polishing abrasive layer 10 provided with recesses 9 formed by
the roll formplate 1 as shown in FIG. 2 is obtained. Since the forming of the layer
10 having the recesses 9 is carried out by a production method as described above,
sharp and clear shapes of the recesses 9 that are faithful reproductions of the shapes
profiled on the roll formplate 1 are obtained. Particularly, even in the case where
the recesses are of complex and delicate shapes, they can be obtained simply and positively.
[0017] Furthermore, by so feeding a substrate 2 provided on one surface thereof with the
abrasive layer 10 that the other surface thereof, i.e., the surface with no polishing
layer formed thereon, contacts the roll formplate 1 and passing the same through the
same production process as that described above, abrasive layers 10 of the same kind
can be formed on both surfaces of the substrate. In the case where abrasive layers
10 are to provided on both surfaces of the substrate, furthermore, by installing a
second roll formplate on the downstream side in the feed direction of the substrate,
and feeding the substrate 2 after it has been peeled off from the first roll formplate
directly, as it is, to the second roll formplate, continuous production can be carried
out.
[0018] As shown in FIG. 3, the abrasive polishing layer 10 of the instant example is of
a configuration in which a resin layer part 9a of the polishing layer exists at the
bottom of each recess 9. This configuration is so formed that the ionizing radiation
curable resin 3 supplied to the plate concavities 5 of the roll formplate 1 will not
only be supplied into the plate concavities 5 but will also be interposed between
the peripheral surface of the formplate 1 and the substrate 2. In the case where an
abrasive layer 10 of a configuration wherein a resin layer part 9a does not exist
at the lower part of each recess 9 is to be obtained, a procedure such as scraping
away with a doctor blade (not shown) the resin 3 on the formplate surfaces other than
the plate concavities 5 is carried out after the resin 3 has been supplied to the
roll formplate 1 thereby to carry out adjustment so as to fill only the plate concavities
5 with the curable resin 3. Incidentally, as shown in FIGS. 2 and 3, the recesses
9 are partitioned by banks 9b encompassing the recesses.
[0019] The forming of the plate concavities 5 in the roll formplate 1 can be carried out
by a method such as electronic engraving, etching, machining on a lathe, milling machine,
or the like, electroforming, and sand-blasting. Furthermore, the shape of each plate
concavity 5 is a complementary shape of the shape of each recess 9 of the polishing
layer, and in actuality, the convex-shaped parts impart recessed shapes. The recesses
in the abrasive tape carry out the function of accommodating and thereby collecting
the polishing debris produced from the workpiece during polishing. In order to make
possible efficient accommodation of this polishing debris, it is desirable that the
recess 9, in general, have an opening width of 0.1 to 200 µm, a depth of 0.1 to 100
µm, and a pitch (spacing of the center parts of adjacent recesses) of 10 to 500 µm.
The capability of accommodating polishing debris of recesses which do not satisfy
simultaneously these dimension conditions becomes inadequate. However, the forming
of recesses of conditions other than those recited above is of course possible. Furthermore,
the recesses 9 are arranged uniformly and regularly over the entire surface of the
abrasive layer 10 as illustrated by one example in FIG. 3. In addition, the recesses
can be so formed that the shape of each in planar view (in horizontal section) is
quadrilateral, hexagonal, circular, elliptical, or some other shape and in vertical
section is the shape of an inverted triangle, a rectangle, a semicircle, a trapezoid,
or some other figure. That is, the plate concavities 5 are provided with a shape such
as to form recesses possessing simultaneously various structural requirements as described
above.
[0020] For the above mentioned ionizing radiation curable resin, known resins of the type
which are cured by irradiation with ultraviolet rays or an electron beam can be used.
When, among these (resins), a resin of the type to which no solvent is added is used,
undesirable results such as volumetric contraction, deformation, and generation of
bubbles due to setting do not occur, and, in addition to a process step of predrying
this resin becoming unnecessary, it becomes easier to obtain positively recesses of
good reproducibility. Furthermore, among the ionizing radiation rays, ultraviolet
rays can be used in the case where the film substrate 2 is transparent. However, in
the case where the substrate is opaque, it is necessary to use an electron beam. Furthermore,
if the roll formplate is constructed of a material through which ionizing radiation
rays can be transmitted, irradiation from an irradiating device installed in the interior
of this formplate will become possible. In the case where an electron beam is used,
the quantity of irradiation thereof depends on factors such as the thickness and material
of the sheet substrate, but ordinarily (an irradiation quantity of) the order of 0.5
to 30 Mrad is desirable.
[0021] The shape of the recesses is so designed that, in addition to the requirement for
polishing performance of the polishing adhesive layer, the recesses will fulfill also
the requirement of suitability for separating of the polishing layer from the roll
formplate together with the film substrate. Specifically, a suitable shape of the
plate concavities on the roll formplate is such that, as shown in FIGS. 4 and 5, the
sectional area of each plate concavity 5 cut by the horizontal sectional plane indicated
by line X-X becomes smaller progressively and continuously towards the bottom thereof.
For example, when sand-blasting is carried out on a metal plate, a shape of a recess
as shown in FIG. 4 is obtained. Furthermore, plate concavities 5 of the shape shown
in FIG. 4 can be formed also by forming cells which have been demarcated by halftone
dots or multiline screen, etc., through the use of a plate producing method depending
on etching of known gravure printing process, during which the widths of the convex
parts are made appropriately narrow, and, moreover, amply promoting the side etching
of the cell inner walls thereby to remove the portions immediately below the resist.
[0022] In addition, plate concavities 5 of a shape as shown in FIG. 4 can also be formed
by the aforedescribed machining, and plate concavities 5 of the shape shown in FIG.
4 can also be formed by forming concavities by the aforedescribed etching method and
thereafter carrying out sand-blasting.
[0023] Plate concavities 5 of the shape shown in FIG. 4 can be formed by known photoetching
(or photolithographic) methods other than the aforedescribed gravure plate processing
method. That is, it is also possible to: lay a photosensitive resist film 16 on a
surface of a metal plate 15 as shown in FIG. 6; next, through an original plate (photomask)
having the desired concavity shape (whether to be used as a negative or whether to
be used as a positive of the concave part pattern, selection is made according to
whether the resist is of the negative type or whether it is of the positive type),
expose the resist film 16 to light to develop the same; open windows 18 of the desired
shape of opening part by leaving a resist pattern 16a; etch the metal within the windows
18 as indicated at 20 in FIG. 7 with a suitable etching solution 19 such as an aqueous
solution of ferric chloride (Fe
2Cl
3); thereafter cause side etching with the etching solution in the concave parts 20
as indicated at 21 in FIG. 8; and cause side etching to proceed further, whereby,
through the state indicated in FIG. 9, plate concavities 5 as shown in FIG. 10 are
obtained.
[0024] In this operation, however, care must be exercised in controlling the degree of side
etching. That is, by restricting the degree of side etching, the forming of the concavities
is stopped in the state as shown in FIG. 7. Alternatively, by permitting the side
etching to proceed amply, the banks between the concavities are destroyed as indicated
in FIG. 9 thereby to obtain the state indicated in FIG. 10.
[0025] The necessity of peeling the substrate 2 having the polishing layer 10 from the roll
formplate 1 as indicated in FIG. 1 has already been mentioned. The polishing layer
(cured resin layer) can be so formed that it can be peeled off from the formplate
and have concavities in which side etching is negligible as shown in FIG. 7 in the
following manner. For the roll formplate, a copper cylinder is used. An aqueous solution
of ferric chloride (of a concentration of 39 to 42 Baumé degrees as measured with
a Baumé hydrometer) is used for the etching solution. This etching solution is supplied
onto the copper surface by a shower method or an air-agitation method. In the case
where carbon tissue (potash gelatin dichromate) used in ordinary gravure processing
is used for the resist film, the depth of the plate concavities is made less than
150 µm. By this process, plate concavities in which side etching has been suppressed
as shown in FIG. 7 are obtained. When the extent of the side etching 21 shown in FIG.
8 is excessively great, the resin which has filled the plate concavities and has set
cannot be easily dislodged from the plate concavities, and peeling off becomes difficult.
However, by satisfying the above described conditions, peeling off becomes possible.
[0026] As a condition for attaining simultaneously a compatible combination of both polishing
performance and good separation property of the plate from the mold, the cumulative
frequency distribution curve (ogive) of the surface roughness of the roll formplate
1 is also important. More specifically, when the steps of: obtaining statistical data
of the heights of the hills (concavities/convexities) of the surface of the roll formplate
by means of a measuring and curve-plotting instrument for surface roughness of an
electric tactometric type, optical type, or the like; and plotting cumulative frequency
distribution function f (R) curves with surface roughness, that is, height of the
hills, R, as abscissa and cumulative frequency distribution function of the surface
roughness
![](https://data.epo.org/publication-server/image?imagePath=2002/36/DOC/EPNWB1/EP99105024NWB1/imgb0001)
(where P(R) is the probability density function of the surface roughness R) as ordinate
are taken, curves as shown in FIG. 11 are obtained. Then, even if the maximum value
R
max is the same, the rise of the curve is gentle as in the curve f
B(R) in FIG. 11, and, in the case where it becomes a curve of downward convexity, the
mold separation of the formplate is good. As shown in FIG. 11, the design is carried
out so as to obtain a curve of this character.
[0027] On the other hand, in the case where the rise of the curve is steep as in the curve
f
A(R), and it becomes a curve of upward convexity, the mold separation of the formplate
becomes poor.
[0028] A specific example of the shape of the formplate surface in the case of a function
such as is indicated by curve f
A(R) is as shown in FIG. 12. In the case of a function such as is indicated by curve
f
B(R), the shape becomes as shown in FIG. 13, for example.
[0029] In the case of a shape wherein the sectional area of the plate concavity 5 increases
toward the bottom, as in FIG. 14, the polishing layer after curing cannot be separated
from the mold. Such a shape is therefore unsuitable . An example of such a shape is
shown in FIG. 8, wherein side etching has been carried out by the etching method as
described hereinbefore. In addition, in the case where a matte-plated surface comprising
an aggregate of fine lump-shaped (spherical) particles of a metal such as chromium
is provided on the formplate surface, the sectional shape becomes as shown in FIG.
14. Thus, the mold-separation characteristic becomes poor also in this case.
[0030] As was mentioned hereinbefore, in the case where, the cumulative frequency distribution
curve of the height of the concavities/convexities is as indicated by curve f
B in FIG. 11, that is, the curve has a downward convexity over the entire region from
0% to 100% of the cumulative frequency, good mold separability results. However, even
if there is a portion of upward convexity in one part of the cumulative frequency
distribution curve, in the case where the point at which the cumulative frequency
distribution of the cumulative frequency distribution curve becomes 50% (that is,
the point corresponding to the average value) passes on the right-hand side of the
middle value of the height, that is, average value ≥ middle value, amply satisfactory
mold separability of the set resin layer from the formplate can be obtained.
[0031] FIGS. 15 and 16 illustrate actual examples of such a case. As indicated in FIGS.
15A and 16A, even if a distribution curve of downward convexity is obtained, the relationship
of "average value ≥ middle value" of the concavities/convexities height in these cases
is satisfied, and the shapes of the concavities/convexities are respectively as shown
in FIGS. 15B and 16B. Thus the mold separabilities of the set resin layers from the
formplate were good. In this connection, the section of the formplate surface of FIG.
15B was obtained by sand-blasting the surface of a smooth copper cylinder with #80
sand, and the section of the formplate surface of FIG. 16B was obtained by sand-blasting
the surface of a smooth copper cylinder with #200 sand.
[0032] In the case shown in FIG. 17A, the average value is 52% of the maximum value, and
moreover the cumulative frequency distribution curve comprises a portion of downward
convexity and a portion of upward convexity. In this case, although mold separation
was possible, there was some resistance to mold separation. This case indicates borderline
or threshold conditions of mold separability. FIG. 17B shows the formplate surface
corresponding to FIG. 17A. This sectional shape was obtained by lightly etching the
surface of a smooth copper cylinder, sand-blasting this surface with #200 sand, and
further plating the surface with lustrous chromium plating as indicated at 1a.
[0033] FIG. 18A illustrates a case where the cumulative frequency distribution is linear.
In this case, good mold separation was obtained. This is also a case of borderline
conditions between f
A(R) and f
B(R) of FIG. 11. FIG. 18B shows the formplate surface corresponding to FIG. 18A. This
formplate surface was obtained by forming ridges of a section of a right-angled isosceles
triangle on the surface of a smooth copper cylinder by means of a lathe.
[0034] FIG. 19A indicates a case wherein the cumulative frequency distribution curve has
a portion of upward convexity and a portion of downward convexity and a relationship
of average value < middle value. The mold separability in this case was poor. FIG.
19B shows the formplate surface corresponding to FIG. 19A. In this case, the surface
of a smooth copper cylinder was plated with a plating layer 1b of a chromium matte
(delustering particulate state).
[0035] FIG. 20A illustrates a case where the cumulative frequency distribution curve becomes
a curve of downward convexity over the entire scope of concavity/convexity height.
The peeling characteristic from the roll formplate in this case was good. FIG. 20B
shows the sectional shape of the formplate surface corresponding to FIG. 20A. This
formplate surface shape was produced by carrying out molding from a polyethylene terephthalate
film obtained by kneading thereinto calcium carbonate of particle size of 1 to 10
µm and fabricating the plate by the electroforming method.
[0036] In addition to the recessed parts or depressions of the polishing layer 10 shown
in FIG. 3, the examples thereof shown in FIGS. 21 to 25 are possible.
[0037] In the polishing layer 10 shown in FIG. 21, the depressions are formed by grooves
9A, which are connected to form a pattern of hexagons, the entire assembly resembling
a tortoise-shell. The grooves form hexagonal lands (islands) 23. In the middle of
each island, a recess 9B of pin-hole shape is formed.
[0038] In the polishing layer 10 shown in FIG. 22, the depressions comprise linear grooves
9c mutually intersecting at substantially right angles. Square lands 24 are thus formed
by these grooves 9c.
[0039] In the polishing layer 10 shown in FIG. 23, lands 25 of a convex curved surface shape
such as a semisphere or semiellipsoid are formed instead of the square lands 24 of
the polishing layer of FIG. 22. Depressions 9d are provided around these lands 25.
[0040] In the abrasive polishing layer 10 shown in FIG. 24, a land 26 is further formed
in the middle of each depression 9 in the polishing layer of FIG. 3.
[0041] In the polishing layer 10 shown in FIG. 25, parallel lands 27 of curvilinear ribbon
form are formed by depressions 9e of curvilinear groove form lying therebetween. The
curves of these curvilinear shapes are curves of bounded periodic functions such as
a sinusoidal curve, a hyperbolic curve, an elliptic function curve, a Bessel function
curve, a cycloidal curve, or an involute curve.
[0042] In addition to those described above, the shape of concavities of the polishing layer
is suitably selected in accordance with conditions such as the kind of workpiece to
be polished, the degree of precision of the polishing, and the object.
[0043] In general, in the case of use wherein the polishing quantity is large and a large
quantity of the polishing debris is discharged over a long period, a configuration
as shown in FIGS. 21 and 22 wherein the volume of the recessed parts for accommodating
the polishing debris is relatively large, and, moreover, the groove-shaped recesses
extend to the peripheral edge of the polishing layer is suitable.
[0044] In certain applications, such as polishing of magnetic recording mediums and magnetic
heads, the forming of smooth surfaces with high finishing precision is required. In
such a case, the working surface of the polishing layer 10 may take a configuration
wherein the recesses 9 are mutually isolated as in the examples shown in FIGS. 3 and
24. Furthermore, in order to attain a high uniformity of finish, it is preferable
that the angles formed by the edges of the recesses and the lands therebetween relative
to the polishing direction be numerous and that, moreover, the symmetry of the configuration
thereof be good. For example, the configuration of the example shown in FIG. 21 is
better than that shown in FIG. 24 for this purpose.
[0045] The dimensions of the various configurations of the polishing layers shown in FIGS.
21 through 25 are also selected suitably in accordance with the application, the finishing
precision, and the material of the article to be polished. In general, however, in
the case where finishing precision is required as in the polishing of articles such
as magnetic recording mediums, the dimension of the recesses (the width in the case
of groove-shaped recesses; the length of one side of each recess in the case of isolated
polygonal recesses; and the diameter of each recess in the case of isolated circular
recesses), is ordinarily approximated 0.1 to 200 µm and the depth of each recess is
approximately 1 to 100 µm, as stated hereinbefore.
[0046] The forward relief angle α and the rearward relief angle β between the front and
rear parts of the land, i.e., the convexity, of the polishing layer 10 and the workpiece
30 undergoing polishing, as shown in FIG. 26, are also selected at suitable values
in accordance with factors such as the application, the material of the workpiece
30, and the polishing speed.
[0047] The relief angles α and β contribute to the performances of discharging and intercepting
the polishing debris. That is, as indicated in FIG. 27, the polishing debris 31 is
discharged through the range of the relief angles α and β and is intercepted and accumulated
in recesses of the polishing layer 10.
[0048] Furthermore, the relief angles α and β, together with the contact area ratio R of
the polishing layer 10 relative to the workpiece 30, contribute to the polishing efficiency.
The contact area ratio R can be expressed by the following equation.
![](https://data.epo.org/publication-server/image?imagePath=2002/36/DOC/EPNWB1/EP99105024NWB1/imgb0002)
wherein: Sc is the area of contact between the polishing layer 10 and the workpiece
30; Sg is the projected area of the portion of the polishing layer 10 that is not
in contact with the surface of the workpiece (i.e., the portion with a space gap therebetween)
which area is projected onto the surface of the film substrate 2; Sp is the area of
the flat portion of the top parts of the lands of the polishing layer 10; and Sr is
the area of the other portions (corresponding to the concave portions) projected onto
the surface of the film substrate 2.
[0049] The approximation of the furthest right side of the above equation is effective in
the case where the tops of the lands are flat as in FIGS. 26 and 27. Each summation
Σ is taken over an amply broad area of the polishing layer 10. If the contact area
ratio R becomes too small, the portion of the polishing layer 10 which is not used
will increase. On the other hand, if the ratio R becomes too large, the capacity of
the polishing layer 10 to discharge/intercept the polishing debris 31 will drop.
[0050] As described hereinbefore with respect to the example shown in FIG. 1, the plate
concavities 5 of the roll copper plate 1 can be supplied and filled with an ionizing
radiation setting resin by a roll-coating method with the use of coating rolls 7.
This supplying and filling process can be carried out alternatively also by other
methods. For example, this process can be carried out by supplying the resin from
a die such as a T die as described hereinafter. Another possible method comprises
coating and forming the resin by a method such as roll coating beforehand on the film
substrate 2 before the substrate 2 contacts the roll formplate 1.
[0051] The resin can be applied as a coating on the surface of the film substrate 2 in the
following manner. As shown in FIG. 28, the film substrate 2 stock is supplied from
a supply roll 2a to a roll-coating section 36 comprising guide rolls 32 and 33, pressing
roll 34, and a coating roll 35 as essential parts. In this roll-coating section 36,
the ionizing radiation curable resin 3 in liquid form is applied as a coating on the
substrate 2 thus supplied. Next, in the case where the resin 3 contains a diluting
solvent, the substrate 2 is passed through a drying device 37, where the dilute solvent
is evaporated off by a method such blowing warm air. Thereafter, by means of a pressing
roll 6a, the coated surface of the film substrate 2 is pressed into contact with the
surface of the roll formplate 1. A portion of the coated resin layer 3 is thereby
forced to fill the interior of the plate concavities 5. Reference numerals 38 and
39 designate a liquid accumulation and an ink pan, respectively. In addition to roll
coating, this coating process can be accomplished by suitably applying any of various
methods such as gravure roll coating and flow coating.
[0052] The resin liquid can be applied onto the surface of the roll formplate also by another
method as follows. As shown in FIG. 29, as the roll formplate 1 is rotated, liquid
resin 3 is ejected through a T-dye type nozzle 41 and applied on the surface of the
formplate 1. Thus the resin 3 is caused to fill the interiors of the plate concavities
5. Separately, but simultaneously, uncoated film substrate 2 is supplied in the arrow
direction and is pressed into forceful contact with the coated surface of the roll
formplate 1 by a pressing roll 6a. FIG. 30 is a view from the left side of FIG. 29.
In this connection, it is possible to use also another method of coating the surface
of the formplate 1. One example of an alternative method is dipping of the roll formplate
1 directly in the liquid resin in an ink pan.
[0053] In any of the above cases, it is important to prevent the mixing of air bubbles into
the resin between the film substrate 2 and the surface of the roll formplate 1. A
specific preventive measure for this purpose is as follows. As shown in FIGS. 29 and
30, surplus resin liquid 3 is supplied beforehand through the nozzle 41. Then, surplus
resin liquid is squeezed out by rubbing action due to the compression by the pressing
roll 6a, thereby to form a liquid accumulation 42. As a result, air is also squeezed
out by the rubbing action.
[0054] The method of coating onto the side of the film substrate 2 as indicated in FIG.
28 is used in the case where the depth of the plate concavities 5 of the roll formplate
1 is relatively shallow, and where the fluidity of the resin liquid is also good,
or where a dilute solvent is used.
[0055] Still another case where the method of coating onto the film substrate side of FIG.
28 is used is the case where, as a consequence of the addition of the abrasive polishing
material, the fluidity of the ionizing radiation curable resin 3 becomes poor, and
an increase in its viscosity and thixotropy, dilatancy, and the like occur. Consequently,
coating and supplying the resin cannot be carried out without dilution of the solvent.
[0056] In this case, if coating were to be carried out directly on the surface of the roll
formplate as shown in FIG. 29, drying of the solvent would become difficult. Accordingly,
as indicated in FIG. 28, a resin solution which has been amply diluted with the solvent
is first applied as a coating on the film substrate to form a coating film of the
desired surface smoothness. Thereafter, by means of a drying device, the diluting
solvent is evaporated off. The coating film is then caused to contact the roll formplate.
[0057] The reason for this procedure is that, if the solvent remaining as it is in residual
state in the coating film were to be clamped and entrapped between the film substrate
and the roll formplate, the residual solvent, being unable to escape, would remain
as bubbles in the coating film. As a consequence, there would arise the possibility
of the shapes of the surface concavities and convexities, the strength of the coating
film, and the polishing performance being impaired. As a specific example, in the
case of quartz (silica) sand, solvent dilution becomes necessary when the quantity
thereof added is 50 percent by weight or more.
[0058] On the other hand, when the concavities of the roll formplate are relatively deep,
and when the fluidity of the resin liquid is amply good, the method of direct coating
onto the formplate surface as shown in FIG. 29 is suitable.
[0059] For producing an abrasive tape according to the present invention, a roll formplate
of a rigid material such as a metal or glass is used. Furthermore, the film substrate
is pressed by a pressing roll over the resin liquid, and moreover a tension is applied
to the film substrate.
[0060] For this reason, as shown in FIG. 31, the particles P of the polishing material in
the vicinity of the surface of the polishing layer 10 are blocked and prevented from
protruding outward by the plate surface of the roll formplate 1. Furthermore, the
resin liquid (binder), aided by the pressing pressure, amply flows into and fills
also the interface between the polishing material particles or grains P and the plate
surface. As a result, the surface of the polishing layer 10 after being thus molded
becomes a smooth surface as indicated in FIG. 32.
[0061] Of course, it is also possible to obtain a polishing layer 10 with a surface having
concavities and convexities of the set resin corresponding to the polishing particles
or grains P or a polishing layer 10 with a portion where polishing particles or grains
P have been exposed directly at the surface as shown in FIG. 33. Such a polishing
layer 10 can be obtained by measures such as reducing the pressing pressure or the
fluidity of the resin liquid or by selecting somewhat high values of the curing shrinkage
rate of the liquid of the resin 3 of ionizing radiation curing type. In comparison
with the case illustrated in FIG. 32, that shown in FIG. 33 has a greater polishing
capacity.
[0062] Even when the liquid of the same ionizing radiation curable resin is used, it is
possible, depending on the method of curing, to cause the uneven shapes of the polishing
particles P to emerge out of the surface of the set resin layer, as shown in FIG.
33, or furthermore to cause portions of the polishing particles P themselves to be
directly exposed at the surface.
[0063] More specifically, in comparison with the method of curing with ultraviolet rays,
setting with an electron beam increases the crosslinking density of the resin and
increases the curing shrinkage rate. Therefore, even with the same resin liquid, when
curing is carried out with an electron beam, or when, after partial curing is first
caused to proceed with ultraviolet rays, the remainder is cured with an electron beam,
a state resembling more closely that shown in FIG. 33 can be obtained. In either of
the cases illustrated in FIGS. 32 and 33, it is possible to prevent large protrusions
of polishing particles outward from the surface of the resin layer 10 as shown in
FIG. 38 which has occurred with prior art methods.
[0064] The mode of practice of the resin curing method for obtaining an abrasive tape according
to this invention is illustrated in FIGS. 28, 29, 34, 35, and 36. As indicated, by
a multistage curing process, the polishing particles or grains in the polishing layer
are caused to be more densely distributed in vicinity of the surface of the polishing
layer. More specifically, as shown in FIGS. 28 and 29, a plural number of ionizing
radiation devices 8a, 8b, and 8c are installed at positions to confront and irradiate
the surface of the roll formplate 1, being spaced at suitable intervals in the circumferential
direction of the formplate 1.
[0065] In the setting process of the ionizing radiation curable resin liquid 3, the relationship
between the total irradiation energy E required for completion of curing of N radiation
devices 8a, 8b, 8c, ..., 8N and the irradiation energies E
1, E
2, E
3, ..., E
N respectively thereof is as follows.
![](https://data.epo.org/publication-server/image?imagePath=2002/36/DOC/EPNWB1/EP99105024NWB1/imgb0003)
The irradiation of the ionizing radiation rays is carried out successively in this
order by dividing (E).
[0066] Ordinarily, the relationships between the respective energies of the radiation devices
are approximately as follows.
![](https://data.epo.org/publication-server/image?imagePath=2002/36/DOC/EPNWB1/EP99105024NWB1/imgb0004)
However, the relative distribution of these energies E
1, E
2, E
3, ..., E
N is suitably adjusted in accordance with factors such as the desired distribution
of the polishing particles in the thickness direction of the polishing layer, the
kind of resin to be set, and type of irradiation.
[0067] The stages of an example of the multistage setting process of this character are
shown in FIGS. 34 through 37.
[0068] First, as indicated in FIG. 34, a film substrate 2 is pressed against the surface
of the roll formplate 1 over the yet to be cured resin liquid 3 interposed therebetween.
The resin liquid 3 is thereby covered and caused to adhere intimately. Next, at the
position confronted by the first ionizing radiation device 8a, ionizing radiation
rays are projected onto the coated film 3 (polishing layer 10). Thereupon, as indicated
in FIG. 35, the resin 3 closer to the side of the film substrate 2 sets. As a consequence,
the distance between the molecules in the resin liquid 3 in this region is narrowed
by the cross-linking reaction, and the resin 3 shrinks in volume. As a result, the
polishing material particles P, which had been dispersed, are squeezed out from the
spaces between the molecules and migrate from the side of the film substrate 2 toward
the yet not cured resin on the formplate side.
[0069] Then, at the position confronted by the second radiation device 8b, radiation of
the coated film 3 is continued. The resin nearer to film substrate 2 thereby undergoes
cross-linking and shrinks in volume as indicated in FIG. 36. Consequently, the polishing
material particles P migrate further toward the direction of the formplate 1. Then,
when the coated film 3 is irradiated by the third radiation device 8c, the polishing
particles P are moved further toward the formplate (not shown). Thereafter, as the
resin layer 3 thus cured (polishing layer 10) is separated from the surface of the
formplate 1, an abrasive tape 11 in which the polishing particles P are distributed
with even higher density in the vicinity of the surface, as indicated in FIG. 37,
is obtained.
[0070] Thus, by this method of curing by multistage ionizing radiation, particles added
into a coated film are caused to rise to the surface thereby to obtain a coated film
in which the particles are distributed with high density in the vicinity of the coated
film surface. This method
per se has been previously disclosed in Japanese Patent Publication No. 58-15183 and Patent
Application Laid-Open No. 2-261572. By the methods as thus disclosed previously, the
coated film is cured in free air. Therefore, although the effect of causing the added
particles to rise is good, the particles could not be prevented from protruding out
through the surface of the coated film.
[0071] In contrast, by the method of producing an abrasive tape of this invention, the multistage
setting of the resin is carried out with the surface of the coated film in a state
of being fixed to the surface of the formplate. For this reason, an excellent polishing
layer 10 as shown in FIG. 37 is obtained. Thus, protrusion of particles or grains
outward through the surface due to the high density of the polishing particles in
the vicinity of the surface as shown in FIG. 38 is prevented.
[0072] In some cases it is necessary to increase the cross-linking density at the surface
of the polishing layer and to increase the surface hardness and resistance against
heat and chemicals. This can be accomplished in such cases by further irradiating
with ionizing radiation rays the abrasive tape 11 from the polishing layer side after
the tape 11 has been separated from the roll formplate 1. More specifically, for example
as indicated in FIG. 29, a back-up roller 43 and an ionizing radiation irradiation
device 8d are provided on the downstream side of the feed-out roll 6b. At this position,
the abrasive tape 11 is in intimate contact with the back-up roller 43 and is irradiated
in wrapped state by the irradiation device 8d.
[0073] A particularly effective method of increasing the cross-linking density of the surface
comprises, first, setting with ultraviolet rays the polishing layer at the roll formplate
surface and then, after separation from the formplate, irradiating the outer surface
side of the polishing layer with an electron beam. Although the mechanism of the action
of this process is not yet clear, by carrying out irradiation with an electron beam
after curing with ultraviolet radiation, the hardness of the surface can be increased
without overly lowering the calcinability of the entire resin layer,
[0074] However, if the irradiation is parried out excessively, the coated film will become
fragile. As a consequence, when the abrasive tape is caused to assume a curve or is
used in polishing, problems such as the development of cracks in the polishing layer
and separation of the polishing layer occur. For this reason, appropriate quantity
of irradiation and cross-linking density must be set.
[0075] Control of the temperatures of the roll formplate 1 and the back-up roller 43 is
also important. In general, infrared rays are also radiated from sources such as mercury
lamps and carbon-arc lamps. Furthermore, in all cases where the ionizing radiation
is by ultraviolet rays, an electron beam, or the like, a part of the absorbed radiation
energy changes into heat. Consequently, if this heating becomes excessive, defects
such as deformation and heat deterioration will occur in the cured resin layer or
film substrate. A measure for preventing this, in the case of a mercury lamp or a
carbon-arc lamp, is to insert a filter which transmits ultraviolet rays but shuts
off infrared rays. In the case where even this is insufficient, however, an effective
measure is to cool the roll formplate itself. Since the resin coated film and the
film substrate are both adhering intimately to the roll formplate, the heat generated
in, the coated film or the film substrate is rapidly absorbed by the roll formplate
and cooled.
[0076] A specific example of practicing this method comprises using a roll formplate or/and
back-up roller of hollow construction and passing cooling water through the interior
thereof. In some cases, good results are obtained by heating the roll formplate or/and
back-up roller to an appropriate temperature. This is a useful method for solving
the problem of internal stress and/or residual strain remaining in the coated film
(polishing layer) which has been cross-linked and cured by ionizing radiation.
[0077] In this case, a suitable surface temperature of the roll formplate and the back-up
roller is ordinarily of the order of 30 to 80°C. However, since heat generation accompanies
ionizing irradiation, it is necessary to take precautionary measures for preventing
the temperature of the roll from rising above a limiting temperature with the passage
of time. A specific measure is to use a hollow roll formplate and back-up roller and
to pass therethrough warm water at a specific temperature. By this measure, absorption
of heat by the heat capacity of the water itself and discharging of heating by the
flow of the water are accomplished.
[0078] In the case where a plurality of ionizing radiation irradiating devices as described
hereinbefore are to be provided, an arrangement as shown in FIG. 39 is suitable. In
this arrangement, two irradiating devices 8A and 8B are provided around the roll formplate
1 at spaced apart positions. These spaced apart positions are such that the angle
θ between the lines respectively joining the two irradiating devices 8A and 8B to
the center O of the formplate 1 is 90 degrees. The points (lines) at which lines that
radiate from the irradiating device 8A and are tangent to the outer surface of the
formplate 1 respectively at opposite sides thereof are designated A1 and A2. The points
(lines) at which lines that radiate from the irradiating device 8B and are tangent
to the outer surface of the formplate 1 respectively at opposite sides thereof are
designated B1 and B2. Then, in the case where a uniform irradiation intensity (W/m
2) within the irradiated region A1-B1-A2-B2 on the circumferential surface of the roll
formplate 1 is desired, portions of the irradiation regions of the irradiating devices
8A and 8B are caused to overlap (as at B1-A2).
[0079] In the case where it is more desirable to provide a non-irradiated region between
the region irradiated by the irradiating device 8A and the region irradiated by the
irradiating device 8B, the irradiation intensity of the arc B1-A2 is caused to be
zero (0). This is a case where, for example, the internal stress of the polishing
layer due to irradiation by the irradiating device 8A is once reduced, or the polishing
layer whose temperature has been raised is once cooled, and thereafter the remaining
irradiation is carried out.
[0080] The quantity of ionizing radiation rays that have been irradiated can be used effectively
without waste by either of the following methods. In one method, the radiation rays
emerging with maximum diverging angle from the irradiating devices 8A and 8B are caused
to become tangents of the outer surface of the roll formplate 1 as shown in FIG. 39.
In the other method, the irradiating devices are positioned even closer to the roll
formplate 1. However, if they are brought excessively near the roll formplate, the
irradiation quantity will become excessively great. This will give rise to problems
such as: deformation or cracking in the set coated film due to rapid curing of the
resin; and heat generation due to radiant heat unavoidably admixed with the radiation
from the irradiating devices or due to conversion into thermal energy of the radiation
rays in the coated film, this heat generation giving rise to a high temperature rise
in the coated film and thermal deterioration thereof. Therefore, the irradiating devices
are kept at an appropriate distance. In this connection, for the purpose of coating
the roll formplate, it is necessary to leave at least 90/360 of whole circumference
thereof as a non-irradiation region.
[0081] Advantages obtainable from the arrangement of FIG. 39 are as follows. In the prior
art as disclosed in, for example, Japanese Patent Laid-Open Publn. Nos. 2-131175 and
4-200766, only one irradiating device was provided. In such a case, as indicated in
FIG. 40, the region ATB used for irradiation out of one circumference of the roll
formplate 1 is a limited range. The irradiated region even at its maximum limit is
up to one half of one circumference (as in the case shown in FIG. 41). In this case,
the irradiating device is at an infinitely remote point, and furthermore a parallel
radiation flux of amply large area is used.
[0082] When, under these circumstance's, an attempt is made to obtain ample setting of the
resin liquid, the total energy from the radiation source is concentrated in a small
area. As a result, the unit irradiation (W/m
2) becomes large, and, moreover, the total irradiation density (J/m
2) is projected. As a consequence, the coated film rapidly sets, and stresses are not
amply relieved. For this reason, development of strain and cracks in the coated film
tend to occur. Furthermore, because of radiant heat arriving in admixed state from
the irradiation source and/or thermal energy arising from conversion into heat of
a portion from the ionizing radiation rays within the coated film, the temperature
of the coated film rises to a high value, whereby heat deterioration occurs therein
in some cases, and it is difficult to carry out satisfactory setting of the coating
film and forming of the concavities and convexities.
[0083] It may seem possible to solve the above described problems by increasing the rotational
speed of the roll formplate (travelling speed of the film substrate). However, if
the rotational speed is increased'excessively, the action of the resin liquid in filling
the interiors of the concavities of the roll formplate and its displacing the air
will not take place satisfactorily. Furthermore, since the time period during which
any one part of the coated film is irradiated becomes shorter, the irradiation ends
before cross-linking of the resin liquid or polymerization reaction can occur completely,
whereby defective setting of the coated film occurs in some cases.
[0084] On the other hand, by setting the angle θ between the centerlines of the radiation
beams from the two irradiating devices 8A and 8B in the arrangement shown in FIG.
39 at 90 degrees, it becomes possible to obtain an irradiated region out of one circumference
of the roll formplate which is twice as large as that in the case of one irradiating
device as shown in FIGS. 40 and 41. A maximum of 270/360 of the entire circumference
(a region of a central angle of 270 degrees) can be obtained as the irradiated area.
(However, the ratio 270/360 is that for the case where the irradiating device is infinitely
remote (at a far distance of an order which can be thus stated) or for the case where
a surface irradiating device radiating a flux of parallel rays is used; ordinarily
it is less.) For example, in the case of FIG. 39, 210/360 of the entire circumference
becomes the irradiated region.
[0085] Of course, it is also possible to position three or more irradiating devices around
the roll formplate and to carry out irradiation by setting the angle between the lines
joining adjacent two irradiating devices with the center of the roll formplate at
less than 90 degrees. In such a case, it is also possible to obtain an irradiated
region of over 270/360 of the entire circumference.
[0086] However, ordinarily for the process of applying as coating the ionizing radiation
curing type resin liquid on the roll formplate and for displacement of air by the
resin liquid and filling of the concave parts (furthermore for drying of the solvent
if the solvent dilution has been carried out), a region of a minimum of the order
of 90/360 of the entire circumference is necessary. Furthermore, in view of the curing
speed and quantity of irradiation necessary for curing of ordinary resins of ionizing
radiation setting type in practical use at present, the irradiation output of the
radiation source (principally ultraviolet rays or electron beam) and the like, two
irradiation devices are ample. (The irradiation quantity can be adjusted to some extent
also by the rotational speed of the roll formplate).
[0087] Accordingly, the optimum process is to use two irradiation sources and a center angle
formed thereby of 90 degrees. By this process, a large irradiation region area of
a maximum of 270/360 out of the entire circumferential surface of the roll formplate
required in practice can be obtained. Moreover, by irradiating the irradiation quantity
density necessary for the curing of resin liquid coated film over an amply long time,
deformation, cracking, or thermal deterioration of the coated film due to rapid curing
can be prevented. In this connection, it is possible, by adjusting the radiation angle
of the irradiating device and/or the distance between the irradiating device and the
roll formplate, to accomplish a substantially uniform irradiation over the entire
region to be irradiated. Alternatively, it is also possible to divide the irradiation
into two steps and to leave a region of rest without irradiation. These possibilities
can be suitably selected. Then, as described hereinbefore, in the region of 90/360
of the entire circumference (region of 90° center angle) as a minimum, there exists
a region not reached by direct irradiation of the ionizing radiation rays. For this
reason, there is little possibility of the supplied resin being partially or totally
set by stray ionizing radiation rays prior to the forming of the resin by the roll
formplate.
[0088] The polishing material or agent used in the present invention is not particularly
limited provided that it is one that is used for the purpose of carrying out precision
polishing. It can be selected from a wide variety of materials according to the purpose
of the polishing process. For example, in the case where the article to be polished
is made of a material of a high degree of hardness, such as an ultrahard tool, a polishing
material such as green silicon carbide (SiC) or diamond is suitable. For polishing
articles of hard steels, special steels, high-speed steels, and the like, white fused
alumina (Al
2O
3) is suitable, while chromic oxide (Cr
2O
3) is suitable for polishing articles made of soft materials. For final polishing of
magnetic heads, ferric oxide (Fe
2O
3) is suitable. Polishing materials of a grain or particle size of 0.1 to 20 µm are
suitable.
[0089] Examples of other polishing materials are silicon nitride, zirconium oxide, boron
nitride, and emery. Furthermore, it is also possible to use particles and flakes of
synthetic resins as polishing materials. Examples of such resins are:
(1) Linear polyamides that are condensates of a diamine, NH2(CH2)mNH2, and a dibasic acid, HOOC(CH2)n-2COOH, that is, m-n-nylon, more specifically, 6-6-nylon wherein m = 6 and n = 6, 6-10-nylon
wherein m = 6 and n = 10, etc.;
(2) linear polyamides that are polycondensates or polymers of ω-amino acid, H2 N(CH2)nCOOH, or
![](https://data.epo.org/publication-server/image?imagePath=2002/36/DOC/EPNWB1/EP99105024NWB1/imgb0005)
that is, n-nylon, more specifically, 6-nylon wherein n = 6, 11-nylon wherein n =
11, etc.;
(3) acrylic resins such as polyacrylates, e.g., polymethyl acrylate, polyethyl acrylate,
and polybutyl acrylate, and polymethacrylates, e.g., polymethyl methacrylate, polyethyl
methacrylate, and polybutyl methacrylate.
(4) benzoguanamine
(5) melamine resin
[0090] Polishing materials produced from these synthetic resins are suitable for polishing
the surfaces of relatively soft articles such as synthetic resin products. Furthermore,
such polishing materials can be used also for precision polishing requiring fine degrees
of roughness.
[0091] In general, these synthetic resin polishing materials are superior to metals in their
transmittances with respect to ultraviolet rays and visible light rays. Furthermore,
their indices of refraction are close to those of ionizing radiation curable resins.
For these reasons, they are suitable for setting by radiation with ultraviolet rays
and visible light rays.
[0092] As a desirable mode for preventing the abrasive polishing particles from readily
peeling off during polishing and utilizing with maximum effectiveness the hardness
and polishing capability possessed originally by the polishing particles, there is
a method of coating the surfaces of the polishing material particles with a functional
group having chemical affinity and good wettability with respect to the ionizing radiation
curable resin or causing chemical bonding thereof.
[0093] This method has already been disclosed in Japanese Patent Publication No. 16002/1993
as a process method with the object, in the production of light-diffusing plates (or
films) by dispersing particles of a delusterant or delustering agent in a transparent
synthetic resin, of obtaining uniformity of dispersion of the delusterant thereby
to obtain uniformity of delustering and high light transmittance. In the development
of this invention, it was found that this process method is effective also for preventing
peeling off of the polishing material and for improving the polishing performance.
[0094] As a specific example, reference is made to Japanese Patent Publication No. 16002/1993,
which discloses a process wherein, with the use of particles of a silicone resin (polysiloxane)
comprising a three-dimensional-network high polymer as polishing (abrasive) particles,
an alkyl group such as an ethyl group, a methyl group, a propyl group, or a butyl
group, or an organic group such as a carboxyl group, a carbonyl group, an ester group,
or an ether group is caused to bond to at least silicon atoms in the vicinity of the
outer surfaces of the silicon resin particles, thereby exposing a portion of the organic
group at the surfaces of the silicone resin particles. The number of this organic
group is desirably 0.5 or more and less than 1.5 per 1 silicon atom. If this number
is less than 0.5, the dispersibility and the effect of preventing peeling with be
inadequate. If it exceeds 1.5, the density of the mesh of the polysiloxane bond will
become coarse, and the capacity of the material as a polishing agent will be insufficient.
[0095] Another example of the above described method is that wherein a silane coupling agent
is applied as a coating on the surfaces of polishing particles of silica, alumina,
etc.
[0096] An even more desirable mode of procedure is that of dispersing, in an ionizing radiation
curable resin, particles obtained by subjecting the surfaces of polishing material
particles to a coating process with a silane coupling agent comprising alkoxysilane
having a radical-polymerizable unsaturated group. This processing method also has
already been disclosed in Japanese Patent Application Laid-Open Publn. No. 293099/1988
with the object stated therein of preventing blocking (preventing tackiness) of yet
uncured coating film of resin of ionizing radiation curing type. According to the
present invention, however, it was discovered that the instant processing method is
effective in preventing the peeling off of the abrasive tape during polishing and
in improving the polishing performance thereof.
[0097] Specifically, the silane coupling agent is an alkoxysilane having a radical-polymerizable
unsaturated group, such as for example,
γ-methacryloxypropyltrimethoxysilane,
γ-methacryloxypropylmethyldimethoxysilane,
γ-acryloxypropyltrimethoxysilane,
γ-acryloxypropylmethyldimethoxysilane,
and vinyltriethoxysilane.
[0098] As polishing materials for which processing with these (agents) is especially effective,
alumina (Al
2O
3) and silica (SiO
2) can be mentioned, but, of course, there is no reason for limitation thereof to only
these.
[0099] For coating processing a polishing material with the silane coupling agent, a method
in which particles or grains of the polishing material are dispersed in a solvent
such as toluene, and thereafter a specific quantity of the silane coupling agent is
added to cause a reaction is desirable for carrying out the process uniformly.
[0100] When the polishing material particles thus processed are dispersed in a solution
of the ionizing radiation curable resin and irradiated with ionizing radiation rays,
the radical polymerizable unsaturated group in the silane coupling agent molecule
cross links with a monomer, prepolymer, and/or oligomer in the solution of the ionizing
radiation curable resin, polymerizes, and chemically bonds to the polishing material
particles and the cured resin of the ionizing radiation curable resin, adhering strongly
thereto.
[0101] Furthermore, depending on the use, it is also to use as the polishing layer a material
produced by forming desired irregularities of concavities and convexities on the surface
of the cross-linked cured material of the ionizing radiation curable resin solution
without adding any polishing material whatsoever.
[0102] This polishing layer without a polishing material, also, is suitable for surface
polishing and precision polishing of soft substances such as, for example, synthetic
resins.
[0103] The decisions as to whether or not to use a polishing material and to the kind of
the polishing material if used are suitably made in accordance with factors such as
the required polishing performance, the article to be polished, curing conditions,
coating conditions, and the case of forming the concavities and convexities.
[0104] In this connection, in the case where a polishing material is to be used, it is desirable
that the content of the polishing material in the coating for forming the polishing
layer be 50 to 1,400 parts by weight relative to 100 parts by weight of the binder
component.
[0105] While the thickness of the polishing layer 10 is suitably set in accordance with
the use, a thickness of the order of 0.5 to 500 µm is ordinarily suitable. Furthermore,
in the case where the polishing layer 10 is required to have a high flexibility or
resistance to shrinkage, the requirement can be met by adding into the above mentioned
curing type resin a suitable quantity of a thermosetting resin such as, for example,
non-reactive acrylic resin or various waxes. In addition, additives such as an antistatic
agent can also be added as necessary to the polishing layer.
[0106] For the material of the polishing layer, a material containing as a predominant component
a monomer, prepolymer, or oligomer having within its molecule two or more ethylenically
unsaturated groups such as acryloyl groups or methacrylol groups or thiol groups as
a binder is used. Examples are acrylates such as urethane acrylate, polyester acrylate,
epoxy acrylate, trimethylolpropane triacrylate, and dipentaerythritol hexaacrylate;
methacrylates such as urethane methacrylate, polyester methacrylate, epoxy methacrylate,
trimethylolpropane trimethacrylate, and dipentaerythritol hexamethacrylate; thiols
such as trimethylolpropane trithiopropylate and pentaerythritol tetrathioglycol; and
unsaturated polyesters.
[0107] Other than these, a monomer, prepolymer, or oligomer having one or more of groups
such as ethylenically unsaturated groups and thiol groups within the molecule can
also be added. Examples are acrylates and methacrylates. The cross-link density of
the set substance and further physical properties such as flexibility and heat resistance
are adjusted by selecting the numbers of the functional groups, the molecular weights,
the kinds, and other characteristics of the compounds to be compounded. In general,
when a compound of a high molecular weight and a small number of functional groups
is made the predominant component, the hardness becomes lower, the flexibility increases,
and the heat resistance decreases; whereas when a compound of low molecular weight
and a large number of functional groups is made the predominant component, the hardness
becomes higher, the flexibility decreases, and the heat resistance increases. In all
cases, after cross-linking curing, macromolecules of three-dimensional network structure
are formed. Furthermore, in order to improve the adhesivity relative to the film substrate,
a resin of non-crosslinked type such as a methacrylic resin, an acrylic resin, or
a vinyl chloride-vinyl acetate copolymer can be added.
[0108] In the case of crosslinking and curing with ultraviolet rays or visible light rays,
an acetophenone, a benzophenone, or the like is added as a photopolymerization initiator.
[0109] In general, in the case of a use for which a high degree of smoothness of the finished
surface is required as in the finishing of a magnetic recording material, a magnetic
head, or the like, a good result is obtained by using a relatively soft (low degree
of hardness) polishing layer. As one criterion, it became clear as a result of experiments
that, in the case of thermoplastic (saturated) polyester as the binder of the polishing
layer, a substance of a glass transition point of 50°C or lower, particularly 35°C
or lower, is desirable. The above mentioned hardness and flexibility of the set material
of the ionizing radiation curable resin are also adjusted to an equivalent degree.
[0110] Specific examples are as follows.
[0111] An example of an ionizing radiation curing type resin solution composition which
will produce a crosslink cured substance that is relatively flexible, pliant, yet
tough is a composition obtained by mixing a substance having a hard segment and a
soft segment in the monomer, prepolymer, or oligomer to become the polymerization
unit. Upon being irradiated with ionizing radiation rays, these polymerization units
mutually cross link and form a set substance. A specific example is a monomer, prepolymer,
or oligomer of urethane acrylate. To this, for adjusting the crosslinking density
and hardness of the set substance, acryl monomer is admixed.
[0112] For the above mentioned urethane acrylate, that of an average molecular weight of
500 to 50,000 is selected from those known heretofore.
[0113] As a specific example, an oligomer or a prepolymer of an urethane acrylate having
an urethane group and a radical polymerizable unsaturated group in the molecule can
be obtained by causing an isocyanate having two or more isocyanate groups, a polyester
prepolymer of a weight average molecular weight of 200 to 3,000 having 1 to 4 hydroxyl
groups in one molecule, and an acrylate compound having a hydroxyl group as a terminal
group and moreover having a radical polymerizable unsaturated group to react in a
solvent or not in a solvent in the presence of a reaction catalyst such as an amino
or an organic tin compound and a polymerization inhibitor such as hydroquinone.
[0114] As isocyanates for constituting the above mentioned urethane acrylate, there are
aliphatic or aromatic isocyanate compounds. Examples are isophoronediisocyanate and
hexamethylenediisocyanate.
[0115] Examples of the polyester prepolymer having 1 to 4 hydroxyl groups in one molecule
which constitutes the above mentioned urethane acrylate are: addition reaction products
of diol compounds having aromatic or spiro-ring skeletons and lactone compounds or
derivatives thereof or epoxy compounds; condensation products of polybasic acids such
as phthalic acid and polyols such as ethylene glycol; polyester diols such as polyester
compounds obtained by cleaving cyclic ester compounds; polyether diols such as polytetramethylene
ether glycol, polyethylene glycol, and polypropylene glycol; and polycarbonate diols.
These compounds are used singly or in a mixture of two or more members.
[0116] The weight average molecular weight of the polyester polymer having 1 to 4 hydroxyl
groups in one molecule is desirably within a range of 200 to 3,000 from the standpoint
of wear resistance and hardness, a range of 500 to 1,500 being particularly desirable.
[0117] Examples of acrylate compounds having a hydroxyl group at the end of each molecule
and, moreover, having one or more radical polymerizable unsaturated groups are hydroxylation
derivatives of (meth)acrylic acid ester such as hydroxyethyl acrylate and hydroxypropyl
methacrylate and epoxy acrylate. Monomers of these (acrylates) are used.
[0118] In the case where a very high degree of smoothness of the finished surface is not
required but, rather, it is necessary to increase the polishing rate, the binder is
made relatively hard. As a tentative criterion, the hardness and flexibility are made
to be of the same order as those of a thermoplastic polyester of a Tg of 50°C or higher.
[0119] In order to prevent generation of static electricity during polishing, an antistatic
agent is added. In this case, it is desirable to devise a measure for preventing the
antistatic agent from migrating to the side of the article being polished as the polishing
proceeds.
[0120] For example, a good result can be obtained by causing a preparation resulting from
the addition of a surface active agent (anionic or nonionic) molecule to a monomer,
prepolymer, or oligomer having an ethylenically unsaturated bond (acryloyl group,
methacryloyl group, or the like) to undergo crosslinking together with the aforementioned
ionizing radiation setting resin composition. An example of such a surface active
agent is one having a structure represented by the following formula (sold on the
market under the trademark of "Adekarea Soap" from Asahi Denka Kogyo K.K., Japan).
![](https://data.epo.org/publication-server/image?imagePath=2002/36/DOC/EPNWB1/EP99105024NWB1/imgb0006)
where X is H or SO
3NH
4.
[0121] The crosslinkable surface active agent undergoes crosslinking and curing together
with the binder resin and, in the three-dimensional network macropolymer structure,
chemically bonds by covalent bonding or the like, thereby to form an integral structure.
As an example of chemical bonding of a surface active agent molecule to a three-dimensional
network molecular structure formed by crosslinking or polymerization by ionizing radiation
rays, a composition as disclosed in Japanese Patent Laid-Open Publication No. Heisei
5-98049 may be used.
[0122] This is a composition of a resin of ultraviolet-ray setting type comprising principally
the following members (A), (B), (C), and (D) and used singly by itself or is a substance
formed by dispersing particles of the polishing material in said composition.
(A) A monomer having a quaternary ammonium salt represented by the general formula
![](https://data.epo.org/publication-server/image?imagePath=2002/36/DOC/EPNWB1/EP99105024NWB1/imgb0007)
where:
R1 represents a hydrogen atom or a methyl group; each of R3, R4, and R5 represents independently a hydrogen atom or an alkyl group; R2 represents an alkylene group or an oxyalkylene group; and X- represents a halogen ion, R6SO3- (R6 being an alkyl group substituted aromatic group, alkoxy group), or (R7O)2PO2- (R7 being an alkyl group).
(B) A crosslinkable oligomer.
(C) A multifunctional acrylic; ester and/or methacrylic ester of at least trifunctional
character.
(D) A photopolymerization initiator.
[0123] As a separate example, graphite or metals such as, silver, copper, platinum, nickel,
chromium, iron or ferrous alloys such as carbon steel and stainless steel, and aluminum
or aluminum alloys such as duralumin in the form of powder or thin flakes are added
to the polishing layer. In order to overcome problems such as impairment of the polishing
characteristic and adherence to the article being polished, these (metal powders or
flakes) can be added to the film substrate material.
[0124] For the film substrate 2, any kind of film can be used as long as it has been used
from the past for polishing tapes and, moreover, has a suitable flexibility for its
smooth passage of also rolls, etc., in the production process. For example, polyester
film, polyethylene film, polypropylene film, polyvinyl chloride film, polyvinylidene
chloride film, polycarbonate film, polyamide (nylon) film, polystyrene film, ethylene-vinyl
acetate copolymer film, etc., can be used. Among these, when the points of ease of
fabrication, strength, cost, etc., are considered, polyester films such as those of
particularly biaxial orientated polyethylene terephthalate, polyethylene naphthalate,
etc., are desirable. The surfaces of these films to form the polishing layer can be
processed according to necessity by corona discharge treatment or by easily adhesive
primer treatment with polyester resin, etc. Furthermore, other than the above described
substrates, depending on the necessity, paper, fabric, non-woven fabric, synthetic
paper, etc., which have been treated with a filler may be used. The thickness of this
substrate 2 is desirably of the order of 12 to 100 µm. Further, these substrates may
be of a single layer or be laminated with two or more layers.
[0125] According to the method of producing an abrasive tape according to the present invention,
an abrasive tape of constantly uniform and precise recessed part shape is obtained.
At least the initial polishing capacity of this abrasive tape is stable. Furthermore,
since the recessed parts are of specific shapes as described hereinbefore, the polishing
debris produced from the article being polished during polishing is efficiently accommodated
in these recessed parts. As a result, there is little risk of damaging the surface
of the article being polished due to infiltration of polishing debris in between the
abrasive tape and the article being polished. Furthermore, there is also no lowering
of the polishing capacity due to clogging of the pores of the polishing layer. The
abrasive tape is particularly optimally suitable for precision polishing such as that
requiring mirror finishing. In addition, since the polishing layer is constituted
of an ionizing radiation curing type resin which has been set, it has excellent physical
properties such as wear resistance, whereby polishing by the polishing material is
positively carried out, and there is little possibility of defective polishing of
the article being polished, polishing of high precision becoming possible.
[0126] Specific examples of practice of the present invention will now be described.
Example 1 (Comparative Example)
[0127] On one surface of a polyester film (T-60, mfd. by Toray) of 25-µm thickness, a double-liquid
curable type polyester primer was applied by the gravure coating method so as to form
a coating of a thickness of 0.3 µm upon drying thereby to carry out mold release (lubrication)
processing. On this thus-processed surface, a polishing layer was formed with the
following constituent materials and under the following conditions by employing the
production mode indicated in FIG. 1, thereby fabricating an abrasive tape.
· Formplate --- Use was made of a roll formplate with a concavity width of 10 µm,
a plate depth (depth of concavity) of 15 µm, and a concavity pitch of 30 µm. Moreover
the planar shape was that of a tortoise-shell with plate concavities of rectangular
cross section form.
· Ionizing radiation curing type resin --- A polyester-acrylate, electron beam curing
type paint containing 100 percent by weight of white fused alumina was used.
· Irradiation conditions --- Irradiation was carried out with an electron beam of
10 × 106 rad by means of an electron beam radiating apparatus of curtain-beam type.
[0128] The abrasive tape thus obtained had a polishing layer with recessed parts formed
in accordance with the plate, of desired sharp shape, moreover with good reproducibility.
By using this polishing tape, polishing of stainless steel (SUS-45C, JIS) of a centerline
average roughness (JIS-B-0601, JIS) of 0.5 µm was carried out, whereupon a polishing
finish of a centerline average roughness of 0.1 µm was obtained. At the same time,
furthermore, the polishing debris was accommodated in the above mentioned recessed
parts, and damaging (scoring, abrading, etc.) of the surface of the article being
polished did not occur.
Example 2
[0129] On one surface of a biaxially oriented polyester film (T-60, mfd. by Toray Kabushiki
Kaisha) of 25-µm thickness, a double-liquid curing type polyester primer was applied
by the gravure coating method so as to form a coating of a thickness of 0.3 µm upon
drying thereby to carry out mold release (lubrication) processing. On this thus-processed
surface, a polishing layer was formed with the following constituent materials and
under the following conditions by employing the production mode indicated in FIG.
29, thus fabricating an abrasive tape.
· Shape --- A Bernard cell shape as shown in FIG. 21 was used.
· Formplate --- Use was made of a roll formplate with tortoise-shell shape grooved
concavities of a width of 5 µm, plate depth (cell depth) of 10 µm, a diameter of 5
µm and depth of 3 µm of each pinhole in the center of each region divided by the tortoise-shell
shape grooved concavities, and a surface form comprising a reversal of concavities
and convexities with a pitch of tortoise-shell grooves of 100 µm. The material comprised
a hollow iron cylinder and a copper-plated layer on the outer surface thereof, the
concave-convex surface form being formed thereon.
· Ionizing radiation curing type resin --- An electron beam curing type paint comprising
600 parts by weight of alumina powder (WA-#8000, mfd. by Fujimi Kenmazai Kabushiki
Kaisha) and 100 parts by weight of a multifunctional urethane acrylate prepolymer
was used.
· Irradiation conditions --- Irradiation was carried out with an electron beam of
10 × 106 rad by means of an electron beam radiating apparatus of curtain-beam type. The interior
hollow part of the roll formplate was water-cooled to maintain the outer surface temperature
at 20°C.
[0130] The abrasive tape thus obtained had a polishing layer having recessed parts formed
in accordance with the plate, of desired sharp shape, moreover with good reproducibility.
By using this abrasive tape, polishing of the surface of a 5.25-inch magnetic floppy
disc of a centerline average roughness of 0.5 µm was carried out, whereupon a polishing
finish of a centerline average roughness of 0.05 µm was obtained. Furthermore, the
polishing debris at this time was accommodated in the above mentioned recessed parts,
and damaging of the surface of the article being polished due to the polishing debris
did not occur.
Example 3 (Comparative Example)
[0131] On one surface of a biaxially-oriented polyester film (T-60, mfd. by Toray) of 25-µm
thickness, a double-liquid curing type polyester primer was applied by the gravure
coating so as to form a coating of a thickness of 0.3 µm upon drying thereby to carry
out mold release processing. On this thus-processed surface, a polishing layer was
formed with the following constituent materials and under the following conditions
by employing the production mode indicated in FIG. 1, thus fabricating an abrasive
tape.
· Formplate --- For the shape, a Bernard cell shape as shown in FIG. 21 was used.
Use was made of a roll formplate with tortoise-shell shaped grooved concavities of
a width of 1 µm, plate depth (concavity depth) of 2 µm, a diameter of 1 µm and depth
of 1 µm of each pinhole in the center of each region divided by the tortoise-shell
shape grooved concavities, and a surface form comprising a reversal of concavities
and convexities with a pitch of tortoise-shell grooves of 80 µm. The material was
the same as that in Example 2.
· Ionizing radiation curing type resin --- An electron beam curing type paint comprising
600 parts by weight of alumina powder (WA-#8000, mfd. by Fujimi Kenmazai Kabushiki
Kaisha) and 100 parts by weight of a multifunctional urethane acrylate prepolymer
was used.
· Irradiation conditions --- Irradiation was carried out with an electron beam of
10 × 106 rad by means of an electron beam radiating apparatus of curtain-beam type.
[0132] The abrasive tape thus obtained had a polishing layer having recessed parts formed
in accordance with the plate, of desired sharp shape, moreover with good reproducibility.
By using this polishing tape, polishing of the surface of a 5.25-inch magnetic floppy
disc of a centerline average roughness of 0.40 µm was carried out, whereupon a polishing
finish of a centerline average roughness of 0.09 µm was obtained. Furthermore, the
polishing debris at this time was accommodated in the above mentioned recessed parts,
and damaging of the surface of the article being polished due to the polishing debris
did not occur.
INDUSTRIAL APPLICABILITY
[0133] The present invention is applicable to polishing for the purpose of high precision
finishing of surfaces of articles such as floppy discs and magnetic heads and end
faces of optical fibers.