FIELD OF THE INVENTION
[0001] This invention relates to a method of forming a magnetic body, such as a choke or
transformer core, on a printed circuit board, the magnetic body, and the printed circuit
board on which the magnetic body is formed.
BACKGROUND OF THE INVENTION
[0002] Fig. 4A shows a conventional method for providing a ferrite core and the like on
a printed circuit board, for noise control or for use in transformer and choke coil.
In this case, a ferrite core is formed and split into two pieces in advance. The split
ferrite core pieces 51a, 51b are then attached to a printed circuit board 3 respectively
from both sides and glued to each other via attachment holes 5, 5 created beforehand.
[0003] However, since a ferrite core is typically molded from compacted ferrite material
by a sintering molding process, it is difficult to form the core to the desired measurements
and shape. Thus, it is necessary to grind the sinter molded ferrite core to the desired
dimensions after the core is sintered. Also, if the maximum tolerances of the sintered
ferrite core are too great, the distances to adjacent electronic components on a printed
circuit board must be at least as great as the tolerances, and this could prevent
high density packaging. Moreover, a ferrite core which is made too thin is likely
to break or get chipped when dropped or in transit.
[0004] Additionally, if the ferrite core pieces 51a, 51b are attached as above, gaps 57
are likely to appear between the respective ferrite core pieces 51a, 51b and a circuit
pattern 6 on the printed circuit board 3 as illustrated in Fig. 4B. A gap 57 between
the circuit pattern 6 and the ferrite core pieces 51a, 51b causes a decline in magnetic
properties of the ferrite core, which increases rapidly as the gap 57 increases.
SUMMARY OF THE INVENTION
[0005] An object of the present invention is to provide a magnetic body, and a manufacturing
method thereof, as an alternative to a ferrite core or similar shape, for noise control
and for use in transformers and choke coils.
[0006] In order to attain the above object, the present invention discloses a method of
forming a magnetic body by preparing a magnetic material by mixing and melting at
least a magnetic filler and a binder containing one or more kinds of resin, setting
a printed circuit board in a mold, and injection molding to or around the printed
circuit board using the magnetic material, by which the magnetic body is formed to
cover a circuit pattern on the printed circuit board.
[0007] According to such a forming method, the magnetic body includes resin as binder, and
is thereby more resistant to shocks than ferrite alone. Owing to injection molding
of the body, the molding tolerances are reduced to 10% of that of the case of sintering
molding. Accordingly, there is no need to grind the magnetic body after it is formed.
Also, it is possible to arrange the magnetic body close to other electronic components
which are generally provided on a printed circuit board (including a flexible board).
Thus, high density packaging is realized.
[0008] In another aspect of the present invention, the magnetic body is formed in such a
manner that it is appressed to the printed circuit board as a result of the injection
molding process. Wherein the term "appressed" means that a magnetic body 7 is formed
as a single, unitary body without unwanted gaps therein or unwanted gaps between the
magnetic body and the printed circuit board.
[0009] In this way, a decline in magnetic properties which results from gaps between the
printed circuit board and the magnetic body is prevented. With injection molding,
it is easy to have the magnetic body appressed to the printed circuit board.
[0010] In further aspect of the present invention, a gate for supplying the melted material
to a cavity of the mold is in the form of pin gate.
[0011] In this case, a cross section of the gate becomes small and a trace of the gate on
the molded magnetic body is not obtrusive, or clearly distinct. Therefore, the gate
can be provided at any desired position even when two magnetic bodies (or a magnetic
body and another member) are molded adjacently.
[0012] In another aspect of the present invention, the printed circuit board has at least
one through-hole in an area where the magnetic body is formed, and material is supplied
to form the magnetic body on both sides of the printed circuit board via the through-hole.
[0013] In this way, the magnetic body is formed on both sides of the printed circuit board
at one time, and it is not necessary to use adhesives and the like to hold the magnetic
body fast to the printed circuit board.
[0014] In another aspect of the present invention, the magnetic body is formed to cover
an electronic component mounted on the printed circuit board.
[0015] The covered electronic component is protected from noise. The electronic component
to be covered may be a pin, resistance or condenser. Other electronic components can
be covered as well.
[0016] As explained above, such a magnetic body can function to the full extent, and it
does not need be ground after formed.
[0017] Additionally, the magnetic body may be formed on only one side of the printed circuit
board.
[0018] On such a printed circuit as well, the magnetic body can be set adjacent to other
electronic components, and high density packaging can be attained.
BRIEF DESCRIPTION OF THE DRAWING FIGURES
[0019] The invention will now be described, by way of example, with reference to the accompanying
drawing, in which:
Figs. 1A-1C are explanatory views which illustrate the forming of a magnetic body
7 for noise control, or for use as a transformer or choke coil on a printed circuit
board 3 according to the present invention.
Figs 2A and 2B are explanatory views which illustrate forming of the magnetic body
7 in a mold.
Figs. 3A-3D are explanatory views of a magnetic body 43 for use in transformer, formed
according to the present invention.
Figs. 4A and 4B are explanatory views of prior art using ferrite core pieces 51a,
51b for noise control.
Figs. 5A-5C are explanatory views of an experiment which measures effect by making
a magnetic body fast to a printed circuit board.
DETAILED DESCRIPTION OF THE INVENTION
[0020] Figs. 1A-1C, 2A and 2B show how a printed circuit board 3 according to the present
invention is produced. With regard to components in those figures, the same reference
numbers as those in Figs. 4A and 4B are used to represent the same components, so
far as such use of the same numbers does not cause unnecessary confusion. As an example,
a case is described in which a magnetic body for noise control is provided in a position
X on the printed circuit board 3 of Fig. 1A. As in the prior art, attachment holes
5, 5 are created in the printed circuit board 3 in advance. The printed circuit board
3 is then set in a mold 11 as shown in Fig. 2A to perform the injection molding process.
This mold 11 comprises a fixed plate 11a, an intermediate plate 11b and a movable
plate 11c. A melted material 11d comprised of a magnetic material filler and a binder
is filled into a cavity 17b via a sprue 13, a runner 15 and a gate 16.
[0021] Fig. 2B is a sectional view taken along the line B-B in Fig. 2A. The cavity 17b on
the intermediate plate 11b communicates to a cavity 17c on the movable plate 11c via
one or more holes 5 in the printed circuit board 3. The material lid supplied to the
cavity 17b reaches and fills the cavity 17c through one or more holes 5, 5. With regard
to components of the material 11d to be filled, soft ferrite is used as a magnetic
filler, and PolyAmide 12 is used as binder. In this example, the gate 16, which is
an inflow opening which supplies the material to the cavity 17b, is in the form of
pin gate. However, the gate 16 may be in the form of side gate or submarine gate.
[0022] Fig. 1B shows a portion of the printed circuit board 3 after direct injection molding
by which, for example, a magnetic body 7 for noise control is formed on the printed
circuit board 3. The magnetic body 7 appears similar to conventional ferrite core
pieces 51a, 51b. However, as can be seen in Fig. 1C which is a sectional view taken
along the line A-A in Fig. 1B, no gap 57 appears in the magnetic body 7 or between
the magnetic body 7 and the printed circuit board 3. Consequently, the magnetic body
7 for noise control can function well and without degradation of its magnetic properties.
[0023] An experiment was conducted on respective cases in which the magnetic body 7 is appressed
to the printed circuit board 3 by the method of the present invention and in which
the magnetic body 7 is not appressed to the printed circuit board 3. Fig. 5A shows
the case in which the magnetic body 7 is appressed to the printed circuit board in
accordance with the present invention. As shown, a magnetic body mixed resin and ferrite
is appressed to and around a measuring cable 21. Fig. 5B shows the case in which the
magnetic body is not appressed to the printed circuit board according to the present
invention and gaps 57 of 0.5 mm are formed between the measuring cable 21 and respective
pieces of the magnetic body 23. Fig. 5C is a graph showing the result of measurement
by impedance analyzer 25 of impedance frequency characteristics in both cases. A lateral
axis represents frequency and a longitudinal axis represents impedance. A full line
shows the case of having no gap (Fig. 5A), and a dotted line shows the case of having
gaps (Fig. 5B). As can be seen from this graph, when the magnetic body mixed resin
23 is appressed to the measuring cable 21 by the method of the present invention,
superior impedance frequency characteristics were achieved.
[0024] In other words, from this graph, it is understood that higher impedance is achieved
at any frequency in the case of having no gap compared to the case of having gaps.
The higher the impedance is, the higher and superior the noise absorption is.
[0025] A magnetic body 7 of the present invention is also break resistant since PolyAmide
12 is used as binder. Accordingly, the magnetic body 7 does not easily break or get
chipped, unlike the ferrite core pieces 51a, 51b, which break easily. In addition,
since the magnetic body 7 is formed as a single, unitary body extending to both sides
of the printed circuit board 3, gluing is not necessary, as in the case of ferrite
core pieces 51a, 51b. Also, since the forming tolerance is reduced to 10% of that
of the case in using a sintered product, post-forming processing like grinding becomes
unnecessary, and thus it is possible to simplify the manufacturing process. By the
same reason, the distances to adjacent electronic components can be made smaller,
and thus high density packaging can be realized.
[0026] In the above, an embodiment of the present invention is described. However, the present
invention is not limited to the above embodiment, and other modifications and variations
are possible within the scope of the present invention.
[0027] For instance, in the present embodiment, soft ferrite is used for magnetic material.
However, other materials such as hard ferrite, amorphous in Fe, Fe-Si, Fe-Si-Al, Fe-Si-Cr,
Fe-Ni, Fe-Cr, and Co system, Fe-based nanocrystal can be used. In addition, the magnetic
filler made from such magnetic materials can be formed in any shape, such as round,
flat, etc.
[0028] Also, the binder can be thermoplastic resin such as EVA (Ethylene-Vinyl acetate copolymer),
EVOH (Ethylene-Vinyl alcohol-Copolymer), PVC (PolyVinylChloride), CPE (Chlorinated
polyethylene), CA (Cellulose-Acetate), POM (PolyOxyMethylene), PA (PolyAmide), PAR
(Polyarylate), TPU (Thermoplastic Polyurethane), TPE (Thermoplastic-Elastomer), LCP
(Liquid Crystal Polymer), PEEK (PolyEtherEtherKetone), PSU (Polysulphone), PES (PolyEtherSulfone),
HDPE (High Density Polyethylene), LDPE (Low Density Polyethylene), LLDPE (Linear Low
Density Polyethylene), PET (PolyEthylene Terephthalate), PC (PolyCarbonate), PS (PolyStyrene),
PPE (PolyPhenyleneEther), PPO (PolyPhenyleneOxide), PPS (PolyPhenyleneSulfide), PBD
(PolyButadiene), PBT (PolyButhylene Terephthalate), PP (PolyPropylene), PMMA (PolyMethylMethAcrylate),
PMP (Polymethylpentene) and BP (Butyl Phthalate), thermosetting resin such as EP (Epoxy
resin), PDAP (Polydiallyl Phthalate), SI (Silicone), PF (PhenolFormaldehyde), UP (Unsaturated
Polyester), PI (Polyimide), PUR (Polyurethane), MF (Melamine-Formaldehyde) and UF
(Urea-Formaldehyde), vulcanized rubber such as SBR (StyreneButadiene Rubber), NBR
(Nitril-Butadiene Rubber), IR (Isoprene Rubber), CR (Chloroprene-Rubber), BR (Butadiene
Rubber), IIR (Isobutylene-Isoprene Rubber), EPDM (Ethylene-Propylene-Diene Methylene
linkage), CSM (ChloroSulfonated Polyethylene), AR (Acrylic rubber), FR (Fluorine Rubber),
VMQ (Silicone Rubber), ECO (Epichlorhydrin Rubber) and EU (PolyeterUrethane rubber),
polyurethane or silicone thermoplastic rubber, liquid rubber or elastomer.
[0029] In addition, and for example, a magnetic transformer body 43, as shown in Fig. 3B,
may be formed on the printed circuit board 3 on which three attachment holes 41 are
created as shown in Fig. 3A. In this case as well, the magnetic transformer body 43
having an 8-shaped cross section as shown in Fig. 3C can be formed appressed to the
printed circuit board 3. Furthermore, when setting the printed circuit board 3 in
the mold, it is possible to insert a sintered ferrite plate 45 or a magnetic metal
plate 45 in the cavity before performing the injection molding. Then, it is possible
to form a magnetic body 7 containing a sintered ferrite plate 45 as shown in Fig.
3D.
[0030] Moreover, a magnetic body 7 for choke coil may be formed on the printed circuit board
3. It is also possible to form a magnetic body 7 only on one side of the printed circuit
board 3. Additionally, the circuit pattern 6 can be a signal line, power line, ground
line, transformer circuit pattern or choke coil pattern.
1. A method of forming magnetic body comprising steps of
preparing a material by mixing and melting at least a magnetic filler and a binder
including one or more kinds of resin,
setting a printed circuit board into a mold, and
performing injection molding to the printed circuit board using the melted material,
by which a magnetic body is formed to cover a circuit pattern on the printed circuit
board.
2. The method of forming magnetic body as set forth in claim 1, wherein said magnetic
body is formed in such a manner that it is appressed to said printed circuit board.
3. The method of forming magnetic body as set forth in claim 1, wherein a gate which
is an inflow opening for supplying said melted material into a cavity on said mold
is in the form of a pin gate.
4. The method of forming magnetic body as set forth in claim 1, wherein said printed
circuit board has at least one through-hole at an area where said magnetic body is
to be formed, and said melted material is supplied via the through-hole to form said
magnetic body on both sides of said printed circuit board.
5. The method of forming magnetic body as set forth in claim 1, wherein said magnetic
body is formed so that it covers an electronic component mounted on said printed circuit
board.
6. The method of forming magnetic body as set forth in claim 5, wherein said electronic
component is a pin, resistance, or condenser.
7. A magnetic body which is formed by the method of forming magnetic body comprising
steps of preparing a material by mixing and melting at least a magnetic filler and
a binder including one or more kinds of resin, setting a printed circuit board into
a mold, and performing injection molding to the printed circuit board using the melted
material, by which a magnetic body is formed to cover a circuit pattern on the printed
circuit board.
8. A printed circuit board on which a magnetic body is formed by the method of preparing
a material by mixing and melting at least a magnetic filler and a binder including
one or more kinds of resin, setting a printed circuit board into a mold, and performing
injection molding to the printed circuit board using the melted material, by which
a magnetic body is formed to cover a circuit pattern on the printed circuit board.