TECHNICAL FIELD
[0001] The present invention relates to a thick-film thermal printhead.
BACKGROUND ART
[0002] An example of a conventional thick-film thermal printhead is shown in Fig. 5 and
Fig. 6. Each of these conventional thermal printheads (indicated by reference code
P) comprises a rectangular head substrate 1' and a print substrate 2'. As shown in
Fig. 5, the head substrate 1' has a first longitudinal edge 1a' and a second longitudinal
edge 1b' extending in parallel to each other. Further, the head substrate 1' has a
first end 1c' and a second end 1d' extending between the first and the second longitudinal
edges. Likewise, the print substrate 2' has two longitudinal edges and two ends.
[0003] The head substrate 1' has an upper surface entirely covered by a glaze layer 10'
(Fig. 6) made of amorphous glass. On an upper surface of the glaze layer 10' , a linear
heating resistor 11' extending along the first longitudinal edge 1a' is formed.
[0004] The head substrate 1' is further formed with a common electrode 12' and a plurality
of individual electrodes 13' . As shown in Fig. 5, the common electrode 12' extends
along the first end 1c', the first edge 1a', and the second end 1d'. Further, the
common electrode 12' has a plurality of comb-like teeth 12A' extending in parallel
to each other. Each of the comb-like teeth 12A' has a tip potion 12a' contacting the
heating resistor 11'.
[0005] Each of the individual electrodes 13' has a first end portion 13a' and a second end
portion 13b' away therefrom. The first end portion 13a' contacts the heating resistor
11' and extends between two adjacent comb-like teeth 12A'. On the other hand, the
second end portion 13b' is formed with a bonding pad 13c'. The bonding pad 13c' is
electrically connected to a drive IC 14' via a connecting wire W'.
[0006] With the above constitution, the heating resistor 11' is divided into a plurality
of regions 15' by the comb-like teeth 12A'. (Fig. 5 shows only one region 15'.) In
each of the regions 15', electric current is passed selectively via the drive IC 14'
, to heat the selected region 15', making each of the regions 15' function as a heating
dot.
[0007] The prior-art thick-film thermal printhead P as described above has a following disadvantage:
Specifically, the thermal printhead P can provide a good printing result if the printing
is performed at a speed of about 2 inches per second (2 ips). However, if the printing
speed is increased to about 6 ips for example, printed image can be partially blurred,
or an unintended whisker-like projection (feathering) can be printed on a printing
sheet.
[0008] Another thick-film thermal printed is disclosed in JP-A- 5092593. In this document
there is described a thermal head having lead pattern layers provided on a partial
glaze layer formed on a substrate. A thick-film heating element is formed having a
width larger than the width of the partial glaze layer. As a result, part of the heating
element contacts the substrate through the lead pattern layers or directly. Accordingly,
heat from the heating element is dissipated easily.
DISCLOSURE OF THE INVENTION
[0009] An object of the present invention is to provide a thick-film thermal printhead capable
of eliminating or reducing the above-described problem in the prior art.
[0010] According to the present invention there is provided a thick-film thermal printhead
comprising: an oblong rectangular substrate having at least one longitudinal edge;
a partial glaze layer provided on the substrate along the longitudinal edge; a linear
heating resistor formed on the partial glaze layer, the linear heating resistor being
narrower than the partial glaze layer and formed entirely within the width of the
partial glaze layer; a common electrode formed on the substrate and electrically connected
to the heating resistor, the common electrode having a plurality of comb-like teeth
contacting the heating resistor,each of the comb-like teeth including a tip portion
having a smaller width and a base portion having a larger width; and a plurality of
individual electrodes formed on the substrate and electrically connected to the heating
resistor, wherein the base portion of each comb-like tooth extends on both of the
partial glaze layer and the substrate, each base portion extending onto the partial
glaze layer only to a position spaced from the heating resistor so that only the tip
portion of each comb-like tooth contacts the heating resistor.
[0011] According to a preferred embodiment, the partial glaze layer has an arcuate cross
section. Further, the partial glaze layer has a thickness of 10-25 µm and a width
of 400-1000 µm.
[0012] According to the preferred embodiment, each of the individual electrodes includes
a tip portion having a smaller width and an intermediate portion having a larger width,
the intermediate portion of each individual electrode extending on both of the partial
glaze layer and the substrate, each intermediate portion extending on to the partial
glaze layer only up to a position spaced from the heating resistor so that only the
tip portion of each individual electrode contacts the heating resistor.
[0013] Other objects characteristics and advantages of the present invention will become
clearer from an embodiment to be described with reference to the attached drawings.
BRIEF DESCRIPTION OF THE ATTACHED DRAWINGS
[0014]
Fig. 1 is a plan view of a thick-film thermal printhead according to the present invention;
Fig. 2 is a plan view of a primary portion of the thick-film thermal printhead in
Fig. 1;
Fig. 3 is a sectional view taken in lines III-III in Fig. 2;
Fig. 4 is a graph showing a thermal response characteristic of a heating dot;
Fig. 5 is a plan view of a prior art thick-film thermal printhead; and
Fig. 6 is a sectional view taken in lines VI-VI in Fig. 5.
BEST MODE FOR CARRYING OUT THE INVENTION
[0015] Hereinafter, a preferred embodiment of the present invention will be described with
reference to Fig. 1 - Fig. 4.
[0016] Fig. 1 is a plan view showing a thick-film thermal printhead X according to the present
invention. As shown in the figure, the thick-film thermal printhead X comprises an
oblong rectangular head substrate 1 and an oblong print substrate 2 mounted in adjacency
thereto. The head substrate 1 is made of an electrically insulating material such
as alumina ceramic whereas the print substrate 2 is made of an electrically insulating
material such as glass epoxy resin.
[0017] As shown in Fig. 1, the head substrate 1 has a first longitudinal edge 1a and a second
longitudinal edge 1b extending in parallel to each other. Further, the head substrate
1 has a first end 1c and a second end 1d extending between the first and the second
longitudinal edges. Likewise, the print substrate 2 has two longitudinal edges and
two ends.
[0018] The head substrate 1 has an upper surface formed with a partial, linear glaze layer
10 made of amorphous glass. The partial glaze layer 10 extends in parallel to the
first longitudinal edge 1a (and the second longitudinal edge 1b), closer to the first
longitudinal edge 1a than to the second longitudinal edge 1b. The partial glaze layer
10 has a thickness D1 (Fig. 3) of 10-25 µm, and a with D2 of 400-1000 µm. Advantages
achieved from such an arrangement as this will be described later.
[0019] The partial glaze layer 10 can be formed by applying an amorphous glass paste on
the head substrate 1 and then baking the same. As shown in Fig. 3, the partial glaze
layer 10 has a smooth arcuate upper surface. This is because the applied glass paste
flows at the time of baking. Along a peak portion of the partial glaze layer 10, a
linear heating resistor 11 is formed.
[0020] The head substrate 1 is further formed with a common electrode 12 and a plurality
of individual electrodes 13. As is clear from Fig. 1, the common electrode 12 extends
along the first end 1c, the first edge 1a, and the second end 1d. Further, the common
electrode 12 has a plurality of comb-like teeth 12A extending in parallel to each
other. Each of the comb-like tooth 12A contacts the heating resistor 11.
[0021] Each of the individual electrodes 13 has a first end portion 13a and a second end
portion 13b away therefrom. The first end portion contacts the heating resistor 11
and extends between two adjacent comb-like teeth 12A. On the other hand, the second
end portion is formed with a bonding pad 13c. The bonding pad 13c is electrically
connected to a drive IC 14 via a connecting wire W.
[0022] As shown in Fig. 2, each of the comb-like teeth 12A includes a tip portion 12c having
a smaller width, and a base portion 12d having a larger width. The tip portion 12c
is entirely formed on the partial glaze layer 10, and electrically contacted to the
heating resistor 11. On the other hand, the base portion 12d is spaced from the heating
resistor 11, and only a part of the base portion is formed on the partial glaze layer
10 . The other portion of the base portion 12d is formed on the head substrate 1.
The width of the tip portion 12c is 20-25 µm for example, whereas the width of the
base portion 12d is 80 µm for example. The tip portion 12c has a length of 400 µm
for example.
[0023] Likewise, the first end portion of each of the individual electrodes 13 includes
a tip portion 13d having a smaller width, and an intermediate portion 13e having a
larger width. The tip portion 13d is entirely formed on the partial glaze layer 10,
and electrically contacted to the heating resistor 11. On the other hand, the intermediate
potion 13e is spaced from the heating resistor 11, and only a part of the intermediate
portion is formed on the partial glaze layer 10. The other portion of the intermediate
portion 13e is formed on the head substrate 1 . The width of the tip portion 13d is
20-25 µm for example, whereas the width of the intermediate portion 13e is 80 µm for
example. The tip portion 13d has a length of 400 µm for example.
[0024] With the above structure, the heating resistor 11 is divided into a plurality of
regions 15 by the comb-like teeth 12A. (Fig. 2 shows only one region 15.) In each
of the regions 15, electric current is passed selectively via the drive IC 14, to
heat the selected region 15, making each of the regions 15 function as a heating dot.
The number of the heating dots is varied in accordance with conditions such as the
size of recording paper to be used. For example, if printing is to be made to an A-4
size recording paper at a printing density of 200 dpi, 1728 heating dots are formed
in a direction of secondary scanning.
[0025] The common electrode 12 and each of the individual electrodes 13 can be formed by
using the following method: Specifically, first, a paste containing an electrically
conductive metal such as gold is prepared. Next, the paste is applied on the head
substrate 1, and then baked. Then, finally, the baked material is etched by means
of photolithography into a predetermined pattern. According to such a method as above,
the common electrode 12 and the individual electrodes 13 can be formed simultaneously.
The common electrode 12 and the individual electrodes 13 have a thickness of about
0.6 µm.
[0026] The heating element 11 can be formed by first applying a resistor pate containing
ruthenium oxide on the partial glaze layer 10, and then baking the applied paste.
The heating resistor 11 has a thickness of about 9µm for example.
[0027] As shown in Fig. 3, a protective coating 16 is formed to cover the heating resistor
11, the common electrode 12 and each of the individual electrodes 13. However, the
bonding pads 13c of the individual electrodes 13 are not covered by the protective
coating 16. The protective coating 16 can be formed by applying a glass paste on the
head substrate 1 and then baking the glass paste. The protective coating 16 has a
thickness of 4-8 µm for example.
[0028] Alternatively, the protective coating 16 can be formed by an electrically conductive
material such as Ti-sialon and SiC to a thickness of 4-8 µm. In this case, the formation
of the protective coating 16 is performed by using such a technique as spattering
and chemical vapor deposition (CVD) method.
[0029] As has been described earlier, in the thick-film thermal printhead according to the
present invention, the heating resistor 11 is formed on the partial glaze layer 10.
Therefore, it becomes possible to make the heating resistor 11 appropriately contact
the recording paper.
[0030] The thickness D1 of the partial glaze layer 10 is 10-25 µm, whereas the width D2
is 400-1000 µm. By making the partial glaze layer 10 into the above given dimensions,
thermal responsiveness of the heating resistor 11 can be improved over that of the
prior art. This point will be described specifically hereafter.
[0031] Generally, the thermal responsiveness of the heating resistor 11 decreases to deteriorate
printing quality when the area of cross section of the partial glaze layer 10 increases.
Conversly, if the area of cross section of the partial glaze layer 10 is too small,
the heating resistor 11 does not properly contact the recording paper. It has been
found that these problems can be eliminated by setting the thickness and the width
of the partial glaze layer 10 to the values given above. Experiments were conducted
with results shown in the table below. (The experiments were made with thermal printheads
each having a printing density of 200 dpi, and printing was performed at a speed of
6 ips. The common electrode and the individual electrodes of each thermal printhead
were formed by using gold to a thickness of 0.6 µm. The heating resistor was made
from a resistor paste containing ruthenium oxide to a thickness of 9 µm.)
|
Glaze Type |
Thickness [µm] |
Width [µm] |
Thermal Response Time (T:msec) |
Printing Quality |
Example 1 |
Partial Glaze |
12 |
400 |
0.63 |
Good |
No blur |
No feathering |
Example 2 |
Partial Glaze |
24 |
800 |
0.85 |
Good |
No blur |
No feathering |
Example 3 |
Partial Glaze |
50 |
800 |
1.20 |
No good |
Some blur & Feathering |
Example 4 |
Entire Glaze |
10 |
- |
0.56 |
No Good |
Some blur & Feathering |
[0032] As understood from the Table, the thermal responsiveness of the heating resistor
increases if the thickness of the partial glaze layer is 10-25 µm and the width thereof
is 400-1000 µm, and as a result, good printing image is obtained. It should be noted
here that, as shown in Fig. 4, the thermal responsiveness of the heating resistor
is evaluated on the basis of a time T which is the time necessary for a surface temperature
of the heating resistor to descend from 300°C to 100°C. Specifically, the shorter
is the time T, better is the thermal responsiveness.
[0033] The thick-film thermal printhead described has the following advantages: Specifically,
as has been described with reference to Fig. 2, each of the comb-like teeth 12A and
the individual electrodes 13 contacts the heating resistor 11 via the corresponding
tip portion 12c or 13d which has the smaller width. According to such an arrangement
as this, the area of each heating dot 15 can be increased compared with the prior
art, without decreasing the density of the heating dots 15.
[0034] Further, according to the present invention, rupture of each comb-like tooth 12A
(or the individual electrode 13) can be effectively eliminated. Specifically, there
is a step between the head substrate 1 and the partial glaze layer 10, and therefore
the comb-like tooth 12A is formed as folded on the head substrate 1 and the partial
glaze layer 10 (Fig. 3). Because stress concentrates onto such a folded portion as
above, the folded portion is relatively easily ruptured.
[0035] However, according to the present invention, the folded portion is the wider base
portion 12d. Therefore, even with the stress concentration, the comb-like tooth 12A
is not ruptured easily. In the described embodiment this also applies to each of the
individual electrodes.
1. A thick-film thermal printhead comprising:
an oblong rectangular substrate (1) having at least one longitudinal edge (1a);
a partial glaze layer (10) provided on the substrate (1) along the longitudinal edge
(1a);
a linear heating resistor (11) formed on the partial glaze layer (10), the linear
heating resistor (11) being narrower than the partial glaze layer (10) and formed
entirely within the width of the partial glaze layer (10);
a common electrode (12) formed on the substrate (1) and electrically connected to
the heating resistor (11), the common electrode having a plurality of comb-like teeth
(12A) contacting the heating resistor (11), each of the comb-like teeth (12A) including
a tip portion (12c) having a smaller width and a base portion (12d) having a larger
width, wherein the base portion (12d) of each comb-like tooth (12A) extends on both
of the partial glaze layer (10) and the substrate (1), each base portion (12d) extending
onto the partial glaze layer (10) only to a position spaced from the heating resistor
(11) so that only the tip portion (12c) of each comb-like tooth (12A) contacts the
heating resistor (11); and
a plurality of individual electrodes (13) formed on the substrate (1) and electrically
connected to the heating resistor (11).
2. The thick-film thermal printhead according to Claim 1, wherein the partial glaze layer
has an arcuate cross section.
3. The thick-film thermal printhead according to claim 1 or claim 2, wherein the partial
glaze layer has a thickness of 10-25 µm and a width of 400-1000 µm.
4. A thick-film thermal printhead according to any one of claims 1 to 3, wherein each
of the individual electrodes (13) includes a tip portion (13d) having a smaller width
and an intermediate portion (13e) having a larger width, the intermediate portion
(13e) of each individual electrode (13) extending on both of the partial glaze layer
(10) and the substrate (1), each intermediate portion (13e) extending on to the partial
glaze layer (10) only up to a position spaced from the heating resistor (11) so that
only the tip portion (13d) of each individual electrode (13) contacts the heating
resistor (11).
1. Dickfilmthermodruckkopf umfassend:
ein längliches rechteckiges Substrat (1) mit zumindest einer Längskante (1a);
eine auf dem Substrat (1) entlang der Längskante (1a) bereitgestellte teilweise glasierte
Schicht (10);
einen auf der teilweise glasierten Schicht geformten linearen Heizwiderstand (11),
wobei der Heizwiderstand (11) schmaler als die teilweise glasierte Schicht (10) und
vollständig innerhalb der Breite der glasierten Schicht (10) geformt ist;
eine auf dem Substrat (1) geformte und elektrisch mit dem Heizwiderstand (11 ) verbundene
gemeinsame Elektrode (12), wobei die gemeinsame Elektrode eine Vielzahl von den Heizwiderstand
(11) kontaktierenden Kamm-ähnlichen Zähnen (12A) aufweist und jeder der Kamm-ähnlichen
Zähne einen Spitzenbereich (12c) mit einer schmaleren Breite und einen Basisbereich
(12d) mit einer größeren Breite aufweist;
wobei sich der Basisbereich (12d) jedes Kamm-ähnlichen Zahns (12A) sowohl auf die
teilweise glasierte Schicht (10) und das Substrat (1 ) erstreckt, sich jeder Basisbereich
(12d) auf der teilweise glasierten Schicht (10) nur bis zu einer zu dem Heizwiderstand
beabstandeten Position erstreckt, so daß nur der Spitzenbereich (12c) jedes Kamm-ähnlichen
Zahns (12A) den Heizwiderstand (11 ) kontaktiert und eine Vielzahl von Einzelelektroden
(13) auf dem Substrat (1 ) geformt und elektrisch mit dem Heizwiderstand (11 ) verbunden
sind.
2. Dickfilmthermodruckkopf gemäß Anspruch 1, wobei die teilweise glasierte Schicht einen
bogenförmigen Querschnitt aufweist.
3. Dickfilmthermodruckkopf gemäß Anspruch 1 oder 2, wobei die teilweise glasierte Schicht
eine Dicke von 10-25µm und eine Breite von 400-1000µm aufweist.
4. Dickfilmthermodruckkopf gemäß einem der Ansprüche 1 bis 3, wobei jede der Einzelelektroden
(13) einen Spitzenbereich (13d) mit einer schmaleren Breite und einen Zwischenbereich
(13e) mit einer größeren Breite aufweist, sich der Zwischenbereich (13e) jeder Einzelelektrode
(13) auf der teilweise glasierten Schicht (10) nur bis zu einer von dem Heizwiderstand
beabstandeten Position erstreckt, so daß nur der Spitzenbereich (13d) jeder Einzelelektrode
(13) den Heizwiderstand (11 ) kontaktiert.
1. Tête d'imprimante thermique à couche épaisse comprenant :
un substrat rectangulaire oblong (1) ayant au moins un bord longitudinal (1a) ;
une couche partielle émaillée (10) disposée sur le substrat (1) le long du bord longitudinal
(1a) ;
une résistance chauffante linéaire (11) formée sur la couche partielle émaillée (10),
la résistance chauffante linéaire (11) étant plus étroite que la couche partielle
émaillée (10) et formée entièrement à l'intérieur de la largeur de la couche partielle
émaillée (10) ;
une électrode commune (12) formée sur le substrat (1) et électriquement connectée
à la résistance chauffante (11), l'électrode commune comportant une pluralité de dents
de type peigne (12A) venant en contact avec la résistance chauffante (11), chacune
des dents de type peigne (12A) comprenant une partie en pointe (12c) ayant une largeur
plus petite et une partie de base (12d) ayant une largeur plus grande, dans laquelle
la partie de base (12d) de chaque dent de type peigne (12A) s'étend tant sur la couche
partielle émaillée (10) que sur le substrat (1), chaque partie de base (12d) s'étendant
sur la couche partielle émaillée (10) seulement à une position espacée de la résistance
chauffante (11) de sorte que seule la partie en pointe (12c) de chaque dent de type
peigne (12A), vient en contact avec la résistance chauffante (11) ; et
une pluralité d'électrodes individuelles (13) formées sur le substrat (1) et électriquement
connectées à la résistance chauffante (11).
2. Tête d'imprimante thermique à couche épaisse selon la revendication 1, dans laquelle
la couche partielle émaillée présente une section transversale en forme d'arc.
3. Tête d'imprimante thermique à couche épaisse selon la revendication 1 ou la revendication
2, dans laquelle la couche partielle émaillée a une épaisseur de 10 à 25 µm et une
largeur de 400 à 1 000 µm.
4. Tête d'imprimante thermique à couche épaisse selon l'une quelconque des revendications
1 à 3, dans laquelle chacune des électrodes individuelles (13) comprend une partie
de pointe (13d) ayant une largeur plus petite et une partie intermédiaire (13e) ayant
une largeur plus grande, la partie intermédiaire (13e) de chaque électrode individuelle
(13) s'étendant tant sur la couche partielle émaillée (10) que sur le substrat (1),
chaque partie intermédiaire (13e) s'étendant sur la couche partielle émaillée (10)
seulement jusqu'à une position espacée de la résistance chauffante (11) de sorte que
seule la partie de pointe (13d) de chaque électrode individuelle (13) vient en contact
avec la résistance chauffante (11).