(19)
(11) EP 1 187 514 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
02.01.2004 Bulletin 2004/01

(43) Date of publication A2:
13.03.2002 Bulletin 2002/11

(21) Application number: 01307776.3

(22) Date of filing: 12.09.2001
(51) International Patent Classification (IPC)7: H05K 1/02
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 12.09.2000 JP 2000281769

(71) Applicant: SONY CORPORATION
Tokyo (JP)

(72) Inventor:
  • Matsuda, Yoshinari
    Shinagawa-ku, Tokyo (JP)

(74) Representative: Nicholls, Michael John 
J.A. KEMP & CO. 14, South Square Gray's Inn
London WC1R 5JJ
London WC1R 5JJ (GB)

   


(54) Printed wiring board


(57) There is provided a printed wiring board in which control of a characteristic impedance of a signal transmission pattern is realized with a small space and at a low cost, its manufacture is easy, a delay is hard to cause, and a high frequency signal can be stably transmitted. The printed wiring board (10) includes a flat plate base material (1), a signal transmission pattern (9) provided on at least one surface of the base material (1) for transmitting a high frequency signal, an insulator layer (11) formed to a constant thickness so as to cover the signal transmission pattern (9), and a control unit (13) provided on the insulator layer (11) so as to be opposite to the signal transmission pattern (9) and to be grounded, for controlling a characteristic impedance of the signal transmission pattern.






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