(57) An object of the present invention is to unchange the order of wafers when passed
through a wafer outer peripheral part polishing apparatus (1), thereby simplifying
control for each wafer. In predetermined positions of a frame (10) of a wafer outer
peripheral part polishing unit (5), there are arranged and attached a wafer cassette
reception and discharge opening unit (2), a wafer position aligning unit (3), a wafer
notch polishing unit (4), a wafer circumferential part polishing unit (5), an inside
carrier unit, a first slurry supply device (49), and a second slurry supply device
(59). The inside carrier unit has a first carrier sub-unit (81), a second carrier
sub-unit (82), and a third carrier sub-unit (83). After a wafer taken out from the
wafer cassette reception and discharge opening unit (2) is polished, the wafer is
returned to the same slot of the same cassette from which it is taken out. Thus, the
order is not changed.
|
|
