Background of the Invention
Field of the Invention
[0001] The present invention relates to an alloy type thermal fuse in which a Bi-Sn alloy
is used as a fuse element, and which has an operating temperature of about 140°C,
and also to a material for a thermal fuse element.
[0002] An alloy type thermal fuse is widely used as a thermoprotector for an electrical
appliance or a circuit element, for example, a semiconductor device, a capacitor,
or a resistor.
Such an alloy type thermal fuse has a configuration in which an alloy of a predetermined
melting point is used as a fuse element, the fuse element is bonded between a pair
of lead conductors, a flux is applied to the fuse element, and the flux-applied fuse
element is sealed by an insulator.
The alloy type thermal fuse has the following operation mechanism.
The alloy type thermal fuse is disposed so as to thermally contact an electrical
appliance or a circuit element which is to be protected. When the electrical appliance
or the circuit element is caused to generate heat by any abnormality, the fuse element
alloy of the thermal fuse is melted by the generated heat, and the molten alloy is
divided and spheroidized because of the wettability with respect to the lead conductors
or electrodes under the coexistence with the activated flux that has already melted.
The power supply is finally interrupted as a result of advancement of the spheroid
division. The temperature of the appliance is lowered by the power supply interruption,
and the divided molten alloys are solidified, whereby the non-return cut-off operation
is completed.
[0003] Conventionally, a technique in which an alloy composition having a narrow solid-liquid
coexisting region between the solidus and liquidus temperatures, and ideally a eutectic
composition is used as such a fuse element is usually employed, so that the fuse element
is fused off at approximately the liquidus temperature (in a eutectic composition,
the solidus temperature is equal to the liquidus temperature). In a fuse element having
an alloy composition in which a solid-liquid coexisting region exists, namely, there
is the possibility that the fuse element is fused off at an uncertain temperature
in the solid-liquid coexisting region. When an alloy composition has a wide solid-liquid
coexisting region, the uncertain temperature width in which a fuse element is fused
off in the solid-liquid coexisting region is correspondingly increased, and the operating
temperature is largely dispersed. In order to reduce the dispersion, therefore, an
alloy composition having a narrow solid-liquid coexisting region between the solidus
and liquidus temperatures, or ideally a eutectic composition is used.
[0004] Because of increased awareness of environment conservation, the trend to prohibit
the use of materials harmful to a living body is recently growing as a requirement
on an alloy type thermal fuse. Also an element for such a thermal fuse is strongly
requested not to contain a harmful element (Pb, Cd, Hg, Tl, etc.).
Conventionally, a Bi-Sn eutectic alloy (57% Bi, balance Sn) is known as an element
for a thermal fuse which does not contain an element harmful to a living body, and
which has an operating temperature of about 140°C.
Description of the Prior Art
[0005] Conventionally, functions of an electrical appliance are advanced, and the power
consumption of an appliance is increased. Therefore, a thermal fuse is requested to
have a high power rating of AC 250 V and 5 A or more.
When an alloy type thermal fuse is used at a voltage as high as AC 250 V, an arc
is easily generated at an operation of the fuse. As a result, substances such as a
charred flux produced by the arc, and molten portions of a fuse element are scattered
to adhere to the inner wall of a case, thereby forming a resistor path, and a current
may flow through the resistor path. The thermal fuse may be damaged or broken by Joule's
heat due to the current. In succession to the current flow through the resistor path,
or after interruption of the current flow, a rearc may be generated, and the thermal
fuse may be damaged or broken by the rearc. Even when the thermal fuse may not be
damaged or broken, the insulation property after an operation is lowered to produce
the probability that, when a high voltage is applied, reconduction occurs to cause
a serious problem.
The degrees of the damage or destruction modes of a thermal fuse depend on the
level of the destruction energy. The modes are enumerated in the order of degree as
follows: ejection of a molten fuse element or a molten flux; destruction of a sealing
portion; destruction of an insulating case; and melting of a lead conductor or an
insulating case.
[0006] When a thermal fuse in which the above-mentioned Bi-Sn alloy is employed as a fuse
element is used under a high voltage, an abnormal mode such as damage or destruction
at an operation or an insulation failure after an operation easily occurs. The reason
of this is estimated as follows. At an operation, a fuse element is changed at once
from the solid phase to the liquid phase in which the surface tension is low, without
substantially entering an intermediate phase state. When the fuse element is fused
off, therefore, the liquefied fuse element is formed into minute particles, and the
particles are scattered together with a charred flux due to an arc at the operation.
Many of the particles adhere to the inner wall of an outer case, thereby causing the
insulation distance after an operation not to be maintained. As a result, such an
abnormal mode is caused by the reconduction due to the high-voltage application or
generation of a rearc after reinterruption.
[0007] The inventor eagerly conducted studies in order to prevent an abnormal mode from
occurring when a thermal fuse in which a Bi-Sn alloy is used as a fuse element operates.
As a result, it has been found that, when a composition of Bi of larger than 50% and
56% or smaller, and the balance Sn is employed, an abnormal mode can be satisfactorily
prevented from occurring and dispersion of the operating temperature can be sufficiently
reduced.
The reason why an abnormal mode can be prevented from occurring is estimated as
follows. In the specific Bi-Sn alloy composition, a solid-liquid coexisting region
(intermediate state) in which the surface tension is relatively large exists with
being deviated from a eutectic point and between the solidus temperature and the liquidus
temperature. The spheroid division of the fuse element is caused in the intermediate
state. As a result, scattering in the form of minute particles hardly occurs. The
reason why, contrary to the above-mentioned usual technique, dispersion of the operating
temperature of a thermal fuse can be suppressed to a low level even in an alloy composition
of a wide solid-liquid coexisting region is estimated as follows. Referring to DSC
measurement results shown in Figs. 8 to 10, the surface tension of a state in the
vicinity of the peak p that is the terminal of a process in which a change from the
solid phase to the liquid phase rapidly advances reaches a low one necessary for the
spheroid division of the fuse element, even before the liquidification process reaches
the end (the liquidus temperature).
Summary of the Invention
[0008] It is an object of the invention to, based on the finding, provide an alloy type
thermal fuse in which a Bi-Sn alloy is used as a fuse element, which has an operating
temperature of about 140°C, which, even when used at a high power, can safely operate,
and in which dispersion of the operating temperature can be sufficiently reduced,
and also a material for an alloy thermal fuse element.
[0009] The material for a thermal fuse element of a first aspect of the invention has an
alloy composition in which Bi is larger than 50% and 56% or smaller, and a balance
is Sn.
[0010] In the material for a thermal fuse element of a second aspect of the invention, 0.1
to 7.0 weight parts, preferably, 0.1 to 3.5 weight parts of one, or two or more elements
selected from the group consisting of Ag, Au, Cu, Ni, Pd, Pt, Ga, and Ge are added
to 100 weight parts of the alloy composition of the first aspect of the invention.
[0011] The materials for a thermal fuse element are allowed to contain inevitable impurities
which are produced in productions of metals of raw materials and also in melting and
stirring of the raw materials, and which exist in an amount that does not substantially
affect the characteristics. In the alloy type thermal fuses, a minute amount of a
metal material or a metal film material of the lead conductors or the film electrodes
is caused to inevitably migrate into the fuse element by solid phase diffusion, and,
when the characteristics are not substantially affected, allowed to exist as inevitable
impurities.
[0012] In the alloy type thermal fuse of a third aspect of the invention, the material for
a thermal fuse element of the first or second aspect of the invention is used as a
fuse element.
[0013] The alloy type thermal fuse of a fourth aspect of the invention is characterized
in that, in the alloy type thermal fuse of the third aspect of the invention, the
fuse element contains inevitable impurities.
[0014] The alloy type thermal fuse of a fifth aspect of the invention is an alloy type thermal
fuse in which, in the alloy type thermal fuse of the third or fourth aspect of the
invention, the fuse element is connected between lead conductors, and at least a portion
of each of the lead conductors which is bonded to the fuse element is covered with
a Sn or Ag film.
[0015] The alloy type thermal fuse of a sixth aspect of the invention is an alloy type thermal
fuse in which, in the alloy type thermal fuse of any one of the third to fifth aspects
of the invention, lead conductors are bonded to ends of the fuse element, respectively,
a flux is applied to the fuse element, the flux-applied fuse element is passed through
a cylindrical case, gaps between ends of the cylindrical case and the lead conductors
are sealingly closed, ends of the lead conductors have a disk-like shape, and ends
of the fuse element are bonded to front faces of the disks.
[0016] The alloy type thermal fuse of a seventh aspect of the invention is an alloy type
thermal fuse in which, in the alloy type thermal fuse of the third or fourth aspect
of the invention, a pair of film electrodes are formed on a substrate by printing
conductive paste containing metal particles and a binder, the fuse element is connected
between the film electrodes, and the metal particles are made of a material selected
from the group consisting of Ag, Ag-Pd, Ag-Pt, Au, Ni, and Cu.
[0017] The alloy type thermal fuse of an eighth aspect of the invention is an alloy type
thermal fuse in which, in the alloy type thermal fuse of any one of the third to seventh
aspects of the invention, a heating element for fusing off the fuse element is additionally
disposed.
Brief Description of the Drawings
[0018]
Fig. 1 is a view showing an example of the alloy type thermal fuse of the invention;
Fig. 2 is a view showing another example of the alloy type thermal fuse of the invention;
Fig. 3 is a view showing a further example of the alloy type thermal fuse of the invention;
Fig. 4 is a view showing a still further example of the alloy type thermal fuse of
the invention;
Fig. 5 is a view showing a still further example of the alloy type thermal fuse of
the invention;
Fig. 6 is a view showing an alloy type thermal fuse of the cylindrical case type and
its operation state;
Fig. 7 is a view showing a still further example of the alloy type thermal fuse of
the invention;
Fig. 8 is a view showing a DSC curve of a fuse element of Example 1;
Fig. 9 is a view showing a DSC curve of a fuse element of Example 2;
Fig. 10 is a view showing a DSC curve of a fuse element of Example 4;
Fig. 11 is a view showing a DSC curve of a fuse element of Comparative Example 2;
and
Fig. 12 is a view showing a DSC curve of a fuse element of Comparative Example 3.
Detailed Description of the Preferred Embodiments
[0019] In the invention, a fuse element of a circular wire or a flat wire is used. The outer
diameter or the thickness is set to 100 to 800 µm, preferably, 300 to 600 µm.
[0020] The reason why, in the first aspect of the invention, the fuse element has an alloy
composition of 50% < weight of Bi ≤ 56%, and the balance Sn is as follows. In order
to eliminate an element harmful to a living body, the first aspect premises the use
of a Bi-Sn alloy. As apparent from the DSC measurement results shown in Figs. 11 and
12, when Bi is 50% or smaller, the solid-liquid coexisting region is excessively wide,
and dispersion of the operating temperature is larger than ±3°C . When Bi is larger
than 56%, the difference with respect to the eutectic composition (57% Bi, balance
Sn) is excessively small, and spheroid division of the thermal fuse element occurs
in a substantially complete liquid phase state. Therefore, scattering of minute particles
of the alloy together with a charred flux produced by an arc due to an operation easily
occurs, and a follow current is readily produced after the arc in the division. As
a result, the possibility that an abnormal mode occurs at an operation of a thermal
fuse is increased. When the amount of Bi is increased to exceed that (57%) of the
eutectic composition and the composition is deviated from the eutectic composition,
the specific resistance is increased, and the workability is suddenly impaired.
[0021] As apparent from Figs. 8 to 10 showing results of DSC measurements of a Bi-Sn alloy
composition which is useful as a fuse element in the invention, the alloy begins to
melt at about 137°C, and reaches an endothermic peak at about 140°C. In this case,
a predetermined surface tension S necessary for the spheroid division of the fuse
element is attained in the vicinity of the peak p, and a division operation is performed.
As a result, the operating temperature is about 140°C. It is estimated that the scattering
of minute particles of molten alloy is satisfactorily suppressed by the relatively
high viscosity due to the surface tension S.
By contrast, in the eutectic composition, because of the time scale of the spheroid
division speed of the fuse element, the spheroid division is performed in a state
of a surface tension which is lower than the predetermined surface tension S, without
substantially passing through the state of the predetermined surface tension S. It
is therefore estimated that the scattering of minute particles of molten alloy easily
occurs.
In the case where Bi is 50% or smaller, the state of the predetermined surface
tension S is attained at a middle of a shoulder w on the liquid phase side in the
DSC measurement results of Figs. 11 and 12. Since the shoulder is wide, the division
enabled range extending from the timing when the predetermined surface tension S is
attained, to the liquidus temperature is broad. As a result, it is estimated that
dispersion of the operating temperature is increased.
[0022] In the invention, 0.1 to 7.0 weight parts, preferably, 0.1 to 3.5 weight parts of
one, or two or more elements selected from the group consisting of Ag, Au, Cu, Ni,
Pd, Pt, Ga, and Ge are added to 100 weight parts of the alloy composition, in order
to appropriately widen the solid-liquid coexisting region to improve the overload
characteristic and the dielectric breakdown characteristic, and also to reduce the
specific resistance of the alloy and improve the mechanical strength. When the addition
amount is smaller than 0.1 weight parts, the effects cannot be sufficiently attained,
and, when the addition amount is larger than 7.0 weight parts, preferably, 3.5 weight
parts, the above-mentioned melting characteristic is hardly maintained.
With respect to a drawing process, further enhanced strength and ductility are
provided so that drawing into a thin wire of 100 to 300 µmφ can be easily conducted.
Furthermore, the fuse element can be made tackless, so that superficial bonding due
to the cohesive force of the fuse element can be eliminated. Therefore, the accuracy
of the acceptance criterion in a test after weld bonding of the fuse element can be
improved.
It is known that a to-be-bonded material such as a metal material of the lead conductors,
a thin-film material, or a particulate metal material in the film electrode migrates
into the fuse element by solid phase diffusion. When the same element as the to-be-bonded
material, such as Ag, Au, Cu, or Ni is previously added to the fuse element, the migration
can be suppressed. Therefore, an influence of the to-be-bonded material which may
originally affect the characteristics (for example, Ag, Au, or the like causes local
reduction or dispersion of the operating temperature due to the lowered melting point,
and Cu, Ni, or the like causes dispersion of the operating temperature or an operation
failure due to an increased intermetallic compound layer formed in the interface between
different phases) is eliminated, and the thermal fuse can be assured to normally operate,
without impairing the function of the fuse element.
[0023] The fuse element of the alloy type thermal fuse of the invention can be usually produced
by a method in which a billet is produced, the billet is extrusively shaped into a
stock wire by an extruder, and the stock wire is drawn by a dice to a wire. The outer
diameter is 100 to 800 µmφ, preferably, 300 to 600 µmφ. The wire can be finally passed
through calender rolls so as to be used as a flat wire.
Alternatively, the fuse element may be produced by the rotary drum spinning method
in which a cylinder containing cooling liquid is rotated, the cooling liquid is held
in a layer-like manner by a rotational centrifugal force, and a molten material jet
ejected from a nozzle is introduced into the cooling liquid layer to be cooled and
solidified, thereby obtaining a thin wire member.
In the production, the alloy composition is allowed to contain inevitable impurities
which are produced in productions of metals of raw materials and also in melting and
stirring of the raw materials.
[0024] The invention may be implemented in the form of a thermal fuse serving as an independent
thermoprotector. Alternatively, the invention may be implemented in the form in which
a thermal fuse element is connected in series to a semiconductor device, a capacitor,
or a resistor, a flux is applied to the element, the flux-applied fuse element is
placed in the vicinity of the semiconductor device, the capacitor, or the resistor,
and the fuse element is sealed together with the semiconductor device, the capacitor,
or the resistor by means of resin mold, a case, or the like.
[0025] Fig. 1 shows an alloy type thermal fuse of the cylindrical case type according to
the invention. A fuse element 2 of the first or second aspect of the invention is
connected between a pair of lead conductors 1 by, for example, welding. A flux 3 is
applied to the fuse element 2. The flux-applied fuse element is passed through an
insulating tube 4 which is excellent in heat resistance and thermal conductivity,
for example, a ceramic tube. Gaps between the ends of the insulating tube 4 and the
lead conductors 1 are sealingly closed by a sealing agent 5 such as a cold-setting
epoxy resin.
[0026] Fig. 2 shows a fuse of the radial case type. A fuse element 2 of claim 1 or 2 of
the invention is connected between tip ends of parallel lead conductors 1 by, for
example, welding. A flux 3 is applied to the fuse element 2. The flux-applied fuse
element is enclosed by an insulating case 4 in which one end is opened, for example,
a ceramic case. The opening of the insulating case 4 is sealingly closed by sealing
agent 5 such as a cold-setting epoxy resin.
[0027] Fig. 3 shows a fuse of the radial resin dipping type. A fuse element 2 of claim 1
or 2 of the invention is bonded between tip ends of parallel lead conductors 1 by,
for example, welding. A flux 3 is applied to the fuse element 2. The flux-applied
fuse element is dipped into a resin solution to seal the element by an insulative
sealing agent such as an epoxy resin 5.
[0028] Fig. 4 shows a fuse of the substrate type. A pair of film electrodes 1 are formed
on an insulating substrate 4 such as a ceramic substrate by printing conductive paste.
Lead conductors 11 are connected respectively to the electrodes 1 by, for example,
welding or soldering. A fuse element 2 of claim 1 or 2 of the invention is bonded
between the electrodes 1 by, for example, welding. A flux 3 is applied to the fuse
element 2. The flux-applied fuse element is covered with a sealing agent 5 such as
an epoxy resin. The conductive paste contains metal particles and a binder. For example,
Ag, Ag-Pd, Ag-Pt, Au, Ni, or Cu may be used as the metal particles, and a material
containing a glass frit, a thermosetting resin, and the like may be used as the binder.
[0029] In the alloy type thermal fuses, in the case where Joule's heat of the fuse element
is negligible, the temperature Tx of the fuse element when the temperature of the
appliance to be protected reaches the allowable temperature Tm is lower than Tm by
2 to 3°C, and the melting point of the fuse element is usually set to [Tm - (2 to
3°C)].
[0030] The invention may be implemented in the form in which a heating element for fusing
off the fuse element is additionally disposed on the alloy type thermal fuse. As shown
in Fig. 5, for example, a conductor pattern 100 having fuse element electrodes 1 and
resistor electrodes 10 is formed on the insulating substrate 4 such as a ceramic substrate
by printing conductive paste, and a film resistor 6 is disposed between the resistor
electrodes 10 by applying and baking resistance paste (e.g., paste of metal oxide
powder such as ruthenium oxide). A fuse element 2 of claim 1 or 2 of the invention
is bonded between the fuse element electrodes 1 by, for example, welding. A flux 3
is applied to the fuse element 2. The flux-applied fuse element 2 and the film resistor
6 are covered with a sealing agent 5 such as an epoxy resin.
In the fuse having an electric heating element, a precursor causing abnormal heat
generation of an appliance is detected, the film resistor is energized to generate
heat in response to a signal indicative of the detection, and the fuse element is
fused off by the heat generation.
The heating element may be disposed on the upper face of an insulating substrate.
A heat-resistant and thermal-conductive insulating film such as a glass baked film
is formed on the heating element. A pair of electrodes are disposed, flat lead conductors
are connected respectively to the electrodes, and the fuse element is connected between
the electrodes. A flux covers a range over the fuse element and the tip ends of the
lead conductors. An insulating cover is placed on the insulating substrate, and the
periphery of the insulating cover is sealingly bonded to the insulating substrate
by an adhesive agent.
[0031] Among the alloy type thermal fuses, those of the type in which the fuse element is
directly bonded to the lead conductors (Figs. 1 to 3) may be configured in the following
manner. At least portions of the lead conductors where the fuse element is bonded
are covered with a thin film of Sn or Ag (having a thickness of, for example, 15 µm
or smaller, preferably, 5 to 10 µm) (by plating or the like), thereby enhancing the
bonding strength with respect to the fuse element.
In the alloy type thermal fuses, there is a possibility that a metal material or
a thin film material in the lead conductors, or a particulate metal material in the
film electrode migrates into the fuse element by solid phase diffusion. As described
above, however, the characteristics of the fuse element can be sufficiently maintained
by previously adding the same element as the thin film material into the fuse element.
[0032] As the flux, a flux having a melting point which is lower than that of the fuse element
is generally used. For example, useful is a flux containing 90 to 60 weight parts
of rosin, 10 to 40 weight parts of stearic acid, and 0 to 3 weight parts of an activating
agent. In this case, as the rosin, a natural rosin, a modified rosin (for example,
a hydrogenated rosin, an inhomogeneous rosin, or a polymerized rosin), or a purified
rosin thereof can be used. As the activating agent, hydrochloride or hydrobromide
of an amine such as diethylamine, or an organic acid such as adipic acid can be used.
[0033] Among the above-described alloy type thermal fuses, in the fuse of the cylindrical
case type, the arrangement in which the lead conductors 1 are placed so as not to
be eccentric to the cylindrical case 4 as shown in (A) of Fig. 6 is a precondition
to enable the normal spheroid division shown in (B) of Fig. 6. When the lead conductors
are eccentric as shown in (C) of Fig. 6, the flux (including a charred flux) and scattered
alloy portions easily adhere to the inner wall of the cylindrical case after an operation
as shown in (D) of Fig. 6. As a result, the insulation resistance is lowered, and
the dielectric breakdown characteristic is impaired.
In order to prevent such disadvantages from being produced, as shown in (A) of
Fig. 7, a configuration is effective in which ends of the lead conductors 1 are formed
into a disk-like shape d, and ends of the fuse element 2 are bonded to the front faces
of the disks d, respectively (by, for example, welding). The outer peripheries of
the disks are supported by the inner face of the cylindrical case, and the fuse element
2 is positioned so as to be substantially concentrical with the cylindrical case 4
[in (A) of Fig. 7, 3 denotes a flux applied to the fuse element 2, 4 denotes the cylindrical
case, 5 denotes a sealing agent such as an epoxy resin, and the outer diameter of
each disk is approximately equal to the inner diameter of the cylindrical case]. In
this instance, as shown in (B) of Fig. 7, molten portions of the fuse element spherically
aggregate on the front faces of the disks d, thereby preventing the flux (including
a charred flux) and the scattered alloy from adhering to the inner face of the case
4.
[Examples]
[0034] In the following examples and comparative examples, alloy type thermal fuses of the
cylindrical case type having an AC rating of 5 A × 250 V were used. The fuses have
the following dimensions. The outer diameter of a cylindrical ceramic case is 3.3
mm, the thickness of the case is 0.5 mm, the length of the case is 11.5 mm, a lead
conductor is a Sn plated annealed copper wire of an outer diameter of 1.0 mmφ, and
the outer diameter and length of a fuse element are 1.0 mmφ and 4.0 mm, respectively.
A compound of 80 weight parts of natural rosin, 20 weight parts of stearic acid, and
1 weight part of hydrobromide of diethylamine was used as the flux. A cold-setting
epoxy resin was used as a sealing agent.
The solidus and liquidus temperatures of a fuse element were measured by a DSC
at a temperature rise rate of 5°C/min.
[0035] Fifty specimens were used. Each of the specimens was immersed into an oil bath in
which the temperature was raised at a rate of 1°C/min., while supplying a detection
current of 0.1 A to the specimen, and the temperature T0 of the oil when the current
supply was interrupted by blowing-out of the fuse element was measured. A temperature
of T0 - 2°C was determined as the operating temperature of the thermal fuse element.
[0036] An abnormal mode at an operation of the thermal fuse was evaluated on the basis of
the overload test method and the dielectric breakdown test method defined in IEC 60691
(the humidity test before the overload test was omitted).
Specifically, existence of destruction or physical damage at an operation was checked.
While a voltage of 1.1 × the rated voltage and a current of 1.5 × the rated current
were applied to a specimen, and the thermal fuse was caused to operate by raising
the environmental temperature at a rate of (2 ± 1) K/min. Among specimens in which
destruction or damage did not occur, those in which the insulation between lead conductors
withstood 2 × the rated voltage (500 V) for 1 min., and that between the lead conductors
and a metal foil wrapped around the fuse body after an operation withstood 2 × the
rated voltage + 1,000 V (1,500 V) for 1 min. were judged acceptable with respect to
the dielectric breakdown characteristic, and those in which the insulation resistance
between the lead conductors when a DC voltage of 2 × the rated voltage (500 V) was
applied was 0.2 MΩ or higher, and that between the lead conductors and the metal foil
wrapped around the fuse body after an operation was 2 MΩ or higher were judged acceptable
with respect to the insulation resistance. Acceptance with respect to both the dielectric
breakdown characteristic and the insulation characteristic was set as the acceptance
criterion for the insulation stability. When 50 specimens were used and all of the
50 specimens were accepted with respect to the insulation stability, the specimens
were evaluated as O, and, when even one of the specimens was not accepted, the specimens
were evaluated as ×.
[Example 1]
[0037] A composition of 53% Bi and the balance Sn was used as that of a fuse element. A
fuse element was produced by a process of drawing to 300 µmφ under the conditions
of an area reduction per dice of 6.5%, and a drawing speed of 50 m/min. As a result,
excellent workability was attained while no breakage occurred and no constricted portion
was formed.
Fig. 8 shows a result of the DSC measurement. The solidus temperature was 138°C,
the liquidus temperature was 159°C, and the maximum endothermic peak temperature was
140.0°C.
The fuse element temperature at an operation of a thermal fuse was 141 ± 1°C. Therefore,
it is apparent that the fuse element temperature at an operation of a thermal fuse
approximately coincides with the maximum endothermic peak temperature of 140.0°C.
Even when the overload test was conducted, the fuse element was able to operate
without involving any physical damage such as destruction. With respect to the dielectric
breakdown test after the operation, the insulation between lead conductors withstood
2 × the rated voltage (500 V) for 1 min. or longer, and that between the lead conductors
and a metal foil wrapped around the fuse body after the operation withstood 2 × the
rated voltage + 1,000 V (1,500 V) for 1 min. or longer. Therefore, the fuse element
was acceptable. With respect to the insulation characteristic, the insulation resistance
between the lead conductors when a DC voltage of 2 × the rated voltage (500 V) was
applied was 0.2 MΩ or higher, and that between the lead conductors and the metal foil
wrapped around the fuse body after an operation was 2 MΩ or higher. Both the resistances
were acceptable, and hence the insulation stability was evaluated as O.
The reason why the overload characteristic and the insulation stability after an
operation are excellent as described above is as follows. Even during the energization
and temperature rise, the division of the fuse element is performed in the solid-liquid
coexisting region. Therefore, scattering of minute particles of the molten alloy is
suppressed, and an arc is not generated at an operation, so that extreme temperature
rise hardly occurs. Consequently, pressure rise by vaporization of the flux and charring
of the flux due to the temperature rise can be suppressed, and physical destruction
does not occur, whereby a sufficient insulation distance can be ensured after division.
[Examples 2 to 4]
[0038] The examples were conducted in the same manner as Example 1 except that the alloy
composition in Example 1 was changed as listed in Table 1.
Fig. 9 shows a result of a DSC measurement of Example 2, and Fig. 10 shows a result
of a DSC measurement of Example 4.
The solidus and liquidus temperatures of the examples are shown in Table 1. The
fuse element temperatures at an operation are as shown in Table 1, have dispersion
of ± 2°C or smaller, and are in the solid-liquid coexisting region.
In the same manner as Example 1, both the overload characteristic and the insulation
stability are acceptable. The reason of this is estimated as follows. In the same
manner as Example 1, the fuse element is divided in a solid-liquid coexisting region.
In all the examples, good wire drawability was obtained in the same manner as Example
1.
Table 1
|
Ex. 2 |
Ex. 3 |
Ex. 4 |
Bi (%) |
51 |
54 |
56 |
Sn (%) |
Balance |
Balance |
Balance |
Solidus temperature (°C) |
137.3 |
137.2 |
137.1 |
Liquidus temperature (°C) |
160.1 |
157.6 |
152.4 |
Wire drawability |
Good |
Good |
Good |
Element temperature at operation (°C) |
142 ± 2 |
141 ± 1 |
140 ± 1 |
Overload characteristic |
Damage, etc. are not observed |
Damage, etc. are not observed |
Damage, etc. are not observed |
Insulation stability |
O |
O |
O |
[Example 5]
[0039] The example was conducted in the same manner as Example 1 except that an alloy composition
in which 1 weight part of Ag was added to 100 weight parts of the alloy composition
of Example 1 was used as that of a fuse element.
A wire member for a fuse element of 300 µmφ was produced under conditions in which
the area reduction per dice was 8% and the drawing speed was 80 m/min., and which
are severer than those of the drawing process of a wire member for a fuse element
in Example 1. However, no wire breakage occurred, and problems such as a constricted
portion were not caused, with the result that the example exhibited excellent workability.
The solidus temperature, the maximum endothermic peak temperature, and the fuse
element temperature at an operation of a thermal fuse are approximately identical
with those of Example 1. It was confirmed that the operating temperature and the melting
characteristic of Example 1 can be substantially held.
In the same manner as Example 1, even when the overload test was conducted, the
fuse element was able to operate without involving any physical damage such as destruction.
Therefore, the fuse element was acceptable. With respect to the dielectric breakdown
test after the operation, the insulation between lead conductors withstood 2 × the
rated voltage (500 V) for 1 min. or longer, and that between the lead conductors and
a metal foil wrapped around the fuse body after the operation withstood 2 × the rated
voltage + 1,000 V (1,500 V) for 1 min. or longer. Therefore, the fuse element was
acceptable. With respect to the insulation characteristic, the insulation resistance
between the lead conductors when a DC voltage of 2 × the rated voltage (500 V) was
applied was 0.2 MΩ or higher, and that between the lead conductors and the metal foil
wrapped around the fuse body after an operation was 2 MΩ or higher. Both the resistances
were acceptable, and hence the insulation stability was evaluated as O. Therefore,
it was confirmed that, in spite of addition of Ag, the good overload characteristic
and insulation stability can be held.
[0040] It was confirmed that the above-mentioned effects are obtained in the range of the
addition amount of 0.1 to 7.0 weight parts of Ag.
In the case where the metal material of the lead conductors to be bonded, a thin
film material, or a particulate metal material in the film electrode is Ag, it was
confirmed that, when the same element or Ag is previously added as in the example,
the metal material can be prevented from, after a fuse element is bonded, migrating
into the fuse element with time by solid phase diffusion, and local reduction or dispersion
of the operating temperature due to the lowered melting point can be eliminated.
[Examples 6 to 12]
[0041] The examples were conducted in the same manner as Example 1 except that an alloy
composition in which 0.5 weight parts of respective one of Au, Cu, Ni, Pd, Pt, Ga,
and Ge were added to 100 weight parts of the alloy composition of Example 1 was used
as that of a fuse element.
It was confirmed that, in the same manner as the metal addition of Ag in Example
5, also the addition of Au, Cu, Ni, Pd, Pt, Ga, or Ge realizes excellent workability,
the operating temperature and melting characteristic of Example 1 can be sufficiently
ensured, the good overload characteristic and insulation stability can be held, and
solid phase diffusion between metal materials of the same kind can be suppressed.
It was confirmed that the above-mentioned effects are obtained in the range of
the addition amount of 0.1 to 7.0 weight parts of respective one of Au, Cu, Ni, Pd,
Pt, Ga, and Ge.
[Comparative Example 1]
[0042] The comparative example was conducted in the same manner as Example 1 except that
the composition of the fuse element in Example 1 was changed to 57% Bi and the balance
Sn (eutectic) .
The workability was satisfactory. Since the solid-liquid coexisting region is substantially
zero, dispersion of the operating temperature at an operation was very small or 140
± 1°C. In the overload test and the dielectric breakdown test, however, breakage or
an insulation failure frequently occurred, with the result that the fuse can be hardly
used under the AC rating of 250 V and 5 A. The reason of this is estimated as follows.
At an operation, a fuse element is changed at once from the solid phase to the liquid
phase in which the surface tension is low, without substantially entering an intermediate
phase state. When the fuse element is fused off, therefore, the liquefied fuse element
is formed into minute particles, and the particles are scattered together with a charred
flux due to an arc at the operation. Many of the particles adhere to the inner wall
of an outer case, thereby causing the insulation distance after an operation not to
be maintained. As a result, the insulation distance after an operation cannot be held,
and the reconduction due to the high-voltage application or generation of a rearc
after reinterruption occurs.
[Comparative Example 2]
[0043] The comparative example was conducted in the same manner as Example 1 except that
the composition of the fuse element in Example 1 was changed to 49% Bi and the balance
Sn.
The workability was satisfactory. Fig. 11 shows a result of a DSC measurement.
As compared with the result of a DSC measurement of Example 2 shown in Fig. 9, the
shoulder w on the liquid phase side is considerably large. The fuse element temperature
at an operation extended over 139 to 147°C. As described above, it is estimated that
the excessive dispersion is caused by the large shoulder width of ) the solid-liquid
coexisting region on the liquid phase side.
[Comparative Example 3]
[0044] The comparative example was conducted in the same manner as Example 1 except that
the composition of the fuse element in Example 1 was changed to 47% Bi and the balance
Sn.
The workability was satisfactory. The fuse element temperature at an operation
extended over 139 to 158°C, and dispersion of the temperature was excessively large.
Fig. 12 shows a result of a DSC measurement. The shoulder w on the liquid phase side
is large. As described above, it is estimated that the excessive dispersion of the
operating temperature is caused by the large shoulder width of the solid-liquid coexisting
region on the liquid phase side.
[Effects of the Invention]
[0045] According to the material for a thermal fuse element and the thermal fuse of the
invention, it is possible to provide an alloy type thermal fuse in which a Bi-Sn alloy
not containing a metal harmful to the ecological system is used, and which is excellent
in overload characteristic, dielectric breakdown characteristic after an operation,
and insulation characteristic. Therefore, the invention is useful for a high power
rated thermal fuse.
According to the material for a thermal fuse element and the alloy type thermal
fuse of claim 2 of the invention, since a fuse element can be easily thinned because
of the excellent wire drawability of the material for a thermal fuse element, the
thermal fuse can be advantageously miniaturized and thinned. Even in the case where
an alloy type thermal fuse is configured by bonding a fuse element to a to-be-bonded
material which may originally exert an influence, a normal operation can be assured
while maintaining the performance of the fuse element.
According to the alloy type thermal fuses of claims 3 to 8 of the invention, particularly,
the above effects can be assured in a thermal fuse of the cylindrical case type, a
thermal fuse of the substrate type, a thermal fuse having an electric heating element,
and a thermal fuse or a thermal fuse having an electric heating element in which lead
conductors are plated by Ag or the like,, whereby a high power rating can be attained
in such a thermal fuse and a thermal fuse having an electric heating element.