(19)
(11) EP 1 600 517 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
14.12.2005 Bulletin 2005/50

(43) Date of publication A2:
30.11.2005 Bulletin 2005/48

(21) Application number: 05017191.7

(22) Date of filing: 16.11.1998
(51) International Patent Classification (IPC)7C22C 9/04, C22F 1/08
(84) Designated Contracting States:
BE DE FI FR GB IT SE

(30) Priority: 12.10.1998 JP 28859098

(62) Application number of the earlier application in accordance with Art. 76 EPC:
98953071.2 / 1045041

(71) Applicant: Sambo Copper Alloy Co., Ltd
Osaka 590-0906 (JP)

(72) Inventor:
  • Oishi, Keiichiro
    Sakai-shi Osaka 590-0906 (JP)

(74) Representative: Brown, Fraser Gregory James et al
fJ Cleveland 40-43 Chancery Lane
London WC2A 1JQ
London WC2A 1JQ (GB)

   


(54) Lead-free, free-cutting copper alloys


(57) The present invention relates to lead free, free cutting copper alloys and methods of their manufacture. In particular, the present invention is directed to a lead-free, free-cutting copper alloy which comprises 69 to 79 percent, by weight, of copper; 2.0 to 4.0 percent, by weight, of silicon; and the remaining percent, by weight, of zinc and wherein the metal structure of the free cutting copper alloy has at least one phase selected from the γ (gamma) phase and the κ (kappa) phase.







Search report