| (19) |
 |
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(11) |
EP 2 141 261 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
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28.07.2010 Bulletin 2010/30 |
| (43) |
Date of publication A2: |
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06.01.2010 Bulletin 2010/01 |
| (22) |
Date of filing: 16.03.2009 |
|
| (51) |
International Patent Classification (IPC):
|
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| (84) |
Designated Contracting States: |
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AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO
PL PT RO SE SI SK TR |
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Designated Extension States: |
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AL BA RS |
| (30) |
Priority: |
12.06.2008 JP 2008154461
|
| (71) |
Applicant: Rohm and Haas Electronic Materials LLC |
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Marlborough, MA 01752 (US) |
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| (72) |
Inventors: |
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- Imanari, Masaaki
Misato-City Saitama 341-0026 (JP)
- Ting, Fai Lung
Tin Shiu Wai, New Territories Hong Kong (CN)
- Shimazu, Motoya
Saitama-city Saitama 331-0814 (JP)
- Ohta, Yasuo
Shinagawa-ku Tokyo 142-0063 (JP)
|
| (74) |
Representative: Kent, Venetia Katherine |
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Patent Outsourcing Limited
1 King Street
Bakewell
Derbyshire DE 45 1DZ
Bakewell
Derbyshire DE 45 1DZ (GB) |
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| (54) |
Electrolytic Tin Plating Solution and Electrolytic Tin Plating Method |
(57) A plating solution and a plating method, which does not use a complexing agent and
which provides favorable solder wetting properties and an extremely low coupling rate
when electrolytic tin plating is performed, and particularly when electrolytic tin
plating is performed using a barrel plating method.