(19)
(11) EP 2 019 572 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
20.10.2010 Bulletin 2010/42

(43) Date of publication A2:
28.01.2009 Bulletin 2009/05

(21) Application number: 08013359.8

(22) Date of filing: 24.07.2008
(51) International Patent Classification (IPC): 
H05K 3/00(2006.01)
 H01L 23/538(2006.01)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated Extension States:
AL BA MK RS

(30) Priority: 25.07.2007 JP 2007193844

(71) Applicant: TDK Corporation
Tokyo 103-8272 (JP)

(72) Inventors:
  • Kanemaru, Yoshikazu
    Tokyo 103-8272 (JP)
  • Kawabata, Kenichi
    Tokyo 103-8272 (JP)

(74) Representative: Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät 
Leopoldstrasse 4
80802 München
80802 München (DE)

   


(54) Assembly substrate and method of manufacturing the same


(57) The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work board 100 includes an insulating layer 21 on one surface of a substantially rectangular-shaped substrate 11, and electronic components 41 and a plate-like integrated frame 51 are embedded inside the insulating layer 21. The plate-like integrated frame 51 has a plurality of concave portions 53 arranged in parallel at its inner periphery wall 52a, and arranged on a non-placing area of the electronic components 41 so as to surround a plurality of the electronic components 41 (groups).







Search report