TECHNICAL FIELD
[0001] The present invention generally relates to semiconductor integrated circuits and
power supply voltage control methods, and more particularly to a semiconductor integrated
circuit having a power supply voltage monitoring circuit and to a power supply voltage
control method for controlling a power supply voltage that is supplied to such a semiconductor
integrated circuit.
BACKGROUND ART
[0002] FIG. 1 is a diagram for explaining an example of a conventional power supply voltage
control method. In FIG. 1, a LSI (Large Scale Integrated circuit) 1 includes a power
line 2 that has a resistance an inductance and a capacitance, and transistors 3. A
DC-DC converter 5 that converts a DC (Direct Current) input voltage into a predetermined
DC output voltage supplies a converted power supply voltage VDD to the LSI 1 via a
power line 6 that includes a resistance, inductance and a capacitance. In FIG. 1,
GND denotes the ground. In this example, a voltage at a power supply input terminal
of the LSI 1, that is, an analog voltage signal, is fed back to the DC-DC converter
5 in order to control the power supply voltage VDD.
[0003] In the example illustrated in FIG. 1, the voltage at the power supply input terminal
of the LSI 1 is monitored and fed back to the DC-DC converter 5. Because a feedback
loop does not necessarily stabilize, the power supply voltage that is actually applied
to the transistors 3 within the LSI 1 may be unknown. Consequently, it is difficult
to control the power supply voltage that is applied to the transistors 3 within the
LSI 1 to a constant voltage.
[0004] It is conceivable to provide a dedicated line exclusively for monitoring the power
supply voltage that is actually applied to the transistors 3 within the LSI 1. But
in this case, a fluctuation in the power supply voltage at a high frequency may not
be monitored unless the resistance of the dedicated line is reduced to a sufficiently
small resistance. In addition, when the dedicated line is provided, it is necessary
to separately provide on a package of the LSI 1 a terminal (that is, a signal pin)
exclusively for the voltage monitoring. Furthermore, when a voltage monitoring point
is provided at a central part within the LSI 1, it is necessary to route the signal
lines within the package so as not to interfere with existing lines. Consequently,
the degree of freedom of layout within the package of the LSI 1 deteriorates, and
the area occupied by the lines increases to thereby limit the area in which circuit
elements such as the transistors 3 may be provided within the LSI 1.
Patent Document 1: Japanese Laid-Open Patent Publication No.2004-228104
Patent Document 2: Japanese Laid-Open Patent Publication No.2008-72045
DISCLOSURE OF THE INVENTION
PROBLEM TO BE SOLVED BY THE INVENTION
[0005] According to the conventional power supply voltage control method, there was a problem
in that it is difficult to control the power supply voltage constant within the LSI
using a relatively simple structure, without increasing the number of terminals of
the LSI package.
[0006] Accordingly, one object of the present invention is to provide a semiconductor integrated
circuit and a power supply voltage control method which may control the power supply
voltage constant within the semiconductor integrated circuit using a relatively simple
structure, without increasing the number of terminals of the semiconductor integrated
circuit.
MEANS OF SOLVING THE PROBLEM
[0007] According to one aspect of the present invention, a semiconductor integrated circuit
includes a first selector that selectively outputs one of a power supply voltage supplied
from an outside of the semiconductor integrated circuit and a predetermined reference
voltage to a monitoring target voltage terminal depending on an adjusting mode signal;
a voltage monitoring circuit that monitors a voltage fluctuation at the monitoring
target voltage terminal and converts the voltage fluctuation that is monitored into
a digital signal; and an input and output circuit that outputs the digital signal
to the outside of the semiconductor integrated circuit.
[0008] According to another aspect of the present invention, a power supply voltage control
method for controlling a power supply voltage supplied from a power supply control
circuit to a semiconductor integrated circuit, the power supply voltage control method
including switching a first selector within the semiconductor integrated circuit depending
on an adjusting mode signal in order to selectively output to a monitoring target
voltage terminal a predetermined reference voltage during a circuit adjusting period
and the power supply voltage during a voltage monitoring period; converting into a
digital signal a voltage fluctuation monitored at the monitoring target voltage terminal
by a voltage monitoring circuit within the semiconductor integrated circuit; and controlling
the power supply voltage output from the voltage control circuit by outputting the
digital signal from an input and output circuit within the semiconductor integrated
circuit to the voltage control circuit.
EFFECTS OF THE INVENTION
[0009] According to the semiconductor integrated circuit and the power supply voltage control
method that are disclosed herein, the power supply voltage within the semiconductor
integrated circuit may be controlled constant using a relatively simple structure,
without increasing the number of terminals of the semiconductor integrated circuit.
BRIEF DESCRIPTION OF THE DRAWING
[0010]
FIG. 1 is a diagram for explaining an example of a conventional power supply voltage
control method;
FIG. 2 is a diagram for explaining a power supply voltage control method in an embodiment
of the present invention;
FIG. 3 is a diagram for explaining an example of a semiconductor integrated circuit;
FIG. 4 is a diagram for explaining an example of an adjusting circuit illustrated
in FIG. 3;
FIG. 5 is a flow chart for explaining an operation of the semiconductor integrated
circuit illustrated in FIG. 3;
FIG. 6 is a timing chart for explaining the operation of the semiconductor integrated
circuit illustrated in FIG. 3;
FIG. 7 is a diagram for explaining another example of the semiconductor integrated
circuit;
FIG. 8 is a diagram for explaining an example of an adjusting circuit illustrated
in FIG. 7;
FIG. 9 is a flow chart for explaining an operation of the semiconductor integrated
circuit illustrated in FIG. 7;
FIG. 10 is a timing chart for explaining the operation of the semiconductor integrated
circuit illustrated in FIG. 7;
FIG. 11 is a diagram for explaining another example of the semiconductor integrated
circuit; and
FIG. 12 is a diagram for explaining another example of the semiconductor integrated
circuit.
DESCRIPTION OF THE REFERENCE NUMERALS
[0011]
- 2, 6
- Power Line
- 3
- Transistor
- 11, 11-1 to 11-3, 11-41, 11-42
- LSI
- 12, 12-1, 12-2, 12-21 to 12-4n
- Voltage Monitoring Circuit
- 13
- Input and Output Circuit
- 21, 31
- Voltage Control Circuit
- 61
- Signal Processing Circuit
- 111
- Regulator
- 112
- Selector
- 113
- Voltage Generating Circuit
- 114-1, 114-2
- Adjusting Circuit
BEST MODE OF CARRYING OUT THE INVENTION
[0012] According to the semiconductor integrated circuit and the power supply voltage control
method that are disclosed herein, a power supply control circuit controls a power
supply voltage supplied to the semiconductor integrated circuit. A selector within
the semiconductor integrated circuit is switched depending on an adjusting mode signal
in order to selectively output a predetermined reference voltage during a circuit
adjusting period and to selectively output the power supply voltage during a voltage
monitoring period, to be supplied to a monitoring target voltage terminal. A voltage
fluctuation at the monitoring target voltage terminal is monitored by a voltage monitoring
circuit within the semiconductor integrated circuit, and the monitored voltage fluctuation
is output after being converted into a digital signal. The digital signal is output
from an input and output circuit to a voltage control circuit within the semiconductor
integrated circuit to the voltage control circuit, in order to control a power supply
voltage output from the voltage control circuit.
[0013] The input and output circuit may selectively output scan data prescribed by the IEEE1149.1
JTAG (Joint Test Action Group) standard, for example, when performing a test, and
may output the digital signal during a normal operation. Accordingly, the power supply
voltage within the semiconductor integrated circuit may be controlled constant using
a relatively simple structure, without increasing the number of terminals of the semiconductor
integrated circuit.
[0014] Next, a description will be given of the semiconductor integrated circuit and the
power supply voltage control method in each embodiment of the present invention, by
referring to FIG. 2 and the subsequent figures.
EMBODIMENTS
[0015] FIG. 2 is a diagram for explaining a power supply voltage control method in an embodiment
of the present invention. In FIG. 2, those parts that are substantially the same as
those corresponding parts in FIG. 1 are designated by the same reference numerals,
and a description thereof will be omitted.
[0016] In FIG. 2, a LSI (Large Scale Integrated circuit) 11 includes a power line 2 that
has a resistance, an inductance and a capacitance, transistors 3, a voltage monitoring
circuit 12, and an input and output (I/O) circuit 13. A voltage control circuit 21
supplies a power supply voltage VDD to the LSI 11 via a power line 6 that has a resistance,
an inductance and a capacitance. For example, the voltage control circuit 21 may be
formed by a DC-DC converter that converts an input DC voltage into a predetermined
output DC voltage. In FIG. 2, GND denotes the ground. In this example, the power supply
voltage applied to the transistors 3 within the LSI 11 is monitored by the voltage
monitoring circuit 12, and the power supply voltage VDD is controlled by feeding back
a voltage signal corresponding to the monitored power supply voltage to the voltage
control circuit 21 via the I/O circuit 13.
[0017] In the example illustrated in FIG. 2, the voltage monitoring circuit 12 monitors
a voltage fluctuation of the power supply voltage applied to the transistors 3 within
the LSI 11, and converts the monitored voltage fluctuation into a digital signal that
is output. This digital signal is output from the LSI 11 via the I/O circuit 13, in
a manner similar to a data signal, and is fed back to the voltage control circuit
21. For this reason, the power supply voltage applied to the transistors 3 within
the LSI 11 may be controlled constant, based on a monitored result of the power supply
voltage that is actually applied to the transistors 3 within the LSI 11.
[0018] A monitoring target voltage within the LSI 11, that is, the power supply voltage
applied to the transistors 3, a predetermined reference voltage, and a control signal
are input to the voltage monitoring circuit 12. In addition, the voltage monitoring
circuit 12 is connected to the ground GND, and outputs a voltage signal corresponding
to the monitoring target voltage or, a voltage state signal representing a state of
the monitoring target voltage. The voltage monitoring circuit 12 outputs the voltage
signal or the voltage state signal, indicating how high or how low the monitoring
target voltage is with respect to the predetermined reference voltage that is input
to the voltage monitoring circuit 12. The number of bits of the voltage signal or
the voltage stage signal output from the voltage monitoring circuit 12 determines
the resolution of the power supply voltage control. The control signal input to the
voltage monitoring circuit 12 is used to adjust inconsistencies in the characteristics,
sensitivities, and the like of the transistors within the voltage monitoring circuit
12 that may include PMOS (P-channel Metal Oxide Semiconductor) transistors and NMOS
(N-channel Metal Oxide Semiconductor) transistors.
[0019] According to the power supply voltage control method of FIG. 2, the fluctuation in
the power supply voltage actually applied to the transistors 3 within the LSI 11 may
be monitored, even in the case of a high-frequency fluctuation.
[0020] In addition, because the voltage signal or the voltage state signal output from the
voltage monitoring circuit 12 is a digital signal, the voltage signal or the voltage
state signal may be output outside the LSI 11 using the I/O circuit 13 that is originally
provided within the LSI 11. Furthermore, even when a plurality of voltage monitoring
points exist within the LSI 11, the voltage monitoring point may be switched by the
control signal that is input to the voltage monitoring circuit 12. Even if the voltage
monitoring point is located in a central part within the LSI 11, the wiring layout
within the package of the LSI 11 may be designed with ease by outputting the voltage
signal or the voltage state signal via the I/O circuit 13 that is located in a peripheral
part within the LSI 11. Moreover, by outputting the voltage signal or the voltage
state signal outside the LSI 11 via the I/O circuit 13 that is originally provided
within the LSI 11 for use when performing a test, the number of terminals (that is,
the number of signal pins) provided on the package of the LSI 11 may be reduced.
[0021] FIG. 3 is a diagram for explaining an example of a semiconductor integrated circuit.
In FIG. 3, those parts that are the same as those corresponding parts in FIG. 2 are
designated by the same reference numerals, and a description thereof will be omitted.
For the sake of convenience, the power supply lines 2 and 6 are not illustrated as
blocks and the illustration of the transistors 3 is omitted in FIG. 3 and FIGS. 7,
11 and 12 which will be described later.
[0022] A LSI 11-1 includes a regulator 111, a selector 112, a voltage generating circuit
113, an adjusting circuit 114-1, a voltage monitoring circuit 12-1, selectors 122-1
through 122-n, and an I/O circuit 13 that are connected as illustrated in FIG. 3.
The voltage monitoring circuit 12-1 includes a plurality of inverter circuits 120,
including PMOS transistors and NMOS transistors, and a plurality of buffers 121 for
shaping signal waveforms. For example, the selectors 112 and 122-1 through 122-n may
be formed by transfer gates.
[0023] A power supply voltage VDD output from a voltage control circuit (DC-DC converter)
21, and a predetermined reference voltage VDDref output from the regulator 111, are
input to the selector 112. Accordingly, the power supply voltage VDD from outside
the LSI 11-1 or the reference voltage VDDref from the regulator 111 is supplied to
a monitoring target voltage terminal VDDobs of the voltage monitoring circuit 12-1
via the selector 112. The regulator 111 generates the reference voltage VDDref and
a voltage VDDref/2 based on a voltage VDDH that is higher than the power supply voltage
VDD and is output from the voltage control circuit (DC-DC converter) 31, and supplies
the voltage VDDref/2 to the inverter circuits 120 of the voltage monitoring circuit
12-1.
[0024] The adjusting circuit 114-1 generates an adjusting mode signal AMS and a voltage
setting value VSV based on a clock signal CLK and voltage signals Sig
1 through Sign that are output from the buffers 121 of the voltage monitoring circuit
12-1, and supplies the adjusting mode signal AMS outside the LSI 11-1 and to the selector
112 as a selection signal. The adjusting circuit 114-1 supplies the voltage setting
value VSV to the voltage generating circuit 113.
[0025] The voltage generating circuit 113 generates control signals VBSp and VBSn based
on the voltage VDDH output from the voltage control circuit 31 and the voltage setting
value VSV output from the adjusting circuit 114-1, and supplies the control signals
VBSp and VBSn to the PMOS transistors and the NMOS transistors forming the inverter
circuits 120 of the voltage monitoring circuit 12-1 as control signals. The control
signal VBSp is applied as a back bias signal to the PMOS transistor of each inverter
circuit 120, and the control signal VBSn is applied as a back bias signal to the NMOS
transistor of each inverter circuit 120. A scan-in signal SIS is input to the LSI
11-1 and supplied to a known latch scan chain (not illustrated) within the LSI 11-1.
A scan data output (or test signal) SDO of the latch scan chain is supplied to one
input of each of the selectors 122-1 through 122-n, and the voltage signals Sig
1 through Sign output from the voltage monitoring circuit 12-1 are supplied to respective
other inputs of each of the selectors 122-1 through 122-n. A test mode signal TMS
is supplied, as a selection signal, to each of the selectors 122-1 through 122-n.
Outputs of the selectors 122-1 through 122-n are output from the LSI 11-1 via the
I/O circuit 13 and fed back to the voltage control circuit 21.
[0026] The plurality of inverter circuits 120 within the voltage monitoring circuit 12-1
have mutually different threshold voltages by varying β values of transistors in order
to vary outputs of the transistors, for example. In this example, the inverter circuits
120 located more towards the left side in FIG. 3 may more easily output a logic value
"1" (or a high level). The voltage of the monitoring target voltage terminal VDDobs
is applied to the transistors of each inverter circuit 120 as a power supply voltage.
In addition, the voltage VDDref/2 generated by the regulator 111 is applied to each
inverter circuit 120. Because the inverter circuit 120 located more towards the left
side in FIG. 3 may more easily output the logic value "1", the output pattern of the
plurality of inverter circuits 120 changes depending on the level of the power supply
voltage at the monitoring target voltage terminal VDDobs. An output waveform of each
inverter circuit 120 is shaped by the corresponding buffer 121. Hence, the shaped
voltage signals Sig
1 through Sign from the buffers 121 are output from the voltage monitoring circuit
12-1.
[0027] Because the number of input and output terminals of the LSI 11-1, that is, the number
of signal pins of the package of the LSI 11-1, is not increased in order to output
the voltage signals Sig
1 through Sign, the I/O circuit 13 that is originally used for the test signal only
when testing the LSI 11-1 and is not used during normal operation, may be used in
common for the voltage signals Sig
1 through Sig
n. In this example, the test signal is formed by the scan data output SDO (Scan Data
Output) of the parallel scan. The selectors 122-1 through 122-n are switched depending
on the test mode signal TMS to output the scan data output SDO or the voltage signals
Sig
1 through Sign. At the time of the testing, the test mode signal TMS has a logic value
"0", and the parallel scan data output SDO is supplied to the I/O circuit 13. On the
other hand, at the time of the normal operation, the test mode signal TMS has a logic
value "1", and the voltage signals Sig
1 through Sign are supplied to the I/O circuit 13.
[0028] In FIG. 3, the voltage monitoring is performed after adjusting the circuit in order
to absorb inconsistencies in the characteristics of individual LSIs 11-1. First, the
predetermined reference voltage VDDref is supplied to the monitoring target voltage
terminal VDDobs of the voltage monitoring circuit 12-1, and the voltages of the control
signals VBSp and VBSn generated by the voltage generating circuit 113 are adjusted
so that the output pattern of the voltage signals Sig
1 through Sign becomes ideal (for example, the pattern includes the same number of
logic value "0"s and logic value "1"s). The control signals VBSp and VBSn may be fixed
to the voltages after the adjustment. Then, the voltage supplied to the monitoring
target voltage terminal VDDobs is switched to the power supply voltage VDD before
starting the normal operation of the LSI 11-1, and the actual voltage at the monitoring
target voltage terminal VDDobs is monitored.
[0029] FIG. 4 is a diagram for explaining an example of the adjusting circuit 114-1 illustrated
in FIG. 3. The adjusting circuit 114-1 includes an inverter circuit 41, an OR circuit
42, a signal judging circuit 43-1, a scan latch 44 for retaining a voltage setting
value, and a scan latch 45 for retaining and adjusting mode, that are connected as
illustrated in FIG. 4.
[0030] The value of the scan latch 45 is set to a logic value "1" indicating the adjusting
mode, and the value of the scan latch 44 is set to an initial value, by the scan.
In this state, the selector 112 selectively outputs the predetermined reference voltage
VDDref from the regulator 111 depending on the adjusting mode signal AMS. The signal
judging circuit 43-1 judges whether the voltage signals Sig
1 through Sign have the setting values (for example, the same number of logic value
"0"s and logic value "1"s), and outputs a next voltage setting value NVS and an adjustment
judging signal AJS. The next voltage setting value NVS and the adjustment judging
signal AJS are input to the scan latch 44 and the scan latch 45 every time the clock
signal CLK is applied thereto. The next voltage setting value NVS changes the setting
values in order to increase the voltages of the control signals VBSp and VBSn when
the number of logic value "1"s is larger and to decrease the voltages of the control
signals VBSp and VBSn when the number of logic value "0"s is larger as a result of
comparing the setting value and the values of the voltage signals Sig
1 through Sign. In this example, the adjustment judging signal AJS output from the
signal judging circuit 43-1 assumes the logic value "0" when the setting value and
the values of the voltage signals Sig
1 through Sign match, and otherwise assumes the logic value "1".
[0031] When the value of the scan latch 45 assumes the logic value "0", the clock signal
CLK to the scan latches 44 and 45 within the adjusting circuit 114-1 are disabled.
In addition, a completion of the adjustment may be judged from the adjusting mode
signal AMS that is output from the LSI 11-1 to the outside.
[0032] FIG. 5 is a flow chart for explaining an operation of the semiconductor integrated
circuit illustrated in FIG. 3. In FIG. 5, a step S1 selectively outputs the voltage
signals Sig
1 through Sign from the selectors 122-1 through 122-n depending on the test mode signal
TMS. A step S2 selectively outputs the predetermined reference voltage VDDref from
the selector 112 depending on the adjusting mode signal AMS. A step S3 sets an initial
state by setting the voltage of the control signal VBSn with respect to the power
supply voltage VDD to 0, and setting the voltage of the control signal VBSp with respect
to the ground GND to 0. A step S4 monitors the voltage signals Sig
1 through Sign by the adjusting circuit 114-1. A step S5 judges whether the voltage
signals Sig
1 through Sign have an estimated pattern. The process advances to a step S6 if the
judgement result in the step S5 is NO, and the process advances to a step S7 if the
judgement result in the step S5 is YES. The step S6 controls the voltage generating
circuit 113 by the adjusting circuit 114-1, and decreases the voltages of the control
signals VBSn and VBSp when the pattern of the voltage signals Sig
1 through Sign includes a larger number of logic value "0"s than the estimated pattern,
and increases the voltages of the control signals VBSn and VBSp when the pattern of
the voltage signals Sig
1 through Sign includes a larger number of logic value "1"s than the estimated pattern.
The process returns to the step S4 after the step S6.
[0033] On the other hand, the step S7 selectively outputs the power supply voltage VDD from
the selector 112 depending on the adjusting mode signal AMS. A step S8 causes the
LSI 11-1 to perform a normal operation. A step S9 monitors the voltage signals Sig
1 through Sign by the adjusting circuit 114-1. A step S10 judges whether the voltage
signals Sig
1 through Sign have the estimated pattern. The process advances to a step S11 if the
judgement result in the step S10 is NO, and the process returns to the step S9 if
the judgement result in the step S10 is YES. The step S11 controls the voltage control
circuit 21 by the output of the LSI 11-1, and increases the power supply voltage VDD
when the pattern of the voltage signals Sig
1 through Sign includes a larger number of logic value "0"s than the estimated pattern,
and decreases the power supply voltage VDD when the pattern of the voltage signals
Sig
1 through Sign includes a larger number of logic value "1"s than the estimated pattern.
The process returns to the step S9 after the step S11.
[0034] FIG. 6 is a timing chart for explaining the operation of the semiconductor integrated
circuit illustrated in FIG. 3. In FIG. 6, the ordinate indicates the voltage in arbitrary
units, and the abscissa indicates the time in arbitrary units. FIG. 6 illustrates
the voltage VDDH with respect to the ground GND, the voltage of the control signal
VBSn with respect to the ground GND, the voltage of the control signal VBSp with respect
to the voltage of the monitoring target voltage terminal VDDobs, the voltage of the
monitoring target voltage terminal VDDobs with respect to the ground GND, and the
voltages of the voltage signals Sig
1 through Sign.
[0035] In FIG. 6, t1 denotes a timing at which the voltages of the control signals VBSn
and VBSp are increased in order to make the logic value of the voltage signal Sig
3 "0", and t2 denotes a timing at which the voltage of the monitoring target voltage
terminal VDDobs is switch from the predetermined reference voltage VDDref to the power
supply voltage VDD. In addition, L1, L2, L3 and L4 respectively denote levels at which
the voltage signals Sig
1, Sig
2, Sig
3 and Sig
4 become 0. The circuit adjustment described above is performed during a circuit adjusting
period or interval T1, and the monitoring of the voltage signals Sig
1 through Sign described above is performed during a voltage monitoring period or interval
T2.
[0036] FIG. 7 is a diagram for explaining another example of the semiconductor integrated
circuit. In FIG. 7, those parts that are the same as those corresponding parts in
FIG. 3 are designated by the same reference numerals, and a description thereof will
be omitted.
[0037] In the example illustrated in FIG. 7, outputs of inverter circuits 120 that receive
an input signal to a monitoring target voltage terminal VDDobs are not output directly
to the outside from a voltage monitoring circuit 12-2, but are output to inputs of
selectors 122 and 123. The selectors 122 and 123 respectively select signals to be
output depending on control signals (or selection signals) SELL and SELH from a scan
dedicated latch 115 for setting a voltage monitoring sensitivity. Outputs of the inverter
circuits 120 selectively output from the selector 122 are received from the inverter
circuits 120 having transistors having a lower threshold voltage than that of the
inverter circuits 120 whose outputs are selectively output from the selector 123.
The output of the selector 122 is output from the voltage monitoring circuit 12-2
as a low voltage signal LVS via an inverter 124. The output of the selector 123 is
output from the voltage monitoring circuit 12-2 as a high voltage signal HVS. The
low voltage signal LVS assumes a logic value "1" when a low voltage is monitored in
the voltage monitoring circuit 12-2, and the high voltage signal HVS assumes a logic
value "1" when a high voltage is monitored in the voltage monitoring circuit 12-2.
[0038] A scan-in signal SIS is input to the LSI 11-2 and supplied to a known latch scan
chain (not illustrated) within the LSI 11-2. A scan data output (or test signal) SDO
from the latch scan chain is supplied to one input of each of selectors 116 and 117.
The low voltage signal LVS output from the voltage monitoring circuit 12-2 is supplied
to the other input of the selector 116, and the high voltage signal HVS output from
the voltage monitoring circuit 12-2 is supplied to the other input of the selector
117. In addition, a test mode signal TMS is supplied to each of the selectors 116
and 117 as a selection signal. Outputs of the selectors 116 and 117 are output from
the LSI 11-2 via an I/O circuit 13, and fed back to a voltage control circuit 21.
[0039] In FIG. 7, the voltage monitoring is performed after adjusting the circuit in order
to absorb inconsistencies in the characteristics of individual LSIs 11-2. First, the
scan dedicated latch 115 supplies the control signals SELL and SELH in order to increase
the voltage monitoring sensitivity and to select from the voltage signals Sig
1 through Sign the voltage signals that are to be output as the low voltage signal
LVS and the high voltage signal HVS. A predetermined reference voltage VDDref is supplied
to a monitoring target voltage terminal VDDobs of the voltage monitoring circuit 12-2,
in order to adjust control signals VBSn and VBSp generated by a voltage generating
circuit 113 so that both the low voltage signal LVS and the high voltage signal HVS
become 0. The control signals VBSn and VBSp are fixed to the voltages after the adjustment.
Then, after arbitrarily setting the voltage monitoring sensitivity of the LSI 11-2
at the time of the normal operation by the control signals SELL and SELH, the voltage
supplied to the monitoring target voltage terminal VDDobs is switched to the power
supply voltage VDD before starting the normal operation of the LSI 11-2, and the actual
voltage at the monitoring target voltage terminal VDDobs is monitored.
[0040] Because the number of input and output terminals of the LSI 11-2, that is, the number
of signal pins of the package of the LSI 11-2, is not increased in order to output
the low voltage signal LVS and the high voltage signal HVS, the I/O circuit 13 that
is originally used for the test signal only when testing the LSI 11-2 and is not used
during normal operation, may be used in common for the low voltage signal LVS and
the high voltage signal HVS. In this example, the test signal is formed by the scan
data output SDO of the parallel scan. The selectors 116 and 117 are switched depending
on the test mode signal TMS to output the scan data output SDO or the low voltage
signal LVS and the high voltage signal HVS. At the time of the testing, the test mode
signal TMS has a logic value "0", and the parallel scan data output SDO is supplied
to the I/O circuit 13. On the other hand, at the time of the normal operation, the
test mode signal TMS has a logic value "1", and the low voltage signal LVS and the
high voltage signal HVS are supplied to the I/O circuit 13.
[0041] FIG. 8 is a diagram for explaining an example of the adjusting circuit 114-2 illustrated
in FIG. 7. In FIG. 8, those parts that are the same as those corresponding parts in
FIG. 4 are designated by the same reference numerals, and a description thereof will
be omitted.
[0042] The value of a scan latch 45 is set to a logic value "1" indicating the adjusting
mode, the value of a scan latch 44 is set to an initial value, and the scan dedicated
latch 115 illustrated in FIG. 7 is set to selector setting values (SELL and SELH)
to set the sensitivity to that of the voltage adjusting mode, by the scan. In this
state, the selector 112 selectively outputs the predetermined reference voltage VDDref
from the regulator 111 depending on the adjusting mode signal AMS. A signal judging
circuit 43-2 judges whether both the low voltage signal LVS and the high voltage signal
HVS have a logic value "0", and outputs a next voltage setting value NVS and an adjustment
judging signal AJS. The next voltage setting value NVS and the adjustment judging
signal AJS are input to the scan latch 44 and the scan latch 45 every time the clock
signal CLK is applied thereto. The next voltage setting value NVS changes the setting
values in order to increase the voltages of the control signals VBSp and VBSn when
the high voltage signal HVS has the logic value "1" and to decrease the voltages of
the control signals VBSp and VBSn when the low voltage signal LVS has the logic value
"0". In this example, the adjustment judging signal AJS output from the signal judging
circuit 43-2 assumes the logic value "0" when both the low voltage signal LVS and
the high voltage signal HVS have the logic value "0", and otherwise assumes the logic
value "1".
[0043] When the value of the scan latch 45 assumes the logic value "0", the clock signal
CLK to the scan latches 44 and 45 within the adjusting circuit 114-2 are disabled.
In addition, a completion of the adjustment may be judged from the adjusting mode
signal AMS that is output from the LSI 11-2 to the outside.
[0044] FIG. 9 is a flow chart for explaining an operation of the semiconductor integrated
circuit illustrated in FIG. 7. In FIG. 9, a step S21 selects from the voltage signals
Sig
1 through Sign the voltage signals that are to be output from the selectors 122 and
123 as the low voltage signal LVS and the high voltage signal HVS at a high monitoring
sensitivity depending on the control signals SELL and SELH, and outputs the selected
voltage signals. A step S22 selectively outputs the low voltage signal LVS and the
high voltage signal HVS from the selectors 116 and 117 depending on the test mode
signal TMS. A step S23 selectively outputs the predetermined reference voltage VDDref
from the selector 112 depending on the adjusting mode signal AMS. A step S24 sets
an initial state by setting the voltage of the control signal VBSn with respect to
the power supply voltage VDD to 0 and setting the voltage of the control signal VBSp
with respect to the ground GND to 0. A step S25 monitors the low voltage signal LVS
and the high voltage signal HVS by the adjusting circuit 114-2. A step S26 judges
whether both the low voltage signal LVS and the high voltage signal HVS have the logic
value "0". The process advances to a step S27 if the judgement result in the step
S26 is NO, and the process advances to a step S28 if the judgement result in the step
S26 is YES. The step S27 controls the voltage generating circuit 113 by the adjusting
circuit 114-2, in order to decrease the voltages of the control signal VBSn and VBSp
when the low voltage signal LVS has the logic value "1" and to increase the voltages
of the control signals VBSn and VBSp when the high voltage signal HVS has the logic
value "1". The process returns to the step S25 after the step S27.
[0045] On the other hand, the step S28 selects from the voltage signals Sig
1 through Sign the voltage signals that are to be output from the selectors 122 and
123 as the low voltage signal LVS and the high voltage signal HVS at an arbitrary
monitoring sensitivity depending on the control signals SELL and SELH, and outputs
the selected voltage signals. A step S29 selectively outputs the power supply voltage
VDD from the selector 112 depending on the adjusting mode signal AMS. A step S30 causes
the LSI 11-2 to perform a normal operation. A step S31 monitors the low voltage signal
LVS and the high voltage signal HVS by the adjusting circuit 114-2. A step S32 judges
whether both the low voltage signal LVS and the high voltage signal HVS have the logic
value "0". The process advances to a step S33 if the judgement result in the step
S32 is NO, and the process returns to the step S31 if the judgement result in the
step S32 is YES. The step S33 controls the voltage control circuit 21 by the output
of the LSI 11-2, in order to increase the power supply voltage VDD when the low voltage
signal LVS has the logic value "1" and to decrease the power supply voltage VDD when
the high voltage signal HVS has the logic value "1". The process returns to the step
S31 after the step S33.
[0046] FIG. 10 is a timing chart for explaining the operation of the semiconductor integrated
circuit illustrated in FIG. 7. In FIG. 10, the ordinate indicates the voltage in arbitrary
units, and the abscissa indicates the time in arbitrary units. FIG. 10 illustrates
the voltage VDDH with respect to the ground GND, the voltage of the control signal
SELL, the voltage of the control signal SELH, the voltage of the control signal VBSn
with respect to the ground GND, the voltage of the control signal VBSp with respect
to the voltage at the monitoring target voltage terminal VDDobs, the voltage of the
monitoring target voltage terminal VDDobs with respect to the ground GND, the voltages
of the voltage signals Sig
1 through Sig
4, the voltage of the low voltage signal LVS, and the voltage of the high voltage signal
HVS.
[0047] In FIG. 10, the voltage signal Sig
1 is selected when the logic value is "0", the voltage signal Sig
2 is selected when the logic value is "1", and the voltage signal Sig
3 is selected when the logic value is "2" for the control signal SELL. In addition,
the voltage signal Sig
2 is selected when the logic value is "0", the voltage signal Sig
3 is selected when the logic value is "1", and the voltage signal Sig
4 is selected when the logic value is "2" for the control signal SELH.
[0048] FIG. 11 is a diagram for explaining another example of the semiconductor integrated
circuit. In FIG. 11, those parts that are the same as those corresponding parts in
FIG. 7 are designated by the same reference numerals, and a description thereof will
be omitted. In FIG. 11, n voltage monitoring circuits 12-2
1 through 12-2
n, having the same structure as the voltage monitoring circuit 12-2 illustrated in
FIG. 7, are provided in a LSI 11-3. A low voltage signal LVS1 and a high voltage signal
HVS1 are output from the voltage monitoring circuit 12-2
1, and a low voltage signal LVSn and a high voltage signal HVSn are output from the
voltage monitoring circuit 12-2
n. The low voltage signals LVS1 through LVSn from the voltage monitoring circuits 12-2
1 through 12-2
n are supplied to a low voltage signal processing circuit 118. In addition, the high
voltage signals HVS1 through HVSn from the voltage monitoring circuits 12-2
1 through 12-2
n are supplied to a high voltage signal processing circuit 119. The low voltage signal
processing circuit 118 outputs the low voltage signal LVS by performing on the low
voltage signals LVS1 through LVSn a signal processing that may include a logical product
operation, a logical sum operation, a majority operation, and the like. The high voltage
signal processing circuit 119 outputs the high voltage signal HVS by performing on
the high voltage signals HVS1 through HVSn a signal processing that may include a
logical product operation, a logical sum operation, a majority operation, and the
like. Accordingly, each of the low voltage signal processing circuit 118 and the high
voltage signal processing circuit 119 may be formed by an AND circuit, an OR circuit,
a majority circuit, and the like. The signal processings (that is, operations or computations)
to be performed by the low voltage signal processing circuit 118 and the high voltage
signal processing circuit 119 may be set appropriately depending on the usage or the
like of the LSI 11-3.
[0049] Because the number of input and output terminals of the LSI 11-3, that is, the number
of signal pins of the package of the LSI 11-3, is not increased in order to output
the low voltage signal LVS and the high voltage signal HVS, the I/O circuit 13 that
is originally used for the test signal only when testing the LSI 11-3 and is not used
during normal operation, may be used in common for the low voltage signal LVS and
the high voltage signal HVS. In this example, the test signal is formed by the scan
data output SDO of the parallel scan. The selectors 116 and 117 are switched depending
on the test mode signal TMS to output the scan data output SDO or the low voltage
signal LVS and the high voltage signal HVS. At the time of the testing, the test mode
signal TMS has a logic value "0", and the parallel scan data output SDO is supplied
to the I/O circuit 13. On the other hand, at the time of the normal operation, the
test mode signal TMS has a logic value "1", and the low voltage signal LVS and the
high voltage signal HVS are supplied to the I/O circuit 13.
[0050] FIG. 12 is a diagram for explaining another example of the semiconductor integrated
circuit. In FIG. 12, those parts that are the same as those corresponding parts in
FIG. 3 are designated by the same reference numerals, and a description thereof will
be omitted.
[0051] In the example illustrated in FIG. 12, a power supply voltage VDD from a single voltage
control circuit (DC-DC converter) 21 is supplied to a plurality of (two in this example)
LSIs 11-4
1 and 11-4
2 having the same structure as the LSI 11-1 illustrated in FIG. 3. Voltage signals
Siga
1 through Siga
n are output from the LSI 11-4
1 and supplied to a signal processing part 61. In addition, voltage signals Sigb
1 through Sigb
n are output from the LSI 11-4
2 and supplied to the signal processing part 61. The signal processing part 61 performs
a signal processing (that is, an operation or computation) to obtain an average value,
a maximum value, a minimum value, and the like of the voltage signals Siga
1 through Siga
n and the voltage signals Sigb
1 through Sigb
n, and supplies a process result to a voltage control circuit 21. The voltage control
circuit 21 controls the power supply voltage VDD that is output from the signal processing
part 61 depending on the process result. The signal processing (that is, operation
or computation) to be performed by the signal processing part 61 may be set appropriately
depending on the usage or the like of the LSIs 11-4
1 and 11-4
2.
INDUSTRIAL APPLICABILITY
[0052] The present invention may be applied to various semiconductor integrated circuits
in which there is a demand to control a power supply voltage constant within the semiconductor
integrated circuit.
[0053] Further, the present invention is not limited to these embodiments, but various variations
and modifications may be made without departing from the scope of the present invention.
1. A semiconductor integrated circuit comprising:
a first selector that selectively outputs one of a power supply voltage supplied from
an outside of the semiconductor integrated circuit and a predetermined reference voltage
to a monitoring target voltage terminal depending on an adjusting mode signal;
a voltage monitoring circuit that monitors a voltage fluctuation at the monitoring
target voltage terminal and converts the voltage fluctuation that is monitored into
a digital signal; and
an input and output circuit that outputs the digital signal to the outside of the
semiconductor integrated circuit.
2. The semiconductor integrated circuit as claimed in claim 1, wherein the voltage monitoring
circuit comprises a plurality of inverter circuits each including a plurality of transistors
having mutually different threshold voltages at which outputs thereof change and applied
with a voltage at the monitoring target voltage terminal as a power supply voltage,
and wherein an output pattern of the plurality of inverter circuits changes depending
on a voltage level at the monitoring target voltage terminal.
3. The semiconductor integrated circuit as claimed in claim 2, wherein the first selector
selectively outputs the reference voltage during a circuit adjusting period depending
on the adjusting mode signal and selectively outputs the power supply voltage during
a voltage monitoring period,
and further comprising:
an adjusting circuit that controls a back bias signal supplied to the plurality of
transistors based on the digital signal output from the voltage monitoring circuit
during the circuit adjusting period.
4. The semiconductor integrated circuit as claimed in claim 2, wherein the first selector
selectively outputs the reference voltage during a circuit adjusting period depending
on the adjusting mode signal and selectively outputs the power supply voltage during
a voltage monitoring period,
and further comprising:
a second selector and a third selector that select the digital signal that is to be
selectively output depending on a control signal in accordance with a voltage monitoring
sensitivity; and
an adjusting circuit configured to control a back bias signal supplied to the plurality
of transistors based on the digital signal output from the voltage monitoring circuit
during the circuit adjusting period,
wherein the second selector selectively outputs an output of one of the plurality
of inverter circuits formed by a transistor having a threshold voltage lower than
that of another of the plurality of inverter circuits whose output is selectively
output from the third selector.
5. The semiconductor integrated circuit as claimed in any of claims 1 to 4, wherein the
input and output circuit selectively outputs scan data during a test depending on
a test mode signal, and selectively outputs the digital signal during a normal operation.
6. The semiconductor integrated circuit as claimed in claim 4, further comprising:
a plurality of said voltage monitoring circuits;
a first signal processing circuit that outputs the digital signal by performing a
signal processing on the digital signal that is selectively output from the second
selector of each of the plurality of voltage monitoring circuits; and
a second signal processing circuit that outputs the digital signal by performing a
signal processing on the digital signal that is selectively output from the third
selector of each of the plurality of voltage monitoring circuits.
7. A power supply voltage control method for controlling a power supply voltage supplied
from a power supply control circuit to a semiconductor integrated circuit, the power
supply voltage control method comprising:
switching a first selector within the semiconductor integrated circuit depending on
an adjusting mode signal in order to selectively output to a monitoring target voltage
terminal a predetermined reference voltage during a circuit adjusting period and the
power supply voltage during a voltage monitoring period;
converting into a digital signal a voltage fluctuation monitored at the monitoring
target voltage terminal by a voltage monitoring circuit within the semiconductor integrated
circuit; and
controlling the power supply voltage output from the voltage control circuit by outputting
the digital signal from an input and output circuit within the semiconductor integrated
circuit to the voltage control circuit.
8. The power supply voltage control method as claimed in claim 7, wherein the voltage
monitoring circuit comprises a plurality of inverter circuits each including a plurality
of transistors having mutually different threshold voltages at which outputs thereof
change and applied with a voltage at the monitoring target voltage terminal as a power
supply voltage, and wherein an output pattern of the plurality of inverter circuits
changes depending on a voltage level at the monitoring target voltage terminal.
9. The power supply voltage control method as claimed in claim 8, further comprising:
controlling a back bias signal supplied to the plurality of transistors by an adjusting
circuit based on the digital signal output from the voltage monitoring circuit during
the circuit adjusting period.
10. The power supply voltage control method as claimed in claim 8, further comprising:
switching a digital signal that is selectively output from a second selector and a
third selector depending on a control signal in accordance with a voltage monitoring
sensitivity; and
controlling a back bias signal supplied to the plurality of transistors by an adjusting
circuit based on the digital signal output from the voltage monitoring circuit during
the circuit adjusting period;
wherein the second selector selectively outputs an output of one of the plurality
of inverter circuits formed by a transistor having a threshold voltage lower than
that of another of the plurality of inverter circuits whose output is selectively
output from the third selector.
11. The power supply voltage control method as claimed in any of claims 7 to 10, further
comprising:
controlling the input and output circuit depending on a test mode signal in order
to selectively output scan data during a test and selectively output the digital signal
during a normal operation.
12. The power supply voltage control method as claimed in claim 10, wherein the semiconductor
integrated circuit comprises a plurality of said voltage monitoring circuits,
and further comprising:
outputting the digital signal by performing a signal processing on the digital signal
that is selectively output from the second selector of each of the plurality of voltage
monitoring circuits by a first signal processing circuit; and
outputting the digital signal by performing a signal processing on the digital signal
that is selectively output from the third selector of each of the plurality of voltage
monitoring circuits by a second signal processing circuit.