Technical Field
[0001] The present invention relates to a heater and an ignition device.
Background Art
[0002] A heater (ceramic heater) in which a heat-generating body is disposed in a ceramic
body is known as an example of a heater for use in a gas stove, an on-vehicle heating
device, a kerosene fan heater, a glow plug of an automobile engine, or the like. Patent
Document 1 discloses an example of a ceramic heater.
[0003] Japanese Unexamined Patent Application Publication No.
2000-156275 (hereinafter referred to as Patent Document 1) discloses a ceramic heater including
a ceramic structure, a heat-generating resistor embedded in the ceramic structure,
and feeder lines that are connected to the heat-generating resistor and extend to
a surface of the ceramic structure.
[0004] The ceramic heater described in Patent Document 1 has a risk that cracks will be
formed in the feeder lines when the ceramic heater is repeatedly used in a high-temperature
environment. When, in particular, cracks are formed in portions of the feeder lines
exposed at the surface of the ceramic structure, the outside air may flow into the
feeder lines. Therefore, the resistance of the feeder lines may change due to a reaction
between the feeder lines and the outside air, and abnormal local heat generation may
occur. Thus, it is difficult to increase the long-term reliability when the ceramic
heater is repeatedly used in a high-temperature environment.
Summary of Invention
[0005] A heater includes a ceramic multilayer body including a plurality of ceramic layers
that are stacked together; a heat-generating resistor having a belt shape, the heat-generating
resistor being disposed between the ceramic layers and arranged, and including both
ends that are at a side surface of the ceramic multilayer body; and conductive layers
having a belt shape, disposed between the ceramic layers and stacked on both end portions
of the heat-generating resistor in such a manner that one end of each conductive layer
is at the side surface. Each conductive layer includes a first conductive layer that
extends to the side surface and a second conductive layer that is adjacent to the
first conductive layer, each of the first conductive layer and the second conductive
layer being formed of a plurality of grains, the grains of the first conductive layer
having an average grain diameter smaller than an average grain diameter of the grains
of the second conductive layer.
Brief Description of Drawings
[0006]
Fig. 1 is a longitudinal sectional view of a heater.
Fig. 2 is a cross-sectional view of the heater illustrated in Fig. 1 taken along line
A-A'.
Fig. 3 is a cross-sectional view of the heater illustrated in Fig. 1 taken along line
B-B'.
Fig. 4 is a cross-sectional view of a modification of the heater.
Fig. 5 is a perspective view of an ignition device including the heater illustrated
in Fig. 1.
Description of Embodiments
[0007] A heater 10 will be described with reference to the drawings.
[0008] As illustrated in Figs. 1 to 3, the heater 10 includes a ceramic multilayer body
1 including a plurality of ceramic layers 11 that are stacked together, a heat-generating
resistor 2 provided between the adjacent ceramic layers 11, and conductive layers
3 stacked on the heat-generating resistor 2. The heater 10 may be used in, for example,
a glow plug of an automobile engine or a gas stove.
[0009] The ceramic multilayer body 1 is a member in which the heat-generating resistor 2
and the conductive layers 3 are embedded. The durabilities of the heat-generating
resistor 2 and the conductive layers 3 can be increased by placing the heat-generating
resistor 2 and the conductive layers 3 in the ceramic multilayer body 1. The ceramic
multilayer body 1 is, for example, a rod-shaped or plate-shaped member.
[0010] The ceramic multilayer body 1 is made of an electrically insulative ceramic, such
as an insulating ceramic, a nitride ceramic, or a carbide ceramic. More specifically,
the ceramic multilayer body 1 is made of, for example, an alumina ceramic, a silicon
nitride ceramic, an aluminum nitride ceramic, or a silicon carbide ceramic.
[0011] The ceramic multilayer body 1 made of a silicon nitride ceramic may be obtained by
the following method. For example, silicon nitride, which is the main component, is
mixed with 5 to 15 mass% of rare earth oxide, such as Y
2O
3, Yb
2O
3, or Er
2O
3, which functions as a sintering additive; 0.5 to 5 mass% of Al
2O
3; and SiO
2, the amount of which is adjusted so that the amount of SiO
2 in the sintered body is 1.5 to 5 mass%. The thus-obtained material is formed in a
predetermined shape, and is then fired at a temperature of 1650°C to 1780°C. Thus,
the ceramic multilayer body 1 made of a silicon nitride ceramic is obtained. Hot press
firing, for example, may be performed in the firing process.
[0012] When the ceramic multilayer body 1 is rod-shaped, more specifically, rectangular-prism-shaped,
the length of the ceramic multilayer body 1 is set to, for example, 20 to 100 mm.
The cross-sectional shape of the ceramic multilayer body 1 is set to, for example,
a rectangle having a thickness of 1 to 6 mm and a width of 2 to 40 mm.
[0013] The heat-generating resistor 2 is a layer-shaped member that generates heat when
a voltage is applied thereto. The heat-generating resistor 2 is disposed between the
adjacent ceramic layers 11. When a voltage is applied to the heat-generating resistor
2, a current flows through the heat-generating resistor 2, and the heat-generating
resistor 2 generates heat. The generated heat is transferred through the ceramic multilayer
body 1, so that the temperature of the surface of the ceramic multilayer body 1 increases.
The heat is transferred from the surface of the ceramic multilayer body 1 to an object
to be heated, thereby providing the function of the heater 10. The object to be heated
that receives the heat from the surface of the ceramic multilayer body 1 is, for example,
diesel oil to be supplied to an automobile diesel engine.
[0014] The heat-generating resistor 2 is arranged in such a manner that both ends thereof
are at a side surface of the ceramic multilayer body 1 near the rear end of the ceramic
multilayer body 1. The heat-generating resistor 2 has, for example, a bent shape in
longitudinal cross section (cross section parallel to the length direction of the
heat-generating resistor 2). More specifically, the heat-generating resistor 2 includes
two linear portions that are arranged next to each other and a connecting portion
that has substantially semicircular or substantially semielliptical inner and outer
peripheries and that is bent so as to connect the two linear portions. The heat-generating
resistor 2 is bent at a location near the front end of the ceramic multilayer body
1. The total length of the heat-generating resistor 2 is, for example, 35 to 100 mm.
[0015] The heat-generating resistor 2 is designed so as to generate a large amount of heat
in a region near the front end of the ceramic multilayer body 1. More specifically,
the conductive layers 3 are stacked on both end portions of the heat-generating resistor
2 in a region near the rear end of the ceramic multilayer body 1. Accordingly, a current
flows through both the heat-generating resistor 2 and the conductive layers 3 in the
region near the rear end of the ceramic multilayer body 1. As a result, the amount
of heat generated by the heat-generating resistor 2 is small in the region near the
rear end of the ceramic multilayer body 1. In contrast, the current flows only through
the heat-generating resistor 2 in the region near the front end of the ceramic multilayer
body 1. As a result, the amount of heat generated by the heat-generating resistor
2 is large in the region near the front end of the ceramic multilayer body 1.
[0016] The heat-generating resistor 2 is made of, for example, a material having a carbide,
nitride, silicide, etc., of tungsten (W), molybdenum (Mo), titanium (Ti), etc., as
the main component. When the ceramic multilayer body 1 is made of a silicon nitride
ceramic, the heat-generating resistor 2 is preferably made of a material having tungsten
carbide as the main component. In this case, the coefficient of thermal expansion
of the ceramic multilayer body 1 and that of the heat-generating resistor 2 can be
made close to each other.
[0017] The conductive layers 3 are members for adjusting the amount of heat generated by
the heat-generating resistor 2 in the region near the rear end of the ceramic multilayer
body 1, that is, in the region around the portions of the side surface of the ceramic
multilayer body 1 to which the heat-generating resistor 2 extends. In Fig. 1, the
conductive layers 3 are shown by the broken lines. In Fig. 1, the broken lines that
show the conductive layers 3 and the solid lines that show the heat-generating resistor
2 are shifted from each other to improve visibility. However, in practice, the conductive
layers 3 and the heat-generating resistor 2 have substantially the same width, and
are stacked together so as to be aligned with each other in the width direction. As
illustrated in Figs. 2 and 3, the conductive layers 3 are stacked on both end portions
of the heat-generating resistor 2 in the space between the ceramic layers 11, and
are arranged such that one end of each conductive layer 3 is at the side surface of
the ceramic multilayer body 1. By covering both end portions of the heat-generating
resistor 2, which are to be connected to an external circuit, with the conductive
layers 3, the amount of heat generated in the region near the rear end of the ceramic
multilayer body 1 can be reduced. Accordingly, the connection reliability between
the external circuit and the heater 10 can be increased.
[0018] Each conductive layer 3 includes a first conductive layer 31 that extends to the
side surface of the ceramic multilayer body 1 and a second conductive layer 32 that
is adjacent to the first conductive layer 31. The first conductive layer 31 and the
second conductive layer 32 are each formed of a plurality of grains. The average grain
diameter of the grains of the first conductive layer 31 is smaller than that of the
grains of the second conductive layer 32. Since the first conductive layer 31, which
is located closer to the outside, is formed of grains having a small average grain
diameter, the density of the first conductive layer 31 can be increased. As a result,
the voidage of the first conductive layer 31 is reduced, and the risk that the outside
air will flow into each conductive layer 3 can be reduced.
[0019] Since not only the conductive layers 3 but also the heat-generating resistor 2 extends
to the side surface of the ceramic multilayer body 1, portions that extend to the
side surface have a two-layer structure. Therefore, even when cracks are formed either
in the conductive layers 3 or in the heat-generating resistor 2, the risk that the
cracks will extend into the other of the conductive layers 3 and the heat-generating
resistor 2 can be reduced.
[0020] Since the second conductive layer 32 is formed of grains having a large average grain
diameter, the number of grain boundaries of the grains of the second conductive layers
32 can be reduced. Therefore, the resistance of the second conductive layer 32 can
be reduced. Accordingly, unnecessary heat generation by each conductive layer 3 can
be suppressed.
[0021] As a result, the long-term reliability of the heater 10 when used in a heat cycle
is increased.
[0022] More specifically, for example, in the case where conductive layers having a constant
average grain diameter in each portion thereof are provided, unlike the above-described
heater 10, the following problem arises. That is, when the average grain diameter
of the conductive layers is simply reduced, even though the risk that the outside
air will flow into the conductive layers can be reduced, since the resistance of the
conductive layers increases, unnecessary heat generation by the conductive layers
occurs. Conversely, when the average grain diameter of the conductive layers is simply
increased, even though unnecessarily heat generation by the conductive layers can
be suppressed, the outside air easily flows into the conductive layers. In contrast,
by making the average grain diameter of the grains of the first conductive layer 31
smaller than that of the grains of the second conductive layer 32 as in the above-described
heater 10, the risk that the outside air will enter each conductive layer 3 can be
reduced and unnecessary heat generation by each conductive layer 3 can be suppressed.
[0023] In addition, as illustrated in Fig. 2, the first conductive layer 31 and the second
conductive layer 32 preferably partially overlap. In such a case, unlike the case
in which the first conductive layer 31 and the second conductive layer 32 do not overlap,
each conductive layer 3 can be formed so as to have a coefficient of thermal expansion
that changes gradually in the length direction thereof. As a result, the possibility
that cracks will be formed in the conductive layers 3 in a heat cycle can be reduced.
[0024] Preferably, the first conductive layer 31 is located between the second conductive
layer 32 and the heat-generating resistor 2, and, in a region in which the first conductive
layer 31 is located between the second conductive layer 32 and the heat-generating
resistor 2, the first conductive layer 31 has a thickness that decreases toward the
other end thereof. In such a case, each conductive layer 3 can be formed so as to
have a coefficient of thermal expansion that changes smoothly. As a result, the possibility
that cracks will be formed in the conductive layers 3 in a heat cycle can be further
reduced.
[0025] In the above-described heater 10, each conductive layer 3 includes only the first
conductive layer 31 and the second conductive layer 32. However, each conductive layer
3 is not limited to this, and may further include a portion other than the first conductive
layer 31 and the second conductive layer 32. For example, as illustrated in Fig. 4,
each conductive layer 3 may include, in addition to the first conductive layer 31
and the second conductive layer 32, a third conductive layer 33. The third conductive
layer 33 is adjacent to the second conductive layer 32 at a side opposite to the side
adjacent to the first conductive layer 31.
[0026] There is no particular limitation regarding the layer used as the third conductive
layer 33. For example, the third conductive layer 33 may be formed of grains having
an average grain diameter smaller than that of the grains of the second conductive
layer 32. In such a case, the number of crystal grain boundaries of the grains of
the third conductive layer 33 can be increased. Accordingly, the resistance of the
third conductive layer 33 can be set to a value higher than that of the second conductive
layer 32. Therefore, the amount of heat generated by the heat-generating resistor
2 can be changed gradually. Accordingly, the surface of the heater 10 can be heated
in such a manner that the temperature thereof changes gradually. As a result, the
risk that a large local thermal stress will be generated in the ceramic multilayer
body 1 can be reduced.
[0027] The first to third conductive layers 31 to 33 are made of, for example, a highly
heat-resistant metal material, such as molybdenum (Mo), tungsten (W), or rhenium (Re).
MoSi
2, WSi
2, etc., are preferably mixed in the material to make the coefficient of thermal expansion
close to that of the ceramic multilayer body 1. The length of a portion of the first
conductive layer 31 that extends in the length direction of the heat-generating resistor
2 is set to about 2 to 10 mm. The thickness of the first conductive layer 31 is set
to about 5 to 30 µm. The length of a portion of the second conductive layer 32 that
extends in the length direction of the heat-generating resistor 2 is set to about
5 to 20 mm. The thickness of the second conductive layer 32 is set to about 25 to
75 µm. In the case where the first conductive layer 31 and the second conductive layer
32 overlap, the length of the overlapping region is set to, for example, about 500
µm.
[0028] The grain diameters of the first conductive layer 31 and the second conductive layer
32 can be adjusted as follows. In the case where the first conductive layer 31 and
the second conductive layer 32 are both made of W, the grain diameters of the first
conductive layer 31 and the second conductive layer 32 can be adjusted by changing
the particle diameter of W powder, which is the starting material. For example, the
average grain diameter of the W powder used to form the first conductive layer 31
may be set to 0.2 µm, and the average grain diameter of the W powder used to form
the second conductive layer 32 may be set to 1.2 µm. In this case, the average grain
diameter of the first conductive layer 31 can be set to 0.2 to 2 µm, and the average
grain diameter of the second conductive layer 32 can be set to 1.2 to 12 µm.
[0029] In particular, the average grain diameter of the first conductive layer 31 is preferably
less than 1 µm. In such a case, entrance of the outside air into the first conductive
layer 31 through the spaces between the grains can be suppressed, and therefore the
risk that the outside air will flow into the first conductive layer 31 can be reduced.
The voidage of the first conductive layer is preferably less than 20%. In such a case,
entrance of the outside air into the first conductive layer 31 can be suppressed.
[0030] The average grain diameter of each conductive layer 3 can be determined by, for example,
the following method. That is, the heater 10 is cut along a plane that passes through
the conductive layer 3 and that is perpendicular to the conductive layer 3 by using
a diamond cutter. Then, the cut surface is ground by using diamond powder. After that,
the first conductive layer 31 and the second conductive layer 32 are observed by using
a scanning electron microscope or metallographic microscope. More specifically, five
arbitrary straight lines are drawn on the image obtained by the scanning electron
microscope or metallographic microscope. Then, the average of the lengths of portions
of the five straight lines, each portion passing through ten grains, is determined.
The average grain diameter is determined by dividing the average by ten, which is
the number of grains. The average grain diameter may instead be calculated by using
an image analyzing device (LUZEX-FS produced by Nireco Corporation). This image analyzing
device can also be used to measure the voidage of the first conductive layer 31.
[0031] The heater 10 is used in, for example, an ignition device 100 illustrated in Fig.
5. The ignition device 100 includes the heater 10 and a channel 20 through which fuel
gas is supplied to the heater 10. The channel 20 includes, for example, a gas valve
21 and a gas flow pipe 22 having ejection holes 23. The gas valve 21 has a function
of controlling the flow rate of the fuel gas. The fuel gas supplied from the gas valve
21 is, for example, natural gas or propane gas. The gas flow pipe 22 ejects the fuel
gas, which is supplied from the gas valve 21, toward the heater 10 through the ejection
holes 23. The ejected fuel gas can be ignited by heating the fuel gas with the heater
10. The ignition device 100, which includes the heater 10 having improved long-term
reliability, has increased fuel-gas ignition stability.
Reference Signs List
[0032]
- 1
- ceramic multilayer body
- 11
- ceramic layer
- 2
- heat-generating resistor
- 3
- conductive layer
- 31
- first conductive layer
- 32
- second conductive layer
- 10
- heater
- 20
- channel
- 21
- gas valve
- 22
- gas flow pipe
- 23
- ejection hole
- 100
- ignition device
1. A heater comprising:
a ceramic multilayer body comprising a plurality of ceramic layers that are stacked
together;
a heat-generating resistor having a belt shape, the heat-generating resistor being
disposed between the ceramic layers and arranged, and comprising both ends that are
at a side surface of the ceramic multilayer body; and
conductive layers having a belt shape, disposed between the ceramic layers and stacked
on both end portions of the heat-generating resistor in such a manner that one end
of each conductive layer is at the side surface;
wherein each conductive layer comprises a first conductive layer that extends to the
side surface and a second conductive layer that is adjacent to the first conductive
layer, each of the first conductive layer and the second conductive layer being formed
of a plurality of grains, the grains of the first conductive layer having an average
grain diameter smaller than an average grain diameter of the grains of the second
conductive layer.
2. The heater according to Claim 1, wherein the first conductive layer and the second
conductive layer partially overlap.
3. The heater according to Claim 2, wherein, in a region in which the first conductive
layer and the second conductive layer overlap, the first conductive layer is located
between the second conductive layer and the heat-generating resistor, and
wherein, in a region in which the first conductive layer is located between the second
conductive layer and the heat-generating resistor, the first conductive layer has
a thickness that decreases toward the other end of the first conductive layer.
4. The heater according to any one of Claims 1 to 3,
wherein the grains of the first conductive layer have an average grain diameter of
0.2 to 2 µm, and the grains of the second conductive layer have an average grain diameter
of 1.2 to 12 µm.
5. The heater according to any one of Claims 1 to 4,
wherein the first conductive layer has a voidage of less than 20%.
6. An ignition device comprising:
the heater according to any one of Claims 1 to 5; and
a channel through which fuel gas flows to the ceramic multilayer body included in
the heater.