TECHNICAL FIELD
[0001] Embodiments of the present invention relate to optoelectronic technologies, and in
particular, to an optical assembly and an optical module.
BACKGROUND
[0002] To keep up with the explosive growth of data services, optoelectronic interconnection
modules of an enterprise network and a data center develop towards a trend of a higher
speed and a higher density. In a case in which a unit bit rate of a photoelectric
device is fully developed, an optical module for which parallel cables are used becomes
a solution of further improving receiving and sending efficiency, for example, a protocol
module such as a quad SFP (QSFP) interface based on a multiple-fiber push-on/pull-off
(MPO) interface, and a 120 GB/s 12x Small Form-factor Pluggable (CXP) interface.
[0003] For example,
US 2015/0086165A1 refers to an optical receptacle and optical module provided with the same.
[0004] Currently, a package technology commonly used for the optical module includes a transistor-outline
can (TO-CAN) and a chip on board technology (COB). FIG. 1a is a schematic diagram
of an optical module packaged by means of the COB, and FIG. 1b is a schematic diagram
of a commonly used molded plastic piece. As shown in FIG. 1a and FIG. 1b, a manner
in which the optical module is packaged by means of the COB is directly fastening
an optical chip (for example, a laser or a PD) on a printed circuit board (PCB) by
using an integrally formed molded plastic piece, where two prisms are disposed in
the molded plastic piece, light from a laser 102 is collimated by a lens 119 and then
is turned horizontal by a reflection surface 111, and after travelling through a part
of an optical path, a part of rays are reflected by a disposed clearance surface 113
to a monitor photodetector (MPD) for energy testing. In the manner, a clearance needs
to be added to a design of the optical path, and a length of the optical path is relatively
long.
[0005] However, when the molded plastic piece in the optical module is packaged by means
of the COB, because the optical path is relatively long, a length of the molded plastic
piece is caused to be relatively long, making it difficult to implement miniaturization
of the optical module.
SUMMARY
[0006] Embodiments of the present invention provide an optical assembly and an optical module,
so as to resolve a problem that when a COB technology is used for an optical module,
a length of a molded plastic piece is caused to be relatively long because of an optical
path, making it difficult to implement miniaturization of the optical module.
[0007] A first aspect of the present invention provides an optical assembly, according to
claim 1. The optical assembly comprises:
a main body and a total reflection device, where
the main body includes a fiber connection portion and a light processing portion,
where the fiber connection portion is connected to the light processing portion;
the fiber connection portion is connected to an external fiber; and
a light splitting surface is disposed in the light processing portion and is in contact
with the total reflection device, where the light splitting surface is configured
to reflect a part of incident rays to a monitor photodetector MPD, and transmit the
other part of the incident rays; and the total reflection device is disposed in the
light processing portion, configured to reflect, to the fiber connected to the fiber
connection portion, the incident rays transmitted by the light splitting surface.
[0008] With reference to the first aspect, in a first possible implementation manner of
the first aspect, a first lens and a second lens are further disposed in the light
processing portion, where the first lens is disposed at a position from which the
incident rays enter an optical path, and is configured to refract dispersed incident
rays to parallel incident rays; and the second lens is disposed on an optical path
that is obtained after reflection by the total reflection device, and is configured
to focus the incident rays reflected by the total reflection device.
[0009] With reference to the first aspect or the first possible implementation manner of
the first aspect, in a second possible implementation manner of the first aspect,
the total reflection device includes a reflection sheet or a total reflection profile.
[0010] With reference to the second possible implementation manner of the first aspect,
in a third possible implementation manner of the first aspect, an angle range of a
first included angle between a reflective surface of the total reflection device and
the incident rays is 30 degrees to 60 degrees.
[0011] With reference to the third possible implementation manner of the first aspect, in
a fourth possible implementation manner of the first aspect, the first included angle
is 45 degrees.
[0012] With reference to the first aspect or any one of the first to the fourth possible
implementation manners of the first aspect, in a fifth possible implementation manner
of the first aspect, an angle range of a second included angle between a plane on
which the light splitting surface is located and the incident rays is 45 degrees to
90 degrees.
[0013] With reference to the first aspect or any one of the first to the fifth possible
implementation manners of the first aspect, in a sixth possible implementation manner
of the first aspect, the main body is in an integrally formed structure.
[0014] A second aspect of the present invention provides an optical module, including: an
optical module circuit, a substrate, and an optical assembly, where the optical module
circuit includes a monitor photodetector MPD, and the optical module circuit and the
optical assembly are disposed on the substrate; and
the optical assembly includes a main body and a total reflection device, where the
main body includes a fiber connection portion and a light processing portion, where
the fiber connection portion is connected to the light processing portion, the fiber
connection portion is connected to an external fiber, a light splitting surface is
disposed in the light processing portion and is in contact with the total reflection
device, the total reflection device is disposed in the light processing portion, and
the light splitting surface is configured to reflect a part of incident rays to the
MPD, and transmit the other part of the incident rays; and the total reflection device
is configured to reflect, to the fiber connected to the fiber connection portion,
the incident rays transmitted by the light splitting surface.
[0015] With reference to the second aspect, in a first possible implementation manner of
the second aspect, a first lens and a second lens are further disposed in the light
processing portion, where the first lens is disposed at a position from which the
incident rays enter an optical path, and is configured to refract dispersed incident
rays to parallel incident rays; and the second lens is disposed on an optical path
that is obtained after reflection by the total reflection device, and is configured
to focus the incident rays reflected by the total reflection device.
[0016] With reference to the second aspect or the first possible implementation manner of
the second aspect, in a second possible implementation manner of the second aspect,
the optical module circuit further includes a laser, where the laser is configured
to generate the incident rays.
[0017] With reference to the second aspect or the first or the second possible implementation
manner of the second aspect, in a third possible implementation manner of the second
aspect, the optical module circuit further includes a photodetector (PD), where the
light splitting surface is configured to reflect received rays to the PD.
[0018] According to the optical assembly and the optical module provided in the present
invention, a total reflection device is directly disposed in a light processing portion,
and a light splitting surface is disposed to transmit a part of incident rays to the
total reflection device, where the incident rays are reflected to a connected fiber
by the total reflection device, and the light splitting surface may directly reflect
a small part of the incident rays to an MPD for testing. In this way, an optical path
is relatively short, and package can be performed by means of a COB, thereby
decreasing a size of the optical assembly, and implementing miniaturization of the
optical module to which the optical assembly is applied.
BRIEF DESCRIPTION OF DRAWINGS
[0019] To describe the technical solutions in the embodiments of the present invention or
in the prior art more clearly, the following briefly introduces the accompanying drawings
required for describing the embodiments or the prior art. Apparently, the accompanying
drawings in the following description show some embodiments of the present invention,
and persons of ordinary skill in the art may still derive other drawings from these
accompanying drawings without creative efforts.
FIG. 1a is a schematic diagram of an optical module packaged by means of a COB;
FIG. 1b is a schematic diagram of a commonly used molded plastic piece;
FIG. 2a is a front view of a structure of Embodiment 1 of an optical assembly according
to the present invention;
FIG. 2b is a 3D diagram of a structure of Embodiment 1 of an optical assembly according
to the present invention;
FIG. 3 is a schematic sectional view of Embodiment 2 of an optical assembly not according
to the present invention;
FIG. 4 is a schematic structural diagram of Embodiment 1 of an optical module according
to the present invention; and
FIG. 5 is a schematic diagram of an optical path in an embodiment of an optical module
according to the present invention.
DESCRIPTION OF EMBODIMENTS
[0020] To make the objectives, technical solutions, and advantages of the embodiments of
the present invention clearer, the following clearly and completely describes the
technical solutions in the embodiments of the present invention with reference to
the accompanying drawings in the embodiments of the present invention. Apparently,
the described embodiments are some but not all of the embodiments of the present invention.
All other embodiments obtained by persons of ordinary skill in the art based on the
embodiments of the present invention without creative efforts shall fall within the
protection scope of the present invention.
[0021] FIG. 2a is a front view of a structure of Embodiment 1 of an optical assembly according
to the present invention; and FIG. 2b is a 3D diagram of a structure of Embodiment
1 of an optical assembly according to the present invention. As shown in FIG. 2a and
FIG. 2b, the optical assembly includes a main body 21 and a total reflection device
22, where the main body 21 includes a fiber connection portion 211 and a light processing
portion 212, where the fiber connection portion 211 is connected to the light processing
portion 212, and the fiber connection portion 211 is connected to an external fiber;
a light splitting surface 2121 is disposed in the light processing portion 212, and
is in contact with the total reflection device, where the light splitting surface
2121 is configured to reflect a part of incident rays to a monitor photodetector (English:
Monitor Photo Detector, MPD for short), and transmit the other part of the incident
rays; and the total reflection device 22 is disposed in the light processing portion
212, configured to reflect, to the fiber connected to the fiber connection portion
211, the incident rays transmitted by the light splitting surface 2121.
[0022] In Embodiment 1, as shown in FIG. 2a and FIG. 2b, the total reflection device 22
is disposed on the main body 21, so that incident rays can be reflected, and the light
processing portion 212 is configured to process the incident rays. The light splitting
surface 2121 is disposed by means of a Fresnel reflection effect of a sloping surface,
and a smooth sloping surface, that is, the light splitting surface 2121, is formed
in the light processing portion 212 of the main body 21 by hollowing an optical path
along which the incident rays are input. Most incident rays may be transmitted by
the sloping surface. Because of the intrinsic Fresnel reflection effect, a small part
of the incident rays are reflected to the disposed MPD, and a photon-generated current
is generated, which may reflect a value of an output optical power.
[0023] When the optical assembly is applied, both a key chip and optical chip (for example,
a laser) are placed on a substrate, and then the optical assembly is packaged at a
proper position by using a COB technology.
[0024] According to the optical assembly provided in Embodiment 1, a total reflection device
is directly disposed in a light processing portion, and a light splitting surface
is disposed to transmit a part of incident rays to the total reflection device, where
the incident rays are reflected to a connected fiber by the total reflection device,
and the light splitting surface may directly reflect a small part of the incident
rays to an MPD for testing. In this way, an optical path is relatively short, and
package can be performed by means of a COB, thereby decreasing a size of the optical
assembly, and implementing miniaturization of an optical module to which the optical
assembly is applied.
[0025] FIG. 3 is a schematic sectional view of Embodiment 2 of an optical assembly not according
to the present invention. As shown in FIG. 3, based on FIG. 2, a first lens 2122 and
a second lens 2123 are further disposed in the light processing portion 212 of the
optical assembly, where the first lens 2122 is disposed at a position from which the
incident rays enter an optical path, and is configured to refract dispersed incident
rays to parallel incident rays; and the second lens 2123 is disposed on an optical
path that is obtained after reflection by the total reflection device 22, and is configured
to focus the incident rays reflected by the total reflection device.
[0026] In Embodiment 2 the total reflection device 22 includes a reflection sheet or a total
reflection profile, or may be another device having a total reflection function. Generally,
an angle range of a first included angle between a reflective surface of the total
reflection device and the incident rays is 30 degrees to 60 degrees. As long as the
incident rays can be reflected to the fiber connected to the fiber connection portion,
a specific value of the first included angle is not limited in this solution.
[0027] Preferably, the first included angle may be 45 degrees. As shown in FIG. 3, when
the incident rays are input in a direction perpendicular to a horizontal direction
in the figure, the incident rays are refracted by the first lens 2122 into parallel
rays, and are transmitted by the light splitting surface 2121 to the reflective surface
of the optical reflection device; if the first included angle is 45 degrees, the incident
rays may be precisely reflected to the rayconnected to the ray connection portion
211 that is parallel to a horizontal plane.
[0028] In addition, an angle range of a second included angle between a plane on which the
light splitting surface 2121 is located and the incident rays is 45 degrees to 90
degrees. That is, as a position shown in FIG. 3, an included angle between the light
splitting surface 2121 and the horizontal plane is less than 45 degrees. A specific
value of the second included angle is not limited in this application, as long as
a small part of the incident rays that are reflected by the light splitting surface
can be transmitted to the MPD.
[0029] In Embodiment 2, the main body is an injection molded part in an integrally formed
structure.
[0030] Similarly, using FIG. 3 as an example, for a transmit optical path, when dispersed
rays are input to a plastic molded part, the rays are turned into parallel rays by
the first lens. When passing through the light splitting surface, most parallel rays
are transmitted by the light splitting surface, and then are transmitted to the fiber
after being reflected by the total reflection device and being focused once by the
second lens. A small part of the incident rays that are not transmitted by the light
splitting surface and are reflected by the light splitting surface are reflected to
the MPD for testing, where the light splitting surface is disposed by means of a Fresnel
reflection effect of a sloping surface. Because of the intrinsic Fresnel reflection
effect, a small part of the rays are reflected to the MPD, and a photon-generated
current is generated. A value of the current may reflect a value of an output optical
power.
[0031] According to the optical assembly provided in Embodiment 2, a total reflection device
is directly disposed in a light processing portion, and a light splitting surface
is disposed to transmit a part of incident rays to the total reflection device, where
the incident rays are reflected to a connected fiber by the total reflection device,
and the light splitting surface may directly reflect a small part of the incident
rays to an MPD for testing. In this way, an optical path is relatively short, and
package can be performed by means of a COB, thereby decreasing a size of the optical
assembly, and implementing miniaturization of an optical module to which the optical
assembly is applied. In addition, a first lens and a second lens are disposed to focus
rays, improving a processing effect of the rays.
[0032] FIG. 4 is a schematic structural diagram of an Embodiment of an optical module according
to the present invention. As shown in FIG. 4, the optical module includes: an optical
module circuit 31, a substrate 32, and an optical assembly 33, where the optical module
circuit 31 includes an MPD, and the optical module circuit 31 and the optical assembly
33 are disposed on the substrate 32; and
the optical assembly 33 includes a main body and a total reflection device, where
the main body includes a fiber connection portion and a light processing portion,
where the fiber connection portion is connected to the light processing portion, the
fiber connection portion is connected to an external fiber, a light splitting surface
is disposed in the light processing portion and is in contact with the total reflection
device, and the total reflection device is disposed in the light processing portion,
where if the optical assembly is applied to a transmit optical path, the light splitting
surface is configured to reflect a part of incident rays to the MPD, and transmit
the other part of the incident rays; and the total reflection device is configured
to reflect, to the fiber connected to the fiber connection portion, the incident rays
transmitted by the light splitting surface.
[0033] In this embodiment, the light processing portion is configured to process the incident
rays, and the optical assembly 33 is the optical assembly shown in FIG. 2. Specifically,
a first lens and a second lens are further disposed in the light processing portion,
where the first lens is disposed at a position from which the incident rays enter
an optical path, and is configured to refract dispersed incident rays to parallel
incident rays; and the second lens is disposed on an optical path that is obtained
after reflection by the total reflection device, and is configured to focus the incident
rays reflected by the total reflection device.
[0034] Optically, the optical module circuit 31 further includes a laser, where the laser
is configured to generate the incident rays.
[0035] In addition, all key chips are placed on the substrate 32, which may be a PCB, a
flexible substrate, a ceramic substrate, or an organic substrate.
[0036] The optical assembly 33 in this application may be effectively applied to a pluggable
module, and an application example of the pluggable module is a small form-factor
pluggable (English: Small Form-factor Pluggable, SFP for short) optical module shown
in FIG. 4. The optical assembly 33 may be directly placed on a PCB in the SFP, and
directly externally connected to an LC plug, and internally connected to the laser
or a receiver chip. In this embodiment, the laser and a driver (or the receiver chip
and a trans-impedance-amplifier (English: trans-impedance-amplifier, TIA for short))
in a transmit part are placed under the main body of the optical assembly and on the
module PCB. Using the transmit part as an example, a board on which the module is
located inputs an electrical signal to the driver by using an electrical interface
of the module, and the driver drives the laser after receiving the signal, so that
the laser sends an optical signal. A path on a receive side is precisely reverse.
At an end of an optical transmission system, an LC fiber sends an optical chip, which
is transferred to the optical assembly part in this application, and separately output
to the receiver chip in a photodetector (PD). After being amplified by the TIA, a
received chip is output to the electrical interface of the module, and is finally
processed on the board on which the module is located.
[0037] FIG. 5 is a schematic diagram of an optical path in an embodiment of an optical module
according to the present invention. As shown in FIG. 5, the optical assembly 33 not
only may be applied to a transmit optical path, but also may be applied to a receive
optical path. If the optical assembly 33 is applied to the receive optical path, the
optical module circuit further includes a PD, where the light splitting surface is
configured to reflect received rays to the PD.
[0038] Based on the foregoing embodiments, the optical assembly may be further effectively
applied to a module, for example, a cascaded wavelength multiplexing scenario. Specifically,
as shown in FIG. 5, transmitted rays and received rays have different wavelengths,
and a filter is designed to perform transmission for one wavelength, and perform reflection
for another wavelength, thereby implementing a BiDi transmission function. For example,
in the figure, for the transmit optical path, when dispersed rays are input to the
optical assembly, the rays are turned into parallel rays by a curved lens. The parallel
rays are reflected by a reflection sheet, then are transmitted by the filter, and
are input to a fiber after being focused once by a lens.
[0039] For the receive optical path, after light output from the fiber is collimated by
the lens, due to a 45-degree included angle formed between the light splitting surface
(that is, a C surface in the figure) and the horizontal plane, the rays output by
the fiber are reflected downward by the light splitting surface according to a total
reflection effect, and are input to the PD after being focused once by the lens.
[0040] Application of the optical assembly of this application includes a reverse design
of receiving and transmission, for example, positions of the laser and the PD are
exchanged, and the C surface is turned into a sloping surface, where a same principle
is used.
[0041] According to the optical module provided in this embodiment, an improved optical
module is applied to a transmit optical path or a receive optical path, a total reflection
device is directly disposed in a light processing portion, and a light splitting surface
is disposed to transmit a part of incident rays to the total reflection device, where
the incident rays are reflected to a connected fiber by the total reflection device,
and the light splitting surface may directly reflect a small part of the incident
rays to an MPD for testing. In this way, an optical path is relatively short, and
package can be performed by means of a COB, thereby decreasing a size of an optical
assembly, and implementing miniaturization of the optical module to which the optical
assembly is applied. In addition, a transmit optical power monitoring function is
integrated, which can implement a module digital monitoring function, and can implement
a wavelength division multiplexing function by means of multistage cascading.
[0042] Finally, it should be noted that the foregoing embodiments are merely intended for
describing the technical solutions of the present invention, but not for limiting
the present invention. Although the present invention is described in detail with
reference to the foregoing embodiments, persons of ordinary skill in the art should
understand that they may still make modifications to the technical solutions described
in the foregoing embodiments or make equivalent replacements to some or all technical
features thereof, without departing from the scope of the technical solutions of the
embodiments of the present invention.
1. An optical assembly, wherein the assembly comprises: a main body (21) and a total
reflection device (22), wherein
the main body (21) comprises a fiber connection portion (211) and a light processing
portion (212), wherein the fiber connection portion (211) is connected to the light
processing portion (212);
the fiber connection portion (211) is connected to an external fiber; and
a light splitting surface (2121) is disposed in the light processing portion (212),
wherein the light splitting surface (2121) is configured to reflect a part of incident
rays to a monitor photodetector MPD, and transmit the other part of the incident rays;
and the total reflection device (22) is disposed in the light processing portion (212),
configured to reflect, to the fiber connected to the fiber connection portion (211),
the incident rays transmitted by the light splitting surface (2121), characterized in that
the light splitting surface (2121) is in contact with the total reflection device
(22).
2. The optical assembly according to claim 1, wherein a first lens and a second lens
are further disposed in the light processing portion, wherein the first lens is disposed
at a position from which the incident rays enter an optical path, and is configured
to refract dispersed incident rays to parallel incident rays; and the second lens
is disposed on an optical path that is obtained after reflection by the total reflection
device, and is configured to focus the incident rays reflected by the total reflection
device.
3. The optical assembly according to claim 1 or 2, wherein the total reflection device
comprises a reflection sheet or a total reflection profile.
4. The optical assembly according to claim 3, wherein an angle range of a first included
angle between a reflective surface of the total reflection device and the incident
rays is 30 degrees to 60 degrees.
5. The optical assembly according to claim 4, wherein the first included angle is 45
degrees.
6. The optical assembly according to any one of claims 1 to 5, wherein an angle range
of a second included angle between a plane on which the light splitting surface is
located and the incident rays is 45 degrees to 90 degrees.
7. The optical assembly according to any one of claims 1 to 6, wherein the main body
is in an integrally formed structure.
8. An optical module, wherein the module comprises: an optical module circuit, a substrate,
and an optical assembly according to claim 1, wherein the optical module circuit comprises
a monitor photodetector MPD, and the optical module circuit and the optical assembly
are disposed on the substrate.
9. The optical module according to claim 8, wherein a first lens and a second lens are
further disposed in the light processing portion, wherein the first lens is disposed
at a position from which the incident rays enter an optical path, and is configured
to refract dispersed incident rays to parallel incident rays; and the second lens
is disposed on an optical path that is obtained after reflection by the total reflection
device, and is configured to focus the incident rays reflected by the total reflection
device.
10. The optical module according to claim 8 or 9, wherein the optical module circuit further
comprises a laser, wherein the laser is configured to generate the incident rays.
11. The optical module according to any one of claims 8 to 10, wherein the optical module
circuit further comprises a photodetector PD, wherein the light splitting surface
is configured to reflect received rays to the PD.
1. Optische Baugruppe, wobei die Baugruppe folgendes umfasst: einen Hauptkörper (21)
und eine Totalreflexionsvorrichtung (22), wobei
der Hauptkörper (21) einen ersten Faserverbindungsteil (211) und einen Lichtverarbeitungsteil
(212) umfasst, wobei der Faserverbindungsteil (211) mit dem Lichtverarbeitungsteil
(212) verbunden ist;
der Faserverbindungsteil (211) mit einer externen Faser verbunden ist; und
eine Lichtteilungsoberfläche (2121) in dem Lichtverarbeitungsteil (212) angeordnet
ist, wobei die Lichtteilungsoberfläche (2121) zum Reflektieren eines Teils von einfallenden
Strahlen zu einem Überwachungsfotodetektor MPD und Transmittieren des anderen Teils
der einfallenden Strahlen konfiguriert ist; und
die Totalreflexionsvorrichtung (22) in dem Lichtverarbeitungsteil (212) angeordnet
ist, zum Reflektieren der einfallenden Strahlen, die durch die Lichtteilungsoberfläche
(2121) transmittiert werden, zu der Faser, die mit dem Faserverbindungsteil (211)
verbunden ist, konfiguriert ist, dadurch gekennzeichnet, dass
sich die Lichtteilungsoberfläche (2121) in Kontakt mit der Totalreflexionsvorrichtung
(22) befindet.
2. Optische Baugruppe nach Anspruch 1, wobei eine erste Linse und eine zweite Linse ferner
in dem Lichtverarbeitungsteil angeordnet sind, wobei die erste Linse bei einer Position
angeordnet ist, von der die einfallenden Strahlen in einen optischen Pfad eintreten,
und dazu konfiguriert ist, ein zerstreute einfallende Strahlen zu parallelen einfallenden
Strahlen zu brechen; und wobei die zweite Linse in einem optischen Pfad angeordnet
ist, der nach einer Reflexion durch die Totalreflexionsvorrichtung erhalten wird,
und dazu konfiguriert ist, die einfallenden Strahlen, die durch die Totalreflexionsvorrichtung
reflektiert werden, zu fokussieren.
3. Optische Baugruppe nach Anspruch 1 oder 2, wobei die Totalreflexionsvorrichtung eine
Reflexionsplatte oder ein Totalreflexionsprofil umfasst.
4. Optische Baugruppe nach Anspruch 3, wobei ein Winkelbereich des ersten eingeschlossenen
Winkels zwischen einer reflektierenden Oberfläche der Totalreflexionsvorrichtung und
den einfallenden Strahlen 30 Grad bis 60 Grad beträgt.
5. Optische Baugruppe nach Anspruch 4, wobei der erste eingeschlossene Winkel 45 Grad
beträgt.
6. Optische Baugruppe nach einem der Ansprüche 1 bis 5, wobei ein Winkelbereich eines
zweiten eingeschlossenen Winkels zwischen einer Ebene, auf der sich die Lichtteilungsoberfläche
befindet, und den einfallenden Strahlen 45 Grad bis 90 Grad beträgt.
7. Optische Baugruppe nach einem der Ansprüche 1 bis 6, wobei sich der Hauptkörper in
einer integral gebildeten Struktur befindet.
8. Optisches Modul, wobei das Modul Folgendes umfasst: einen Optikmodulschaltkreis, ein
Substrat und eine optische Baugruppe nach Anspruch 1, wobei der Optikmodulschaltkreis
einen Überwachungsfotodetektor MPD umfasst und der Optikmodulschaltkreis und die optische
Baugruppe auf dem Substrat angeordnet sind.
9. Optisches Modul nach Anspruch 8, wobei eine erste Linse und eine zweite Linse ferner
in dem Lichtverarbeitungsteil angeordnet sind, wobei die erste Linse bei einer Position
angeordnet ist, von der die einfallenden Strahlen in einen optischen Pfad eintreten,
und dazu konfiguriert ist, zerstreute einfallende Strahlen zu parallelen einfallenden
Strahlen zu brechen; und wobei die zweite Linse in einem optischen Pfad angeordnet
ist, der nach einer Reflexion durch die Totalreflexionsvorrichtung erhalten wird,
und dazu konfiguriert ist, die einfallenden Strahlen, die durch die Totalreflexionsvorrichtung
reflektiert werden, zu fokussieren.
10. Optisches Modul nach Anspruch 8 oder 9, wobei der Optikmodulschaltkreis ferner einen
Laser umfasst, wobei der Laser dazu konfiguriert ist, die einfallenden Strahlen zu
erzeugen.
11. Optisches Modul nach einem der Ansprüche 8 bis 10, wobei der Optikmodulschaltkreis
ferner einen Fotodetektor PD umfasst, wobei die Lichtteilungsoberfläche dazu konfiguriert
ist, empfangene Strahlen zu dem PD zu reflektieren.
1. Ensemble optique, dans lequel l'ensemble comprend : un corps principal (21) et un
dispositif à réflexion totale (22), dans lequel
le corps principal (21) comprend une partie de connexion de fibre (211) et une partie
de traitement de la lumière (212), dans lequel la partie de connexion de fibre (211)
est connectée à la partie de traitement de la lumière (212) ;
la partie de connexion de fibre (211) est connectée à une fibre externe ; et
une surface de séparation de la lumière (2121) est disposée dans la partie de traitement
de la lumière (212),
dans lequel la surface de séparation de la lumière (2121) est configurée pour réfléchir
une partie des rayons incidents sur un photodétecteur de surveillance MPD (monitor
photodetector) et transmettre l'autre partie des rayons incidents ; et le dispositif
à réflexion totale (22) est disposé dans la partie de traitement de la lumière (212),
configuré pour réfléchir, sur la fibre connectée à la partie de connexion de fibre
(211), les rayons incidents transmis par la surface de séparation de la lumière (2121),
caractérisé en ce que la surface de séparation de la lumière (2121) est en contact avec le dispositif à
réflexion totale (22).
2. Ensemble optique selon la revendication 1, dans lequel une première lentille et une
seconde lentille sont en outre disposées dans la partie de traitement de la lumière,
dans lequel la première lentille est disposée dans une position à partir de laquelle
les rayons incidents pénètrent dans un chemin optique, et est configurée pour réfracter
des rayons incidente dispersée en des rayons incidents parallèles ; et la seconde
lentille est disposée sur un chemin optique qui est obtenu après réflexion par le
dispositif à réflexion totale et est configurée pour focaliser les rayons incidents
réfléchis par le dispositif à réflexion totale.
3. Ensemble optique selon la revendication 1 ou 2, dans lequel le dispositif à réflexion
totale comprend une feuille de réflexion ou un profil de réflexion totale.
4. Ensemble optique selon la revendication 3, dans lequel une plage d'angle d'un premier
angle inclus entre une surface réfléchissante du dispositif à réflexion totale et
les rayons incidents est comprise entre 30 et 60 degrés.
5. Ensemble optique selon la revendication 4, dans lequel le premier angle inclus est
égal à 45 degrés.
6. Ensemble optique selon l'une quelconque des revendications 1 à 5, dans lequel une
plage d'angle d'un second angle inclus entre un plan sur lequel se trouve la surface
de séparation de la lumière et les rayons incidents est comprise entre 45 et 90 degrés.
7. Ensemble optique selon l'une quelconque des revendications 1 à 6, dans lequel le corps
principal se trouve dans une structure réalisée en un seul bloc.
8. Module optique, dans lequel le module comprend : un circuit de module optique, un
substrat et un ensemble optique selon la revendication 1,
dans lequel le circuit de module optique comprend un photodétecteur de surveillance
MPD, et le circuit de module optique et l'ensemble optique sont disposés sur le substrat.
9. Module optique selon la revendication 8, dans lequel une première lentille et une
seconde lentille sont en outre disposées dans la partie de traitement de la lumière,
dans lequel la première lentille est disposée dans une position à partir de laquelle
les rayons incidents pénètrent dans un chemin optique, et est configurée pour réfracter
des rayons incidente dispersée en des rayons incidents parallèles ; et la seconde
lentille est disposée sur un chemin optique qui est obtenu après réflexion par le
dispositif à réflexion totale et est configurée pour focaliser les rayons incidents
réfléchis par le dispositif à réflexion totale.
10. Module optique selon la revendication 8 ou 9, dans lequel le circuit de module optique
comprend en outre un laser, dans lequel le laser est configuré pour générer les rayons
incidents.
11. Module optique selon l'une quelconque des revendications 8 à 10, dans lequel le circuit
de module optique comprend en outre un photodétecteur PD, dans lequel la surface de
séparation de la lumière est configurée pour réfléchir les rayons reçus vers le PD.