TECHNICAL FIELD
[0001] The technical field generally relates to catalytic methods for CO
2 reduction, and more particularly to electrocatalysts composed of Cu-Al multi-metallic
material and associated methods of manufacture and use in electrochemical CO
2 reduction.
BACKGROUND
[0002] The efficient electrochemical conversion of carbon dioxide (CO
2) into valuable carbon-based fuels and compounds is desirable and technology that
enhances such conversion can, for example, enable the storage of intermittent renewable
electricity as well as net reductions of greenhouse gas emissions. Copper has been
the predominant electrocatalyst for the production of multi-carbon products. However,
achieving high selectivity and productivity to certain desired chemicals (e.g., ethylene,
a highly demanded industrial feedstock) has failed to meet requirements of practical
operation (e.g., current density over 250 mA cm
-2, applied cell voltage below 3 V, Faradaic efficiency to one certain desired product
at least above 70%).
[0003] US2018057950 describes methods for electrochemically reducing carbon dioxide to provide a product.
The methods can comprise contacting the carbon dioxide with an electroreduction catalyst
in an electrochemical cell, and applying a potential to the electrochemical ceil to
form the product. The electroreduction catalyst can comprise a nanoporous Cu catalyst,
a nanoporous Cu-M catalyst, or a combination thereof, where M is a metal chosen from
Pt, Ir, Pd, Ag, Au, Rh, Ru, Zn, Sn, Ni, Fe, Re, Ga, In, Cd, Tl, and Ti. The product
can comprise a C2-C3 alkane, a C2-C3 alkene, a C2-C3 alcohol, a C2-C3 carboxylic acid,
a C2-C3 aldehyde, or a combination thereof.
[0004] AU2016305184 relates to a gas diffusion electrode comprising a, preferably copper-containing,
carrier and a first layer having at least copper and at least one binder, wherein
the first layer has hydrophilic and hydrophobic pores and/or channels, further comprising
a second layer having copper and at least one binder, wherein the second layer is
located on the carrier and the first layer is located on the second layer, wherein
the binder content in the first layer is less than in the second layer. This document
further relates to a method for producing a gas diffusion electrode of this type and
an electrolysis cell comprising a gas diffusion electrode of this type.
[0005] US2015056385 is about a Cu wiring structure forming method. In such a method, a barrier film serving
as a Cu diffusion barrier is formed at least on a surface of a recess in a first insulating
film formed on a substrate, and the recess is filled with an Al-containing Cu film.
A Cu wiring is formed from the Al-containing Cu film, and a cap layer including a
Ru film is formed on the Cu wiring. Further, an interface layer containing a Ru-AI
alloy is formed at an interface between the Cu wiring and the cap layer by heat generated
in forming the cap layer or by a heat treatment performed after forming the cap layer.
A second insulating film is formed on the cap layer.
[0006] There is a need for improved techniques and catalyst materials for efficient electrochemical
CO
2 reduction and related methods and systems of producing chemical compounds.
SUMMARY
[0007] Multi-metal electrocatalysts for reduction of CO
2 to produce multi-carbon compounds can include Cu and at least one metal selected
from Ge, Ga, Sn, Si, Ag, Au, Zn and Al. With preference, they include a Cu-Al material
that may be de-allowed and formed as a catalytic layer on a gas diffusion membrane.
The multi-metal Cu-Al material can include 1 wt% to 50 wt% Al and 50 wt% to 99 wt%
Cu, for example. The Al can be ion-implanted into the Cu or Al can be evaporated into
the Cu and remains after chemical etching. The electrocatalyst can have a surface
region that is nanoporous. Other multi-metal electrocatalyst compositions are also
possible. The electrocatalysts can have various properties, structural features, chemical
compositions and their chemical states as will be described in detail further below.
[0008] The electrocatalysts can be implemented in electrocatalytic reduction of CO
2 into at least one multi-carbon compound, such as ethylene. The electrocatalytic reduction
of CO
2 can be performed in an alkaline medium, such as potassium hydroxide.
[0009] The electrocatalysts can be manufactured by vapour-phase deposition of Al onto a
Cu surface and chemically etching the metallic alloy to produce a de-alloyed Cu-Al
material, or by ion-implanting Al into Cu, for example.
[0010] The electrocatalysts and associated methods and uses have been found to provide advantageous
functionality related to the production of electrocatalytic reduction of CO
2 into multi-carbon compounds.
[0011] Therefore, according to a first aspect, the invention provides for an electrocatalyst
for reduction of CO
2 to produce multi-carbon compounds, remarkable in that the electrocatalyst comprises
a multi-metal material comprising a primary metal being copper (Cu) and at least one
enhancer metal being aluminium (Al), so the electrocatalyst comprises a multi-metal
Cu-Al material being formed as a catalytic layer and comprises a surface region having
a thickness between 1 nm and 3 nm as determined by Auger electron spectroscopy and
in that at least the surface region is nanoporous and comprises an Al content of 3
wt% to 30 wt% and a Cu content of 70 wt% to 97 wt%..
[0012] In a preferred embodiment, the invention provides for an electrocatalyst for reduction
of CO
2 to produce multi-carbon compounds, remarkable in that the electrocatalyst comprises
a multi-metal Cu-Al material. With preference, the multi-metallic Cu-Al material consists
of Cu and Al.
[0013] Surprisingly, the Inventors have found a new CO
2 electroreduction Cu-based catalyst, such as comprising a Cu-Al multi-metal material
with varying ratios of Al concentrations on surface, that shows superior CO
2 electroreduction activity to valuable multi-carbon products (e.g. ethylene).
[0014] The inventors then developed a physical vapor deposition and chemical etching process
to scalably fabricate nanoporous Cu-Al catalysts that enable highly selective production
of ethylene with a record CO
2-to-ethylene Faradaic efficiency of 80% at an unprecedently high applied current density
of 600 mA cm
-2 (-1.8 to -2.1 V vs. RHE) in a flow cell system. This result vastly improves the CO
2-to-ethylene selectivity and stability with a fairly high half-cell electricity-to-ethylene
power conversion efficiency of 30% which readily meets the requirements of practical
operation.
[0015] The inventors find out that Cu-Al alloys provide multiple sites and surface orientations
that exhibit optimal CO adsorption energies near the top of the activity volcano plot
for CO
2 reduction.
In situ X-ray absorption further reveals how Cu and Al enable a favourable Cu coordination
environment that enhances C-C dimerization, the rate-determining step from CO
2 to C2 products.
[0016] With preference, the one or more following features can be used to further define
the multi-metal Cu-Al material:
- The multi-metal Cu-Al material is a de-alloyed Cu-Al material.
- The multi-metal Cu-Al material comprises from 1 wt% to 50 wt% of Al based on the total
weight of the multi-metal Cu-Al material, preferably from 2 wt% to 40 wt% of Al, more
preferably from 3 wt% to 30 wt% of Al.
- The multi-metal Cu-Al material comprises from 50 wt% to 99 wt% of Cu, based on the
total weight of the multi-metal Cu-Al material, preferably from 80 wt% to 98 wt%,
more preferably from 70 wt% to 97 wt% Cu.
[0017] In an embodiment, the multi-metal Cu-Al material comprises Cu doped with Al. In another
embodiment, the multi-metal Cu-Al material comprises Al doped with Cu.
[0018] With preference:
- the electrocatalyst comprises a gas diffusion membrane; and/or
- the catalytic layer is formed directly on a gas diffusion membrane; and/or
- the catalytic layer has a thickness between 1 nm and 5000 nm as determined by cross-sectional
scanning electron microscopy; preferably 10 to 5000 nm.
[0019] The invention uses thermal evaporation or co-sputtering to deposit the catalyst layer
on the gas diffusion membrane. For the thermal evaporation, the thickness of the catalyst
layer is monitored with a film-thickness sensor during the deposition. For the co-sputtering,
the depositing rate of each catalyst material is first measured by depositing it on
flat Si substrates under the same deposition conditions used for depositing the catalyst
layer on the gas diffusion membrane. Once the deposition rate of each material is
known, the film thickness can be controlled by its deposition time.
[0020] The thickness of the catalytic layer can also be determined by cross-sectional scanning
electron microscopy (SEM).
[0021] One or more of the following features can be used to better define the catalyst layer:
- The catalyst layer has a thickness ranging between 10 and 1500 nm as determined by
cross-sectional scanning electron microscopy (SEM)
- The catalyst layer has a thickness of at least 15 nm as determined by cross-sectional
scanning electron microscopy (SEM), preferably at least 50 nm, and more preferably
of at least 100 nm.
- The catalyst layer has a thickness of at most 1200 nm as determined by cross-sectional
scanning electron microscopy (SEM), preferably of at most 1000 nm, and more preferably
of at most and 500 nm.
[0022] According to the invention the Cu-Al catalyst can be of two types:
- In a first embodiment, the multi-metal Cu-Al material used as Cu-Al catalyst is produced
by first depositing Cu-Al alloy on a gas diffusion layer and then de-alloying the
Cu-Al alloy by chemical etching. After de-alloying, the multi-metal Cu-Al catalyst
is in a porous structure. A certain amount of Al (1-50 wt% Al, 3-30 wt% Al in the
optimal case) is present on the catalyst surface.
- In a second embodiment, the multi-metal Cu-Al material used as Cu-Al catalyst is produced
by first depositing a Cu catalyst layer on a gas diffusion layer and then ion-implanting
Al into the Cu layer to make a Cu-Al surface.
[0023] In a preferred embodiment, the Cu and Al in the multi-metal Cu-Al material are morphologically
stable after five hours of electroreduction reaction in alkaline electrolyte.
[0024] With preference, Al concentration in the multi-metal Cu-Al material is stable after
five hours of electroreduction reaction in alkaline electrolyte.
[0025] The multi-metal Cu-Al catalyst is both morphologically and compositionally stable
after five hours of electroreduction reaction in the alkaline electrolyte. The Cu-Al
material shows a very similar porous morphology with pore diameters of 5-50 nm before
and after the chemical reaction in the alkaline electrolyte. The Cu and Al concentrations
on the Cu-Al catalyst surface is almost unchanged (concentration variation within
5 wt%) before and after the chemical reaction.
[0026] With preference, one or more of the following is true:
- At least the surface region consists of Cu and Al.
- At least the surface region has pores that have pore diameters ranging from 1 nm to
100 nm, or from 5 nm to 20 nm as determined HRTEM and HAADF analysis.
- At least the surface region has a homogeneous distribution of Al and Cu.
[0027] In a preferred embodiment, the Cu in at least the surface region is Cu (111); with
preference, the Al content in the Cu (111) is about 8 wt% to about 15 wt%, or about
11 wt% to about 13 wt%.
[0028] In another embodiment, the Cu in at least the surface region is Cu (100); with preference,
the Al content in the Cu (100) is about 3 wt% to about 15 wt%.
[0029] With preference, the enhancer metal increases catalytic site density with decreased
reaction energy for the C-C dimerization; with preference, the reaction energy for
the C-C dimerization is decreased by 0.3 eV to 0.7 eV.
[0030] With preference, the multi-metal material comprises enhancer metal-terminated pores.
[0031] According to a second aspect, the invention provides the use of the electrocatalyst
as defined in the first aspect, for electrocatalytic reduction of CO
2 into at least one multi-carbon compound. Preferably, the at least one multi-carbon
compound comprises ethylene.
[0032] In a preferred embodiment, the electrocatalytic reduction of CO
2 is performed in an alkaline medium; with preference, the alkaline medium comprises
potassium hydroxide.
[0033] In a further preferred embodiment, the electrocatalytic reduction of CO
2 is performed in a three-electrode flow-cell.
[0034] According to a third aspect, the invention provides a process for electrochemical
production of a multi-carbon compound from CO
2, comprising:
- contacting CO2 gas and an electrolyte with an electrode comprising the electrocatalyst as defined
in any one of the first aspect such that the CO2 contacts the electrocatalyst;
- applying a voltage to provide a current density to cause the CO2 gas contacting the electrocatalyst to be electrochemically converted into the multi-carbon
compound; and
- recovering the multi-carbon compound.
[0035] The one or more following features can be further used to further define the process
according to the third aspect:
- The current density provided in the current collection structure is predetermined
for selective electrochemical conversion of the CO2 into a target multi-carbon compound.
- The target multi-carbon compound is ethylene or an alcohol.
- The electrolyte comprises an alkaline compound.
- The electrolyte comprises KOH and/or other alkaline solutions.
- The process is conducted in a three-electrode flow-cell.
[0036] According to a fourth aspect, the invention provides a system for CO
2 electroreduction to produce multi-carbon hydrocarbons, comprising:
- an electrolytic cell configured to receive a liquid electrolyte and CO2 gas;
- an anode;
- a cathode comprising an electrocatalyst as defined in any one of the first aspect
and
- a voltage source to provide a current density to cause the CO2 gas contacting the electrocatalyst to be electrochemically converted into the multi-carbon
hydrocarbon, which is optionally ethylene or an alcohol.
[0037] According to a fifth aspect, the invention provides a method of manufacturing the
electrocatalyst as defined in any one of the first aspect comprising vapour-phase
deposition followed by chemical etching or ion-implanting.
[0038] According to an sixth aspect, the invention provides a method of manufacturing an
electrocatalyst for reduction of CO
2 to produce multi-carbon compounds, the method comprising:
- producing a metallic material comprising Cu and Al; and
- subjecting the metallic material to chemical etching to remove a portion of the Al
from a surface region of the metallic alloy to produce a de-alloyed Cu-Al material.
[0039] In a preferred embodiment, the method comprises producing the metallic material comprises
vapour-phase deposition of Al onto a Cu surface; with preference:
- the vapour-phase deposition comprising evaporating solid Al and forming a deposited
Al layer on the Cu surface to form an evaporated AI-on-Cu material.
- the deposited Al layer has a thickness of about 50 to 150 nm as determined by cross-sectional
scanning electron microscopy.
- the evaporating of the solid Al is performed at an evaporation rate of approximately
1-10 nm s-1, 1-5 nm s-1 or 1-2 nm s-1.
- the evaporating of the solid Al is performed at under a base pressure of about 10-5 to 10-8 Torr (133.32 × 10-5 to 133.32 × 10-8 Pa).
[0040] In a preferred embodiment, the method comprises producing the metallic material comprises
vapour-phase deposition of Al onto a Cu surface; with preference:
- the chemical etching comprises immersing the evaporated Al-on-Cu material into an
acidic solution to remove Al.
- the acidic solution comprises hydrochloric acid solution.
- the hydrochloric acid solution comprises from 1 to 20 wt% of hydrochloric acid, preferably
from 1 to 10 wt% of hydrochloric acid, more preferably from 1 to 5 wt% hydrochloric
acid.
- The method further comprising, after chemical etching, washing with water to remove
the acidic solution; with preference, further comprising, after washing, air drying
to remove water.
- The method further comprising, prior to producing the metallic alloy comprising the
Cu and Al, depositing Cu on a gas diffusion layer (GDL).
- the Cu is deposited by thermal evaporation onto the GDL.
- the Cu forms a deposited Cu layer on the GDL.
- the deposited Cu layer has a thickness of about 400 to 600 nm as determined by cross-sectional
scanning electron microscopy.
[0041] In a preferred embodiment, producing the metallic material comprises co-evaporation
of Al and Cu to form a Cu-Al alloy; with preference:
- The method further comprises depositing a layer of the Cu-Al alloy onto a gas diffusion
layer (GDL) prior to the chemical etching.
- The method further comprises cooling the deposited Cu-Al alloy prior to chemical etching.
- The chemical etching comprises immersing the Cu-Al alloy in an acidic solution to
remove Al; preferably, the acidic solution comprises hydrochloric acid solution, and/or
the method further comprises, after chemical etching, washing with water to remove
the acidic solution.
[0042] According to a seventh aspect, the invention provides a method of manufacturing an
electrocatalyst for reduction of CO
2 to produce multi-carbon compounds, the method comprising ion-implanting Al into Cu.
DESCRIPTION OF FIGURES
[0043]
Figure 1: Screening of Cu and Cu based compounds using computational methods. a, DFT-calculated
CO adsorption energies (ΔEco) of the surfaces. Energies are plotted on a volcano-shaped scaling relationship.
Random noise was added to the (ΔEco) values to distinguish different points more effectively. b, t-SNE representation
of 3,494 adsorption sites that the method performed DFT calculations on. All Cu-Al
clusters are labelled numerically. c, Representative coordination sites for each of
the clusters labelled in the t-SNE diagram.
Figure 2: Schematic and characterization of de-alloyed Cu-Al catalyst, a, Schematic of a de-alloyed
nanoporous Cu-Al catalyst on a gas diffusion layer for CO2 electroreduction. b, Scanning electron microscopy (SEM) and high angle angular dark
field-scanning transmission electron microscopy (HAADF-STEM) images of de-alloyed
Cu-Al catalyst before (left) and after (right) 5 hours CO2 electroreduction at an applied current density of 600 mA cm-2 in flow cells. The scale bars for SEM images are 500 nm (top-left) and 200 nm (top-right).
The scale bars for TEM images are 200 nm (bottom-left) and 100 nm (bottom-right).
c, HAADF-STEM image, and electron energy loss spectroscopy (EELS) spectra of the de-alloyed
Cu-Al catalyst. #1, 2, 3 curves in the EELS spectra represent the EELS results measured
at #1, 2, 3 areas in the corresponding HAADF-STEM image. Al, Al2O3, CuO, Cu2O and Cu EELS results are plotted as references. The scale bar is 5 nm.
Figure 3: Analyses of (111) and (100) facets across varying ratios of Al concentrations. a,
b, The distribution of ΔEco values for the adsorption sites on Cu (111) and (100) surfaces with different amounts
of Al replacement on the top layer of atoms.
Figure 4: CO2 electroreduction performance on de-alloyed Cu-Al, porous Cu and deposited Cu catalysts.
a, Faradaic efficiencies for gaseous products with de-alloyed Cu-Al catalysts at different
applied current densities and with nanoporous Cu and evaporated Cu catalysts at a
constant current density of 600 mA cm-2 obtained using chronopotentiometry. b, Faradaic efficiencies for all products at
an applied current density of 600 mA cm-2 with 17 de-alloyed Cu-AI samples measured. c, Current-potential curves with de-alloyed
Cu-Al, nanoporous Cu and evaporated Cu catalysts obtained from linear sweep voltammetry
scans. d, C2H4 production partial current density vs. potential with de-alloyed Cu-Al, nanoporous
Cu and evaporated Cu catalysts. e, The CO2 electroreduction activity of a de-alloyed Cu-Al catalyst at an applied current density
of 600 mA cm-2. Left axis: potential (V vs. RHE) vs. time (s), right axis: C2H4 Faradaic efficiency (%) vs. time (s).
Figure 5: a, Faradaic efficiencies of CO2 reduction to CO, H2, CH4 and C2H4 with Cu, Al-on-Cu (ion implant) and Al-on-Cu (evap. + etch); b, C2H4 partial current density versus potential with Cu, Al-on-Cu (ion implant) and Al-on-Cu
(evap. + etch); c, SEM images of Al-on-Cu (ion implant) before and after 5 hours CO2 RR reaction; d, SEM images of Al-on-Cu (evap. + etch) before and after 5 hours CO2 RR reaction.
Figure 6: a, Faradaic efficiencies of CO2 reduction to CO, H2, CH4 and C2H4 with de-alloyed Cu-Al at different current densities and with porous Cu and Cu at
600 mA cm-2; b, Faradaic efficiency of CO2 reduction to CO, H2, CH4, C2H4, C2H5OH, formic, n-propanol with de-alloyed Cu-Al; c, CO2 reduction activity of de-alloyed Cu-Al at 600 mA cm-2; d, SEM, TEM and EDX images of de-alloyed Cu-Al before and after 5 hours CO2 RR reaction.
Figure 7: a-b, In situ X-ray absorption near-edge structure (XANES) spectra of de-alloyed Cu-AI
catalyst before, during and after CO2 electroreduction tests and ex-situ XANES spectra of Cu foil, Cu2O, CuO. c-d, In situ X-ray absorption near-edge structure (XANES) spectra of pure
Cu catalyst before and during CO2 electroreduction tests and ex-situ XANES spectra of Cu foil.
Figure 8: Schematic for the synthesis of different catalysts on gas diffusion layers. a, evaporated
Cu. b, ion-implanted Al-on-Cu. c, evaporated-etched Al-on-Cu. d, de-alloyed Cu-AI
catalysts.
Figure 9: Morphologies of evaporated Cu catalysts on gas diffusion layers. a, Top-view SEM
images before CO2 electroreduction. b, Top-view SEM images after 5 hours CO2 electroreduction in 1 M KOH at an applied current density of 600 mA cm-2 in a flow cell.
Figure 10: Morphologies of ion-implanted Al-on-Cu catalysts on gas diffusion layers. a, Top-view
SEM images before CO2 electroreduction. b, Top-view SEM images after 5 h CO2 electroreduction in 1 M KOH at an applied current density of 600 mA cm-2 in a flow cell.
Figure 11: Morphologies of evaporated and evaporated-etched Al-on-Cu samples on gas diffusion
layers. a, Top-view SEM images of the as-evaporated Al-on-Cu samples. b, Top-view
SEM images of the evaporated-etched Al-on-Cu catalyst before CO2 electroreduction, c
Figure 12: Schematic of the cathode side in a flow-cell configuration.
Figure 13: CO2 electroreduction performances on pure Cu, ion-implanted Al-on-Cu, and evaporated-etched
Al-on-Cu catalysts. a, Faradaic efficiencies of gaseous products on pure Cu, ion-implanted,
and evaporated-etched Al-on-Cu obtained from chronopotentiometry tests at an applied
current density of 600 mA cm-2. b, C2H4 production partial current density versus potential on pure Cu, ion-implanted, and
evaporated-etched Al-on-Cu.
Figure 14: Auger electron spectroscopic analysis of an ion-implanted Al-on-Cu catalyst, a, Auger
secondary electron microscopic image. b, Auger spectroscopic narrow-scan spectra.
c, Concentrations of Cu and Al.
Figure 15: Auger electron spectroscopic analysis of an evaporated-etched Al-on-Cu catalyst.
a, Auger secondary electron microscopic image. b, Auger spectroscopic narrow-scan
spectra.
c, Concentrations of Cu and Al.
Figure 16: Pourbaix diagrams. Pourbaix diagrams of a, Cu and b, Al at ionic concentrations of
1 µM. The potentials versus the standard hydrogen electrode (V vs. SHE) can be converted
to the reversible hydrogen electrode scale (V vs. RHE) according to the Nernst equation,
V vs.
RHE = V vs. SHE + 0.059 × pH.
Figure 17: EDX analysis of an as-prepared ion-implanted Al-on-Cu sample before CO2 electroreduction. a, Elemental concentrations.
Figure 18: EDX analysis of an ion-implanted Al-on-Cu sample after 5 hours CO2 electroreduction. a, Elemental concentrations. Potassium is observed on the surface
after the reaction.
Figure 19: EDX analysis of an evaporated-etched Al-on-Cu sample before CO2 electroreduction. a, EDX mapping. b, Elemental concentrations. Chlorine is observed
on the surface due to the use of HCl solution in the etching process.
Figure 20: EDX analysis of an evaporated-etched Al-on-Cu sample after 5 hours CO2 electroreduction. a, EDX mapping. b, Elemental concentrations. Potassium was observed
on the surface after the reaction.
Figure 21: EDX analysis of a pure Cu catalyst after half-hour CO2 electroreduction in 1 M KOH with 1 mM Al(OH)4-. a, EDX mapping. b, Elemental concentrations. Fluorine was from the PTFE/carbon layer
in the gas diffusion electrode. Al was electrodeposited on Cu at an applied current
density of 600 mA cm-2. Therefore, dissolving Al into solution was avoided.
Figure 22: Auger electron spectroscopic analysis of a pure Cu catalyst after 0.5-hour CO2 electroreduction at 600 mA cm-2 in 1 M KOH with 1 mM Al(OH)-. a, Auger secondary electron microscopic image. b, Auger spectroscopic narrow-scan
spectra. c, Concentrations of Cu and Al.
Figure 23: CO2 electroreduction performance. Faradaic efficiencies for gaseous products with a pure
Cu catalyst at a constant current density of 600 mA cm-2 in 1 M KOH with the presence of 1 mM Al(OH)4- obtained from Chronopotentiometry tests.
Figure 24: EDX analysis of a pure Cu after immersing in 1 M KOH with 1 mM Al(OH)4- for 0.5 hour. a, EDX mapping. b, Elemental concentrations. The invention manually
selected Al and it was automatically marked in red by EDX software (Esprit 2.1) with
a large error of 43.81%, indicating Al was actually out of the EDX detecting limit.
As shown in the SEM image in Figure 19a, the morphology was also drastically changed.
Most of Cu dissolved into 1 M KOH leaving thin Cu(OH)2 nanowires to be dissolved.
Figure 25: Top-view SEM images of the de-alloyed Cu-Al catalyst at different magnifications.
Figure 26: EDX analyses in TEM of de-alloyed Cu-Al catalysts. a, as-prepared de-alloyed Cu-AI
catalyst, b, de-alloyed Cu-Al catalyst after 5 hours CO2 electroreduction in 1 M KOH at 600 mA cm-2 in a flow-cell configuration.
Figure 27: EDX analysis in SEM of the as-prepared de-alloyed Cu-Al catalyst before CO2 electroreduction. a, EDX mapping. b, Elemental concentrations. Chlorine was detected
because of the use of a 5 wt% HCl solution in the etching process to prepare a de-alloyed
Cu-AI catalyst.
Figure 28: EDX analysis in SEM of a de-alloyed Cu-Al catalyst after 5 hours CO2 electroreduction. a, EDX mapping. b, Elemental concentrations. Potassium was detected
because of the use of KOH electrolyte in CO2 electroreduction.
Figure 29: STEM-ADF image of the de-alloyed Cu-Al catalyst. The observation was performed in
the same area where the EELS analysis study was performed
Figure 30: Auger electron spectroscopic analysis of an as-prepared de-alloyed Cu-Al catalyst.
a, Auger secondary electron microscopic image. b, Auger spectroscopic narrow-scan
spectra. c, Concentrations of Cu and Al.
Figure 31: Auger electron spectroscopic analysis of a de-alloyed Cu-Al catalyst after 5 hours
CO2 electroreduction at 600 mA cm-2. a, Auger secondary electron microscopic image. b, Auger spectroscopic narrow-scan
spectra. c, Concentrations of Cu and Al.
Figure 32: Reaction Gibbs free energy diagram. Reaction Gibbs free energy diagram from adsorbed
CO2 to OC2H4, an intermediate to C2H4, and to CHOCH3, an intermediate to C2H5OH, on the pure Cu (111) surface (blue lines) and ML predicted 12% Al incorporated
Cu (111) surface (red lines). The ML predicted structure of 12% Al incorporated Cu
(111) is inserted in the lower left.
Figure 33: Reaction Gibbs free energy diagram. Reaction Gibbs free energy diagram from adsorbed
CO2 to OC2H4, an intermediate to C2H4, and to CHOCH3, an intermediate to C2H5OH, on the pure Cu (100) surface (blue lines) and ML predicted 4% Al incorporated
Cu (100) surface (red lines). The ML predicted structure of 4% Al incorporated Cu
(111) is inserted in the lower left.
Figure 34: De-alloyed Cu-Al with different surface Al concentrations. a, SEM images of de-alloyed
Cu-Al with different etching time. b, Al concentrations on surfaces determined by
surface-sensitive Auger electron spectroscopic analysis. Surface Al concentrations
could be roughly varied from 4-28% by controlling the etching time. c, Faradaic efficiencies
of C2+ and C2+/C1 ration with de-alloyed catalysts at different surface Al concentrations.
Figure 35: Half-cell electricity-to-ethylene power conversion efficiencies with de-alloyed Cu-Al
catalyst plotted at different current densities. The invention estimates the half-cell
power conversion efficiency using the equation:

where

Figure 36: SEM images of a de-alloyed Cu-Al catalyst soaked in 10 mM CuCl2 for 10 minutes. 10 minutes is an optimal time that the invention used to roughly
maintain nanoporosity while replacing surface Cu with Al by the displacement reaction
of 2Al + 3CuCl2 → 2AlCl3 + 3Cu. The invention also found that nanopores were gradually blocked by the precipitated
Cu with a prolonged CuCl2 treatment.
Figure 37: Auger electron spectroscopic analysis of a de-alloyed Cu-Al catalyst soaked in 10
mM CuCl2 solution for 0.5 hour. a, Auger secondary electron microscopic image. b, Auger spectroscopic
narrow-scan spectra. c, Concentrations of Cu and Al. The Al concentration calculated
from Al narrow-scan spectrum is already close to the AES detecting limit.
Figure 38: CO2 electroreduction performance. Faradaic efficiencies for all products at an applied
current density of 600 mA cm-2 obtained with of a de-alloyed Cu-Al catalyst after soaking in 10 mM CuCl2 solution for 10 minutes.
DETAILED DESCRIPTION
[0044] Techniques described herein relate to enhanced catalyst materials that can be used
for electrochemical CO
2 reduction and the production of multi-carbon compounds, and also to methods of manufacturing
such catalyst materials.
[0045] Figure 1 highlights that Cu-Al shows improved CO binding energy for better C-C dimerization.
Figure 5 reveals that ion-implanting Al into Cu shows a better CO
2-electrolysis performance than that of pure Cu. Figure 6 shows that de-alloyed Cu-Al
catalysts has a better CO
2-electrolysis performance than that of pure Cu.
The electrocatalyst
[0046] The invention provides an electrocatalyst for reduction of CO
2 to produce multi-carbon compounds. According to the invention, the electrocatalyst
comprises a multi-metal material comprising a primary catalyst material and an enhancer
material. The enhancer material is selected to modify the coordination of the primary
catalyst material in order to enhance the C-C dimerization. The multi-carbon compounds
preferably comprise, or consist of, ethylene.
[0047] According to the invention, the primary catalyst material is copper (Cu); and/or
the enhancer material is aluminium (Al).
[0048] Therefore, the electrocatalyst comprises, or consist of, a multi-metal Cu-Al material.
Indeed, the new Cu-Al based electrocatalyst materials according to the invention demonstrate
highly activity for electrochemical reduction of carbon dioxide to chemicals (e.g.,
ethylene).
[0049] In a preferred embodiment, in the multi-metal material, the primary catalyst material,
preferably comprising Cu or consisting of Cu, is predominant. Thus, the multi-metal
material comprises from 70 wt% to 97 wt% of the primary catalyst material, based on
the total weight of the multi-metal material.
[0050] In a preferred embodiment, the multi-metal material the enhancer material, preferably
comprising Al or consisting of Al, is present in a weight percentage that is inferior
to the weight percentage of the primary catalyst material. Thus, the multi-metal material
comprises from 3 wt% to 30 wt% of the enhancer material, based on the total weight
of the multi-metal material..
[0051] In another embodiment, the multi-metal material is formed as a catalytic layer. Therefore,
the invention provides an electrocatalyst comprising a catalytic layer and a gas diffusion
membrane; wherein the catalytic layer has a thickness ranging from 10 nm to 5000 nm
as determined by cross-sectional scanning electron microscopy; preferably from 2 nm
to 2500 nm; more preferably from 3 nm to 1000 nm. With preference, the catalytic layer
is formed directly on the gas diffusion membrane.
[0052] The gas diffusion membrane comprises a carbon-based material and/or is hydrophobic.
In an embodiment, the gas diffusion membrane includes a hydrophobic polymer-based
support such as polytetrafluoroethylene or similar polymers.
[0053] In an embodiment, the electrocatalyst described herein can be used as a catalyst
layer in a composite multilayered electrocatalyst (CME) that includes a polymer-based
gas-diffusion layer, a current collection structure, and the catalyst layer, sandwiched
in between. The current collection structure can include a carbon nanoparticle layer
applied against the catalyst layer, and a graphite layer applied against the nanoparticle
layer. In one possible implementation of the CME, it includes hydrophobic polymer-based
support such as polytetrafluoroethylene (PTFE); a Cu-Al or other multi-metal catalyst
material deposited on top; a layer of carbon-based nanoparticles (NPs) atop the catalyst;
and an ensuing layer of graphite as the electron conductive layer. In this configuration,
the PTFE layer, which can be substantially pure PTFE or similar polymer, acts as a
more stable hydrophobic gas-diffusion layer that prevents flooding from the catalyst;
carbon NPs and graphite stabilize the metal catalyst surface; the graphite layer both
serves as overall support and current collector. In an alternative implementation,
the CME includes a hydrophobic polymer-based layer; the multi-metal electrocatalyst
deposited on top; and then a layer of conductive material such as graphite deposited
on top of the catalyst layer. In this configuration, the stabilization material (e.g.,
carbon nanoparticles) are not present as a distinct layer in between the graphite
and the catalyst layers. Other features of the CME and related CO
2RR methods as described in the article
Cao-Thang Dinh & al. "CO2 electroreduction to ethylene via hydroxide-mediated copper
catalysis at an abrupt interface" Science 18 May 2018 Vol. 360, Issue 6390, pp. 783-787
(DOI: 10.1126 /science.aas 9100) can be used in combination with the electrocatalyst and methods described herein.
[0054] According to a preferred embodiment, the multi-metal material is a de-alloyed material.
Thus, it is a de-alloyed Cu-Al material.
[0055] The structure of the multi-metal material can be as follow:
- the multi-metal material comprises enhancer material-terminated pores; or
- the enhancer material is ion-implanted into the primary catalyst material; or
- the enhancer material is present in the primary catalyst material as the enhancer
material that has been evaporated into the primary catalyst material and remains after
chemically etching
[0056] In an embodiment, the electrocatalyst is layered, and comprises an internal region
and a surface region. The internal region may consist of the primary catalyst material
or both of the primary catalyst material and the enhancer material. If the internal
region consists of both the primary and enhance materials, their weight percentages
can be varied from 1% - 99% for each.
[0057] The surface region of the electrocatalyst has preferably a thickness ranging between
1 nm to 3 nm as determined by Auger electron spectroscopy, preferably ranging from
1.5 to 2. 5 nm.
[0058] In a preferred embodiment, at least in the surface portion of the multi-metal material,
the primary catalyst material, comprising Cu or consisting of Cu, is predominant.
Thus, at least the surface portion of the multi-metal material comprises from 50 wt%
to 99 wt% of the primary catalyst material, based on the total weight of the surface
portion of the multi-metal material, preferably from 60 wt% to 98 wt% of the primary
catalyst material, more preferably from 65 wt% to 97 wt% of the primary catalyst material,
even more preferably from 70 wt% to 96 wt% of the primary catalyst material.
[0059] In a preferred embodiment, at least in the surface portion of the multi-metal material,
the enhancer material, comprising Al or consisting of Al, is present in a weight percentage
that is inferior to the weight percentage of the primary catalyst material. Thus,
at least the surface portion of the multi-metal material comprises from 1 wt% to 50
wt% of the enhancer material, based on the total weight of the surface portion of
the multi-metal material, preferably from 2 wt% to 40 wt% of the enhancer material,
more preferably from 3 wt% to 35 wt% of the enhancer material, even more preferably
from 4 wt% to 30 wt% of the enhancer material.
[0060] In a preferred embodiment, at least the surface region comprises an Al content of
1 wt% to 50 wt% and a Cu content of 50 wt% to 99 wt%, or comprises an Al content of
3 wt% to 30 wt% and a Cu content of 70 wt% to 97 wt%.
[0061] In a preferred embodiment, at least the surface region consists of Cu and Al; with
preference, the multi-metal material consists of Cu and Al.
[0062] In a preferred embodiment, at least the surface region of the multi-metal material
is nanoporous. In another embodiment, at least 50 wt% of the multi-metal material
is nanoporous based on the total weight of the multi-metal material, preferably 95
wt% of the multi-metal material is nanoporous.
[0063] The multi-metal material comprises pores having a pore diameter ranging from 1 nm
to 100 nm as determined by HRTEM and HAADF analysis, preferably from 2 nm to 80 nm;
more preferably from 3 nm to 60 nm, even more preferably from 4 nm to 40 nm and most
preferably from 5 nm to 20 nm.
[0064] In a preferred embodiment, at least the surface region has a homogeneous distribution
of Al and Cu, which means that at least the Al on the surface region is uniformly
distributed within the Cu-Al material, i.e. no aggregated metallic Al nanocluster
or other metallic Al nanomorphology on the surface.
[0065] In an embodiment, the Cu in at least the surface region is Cu (100); with preference,
the Al content in the Cu (100) is about 3 wt% to about 15 wt%
[0066] In another embodiment, the Cu in at least the surface region is Cu (111); with preference,
the Al content in the Cu (111) is about 8 wt% to about 15 wt%, or about 11 wt% to
about 13 wt%.
Method to manufacture the electrocatalyst
[0067] The electrocatalyst is preferably manufactured by physical vapour deposition and
chemical etching processes. In another embodiment, the electrocatalyst is manufactured
by ions implanting.
[0068] Methods of manufacturing Cu-Al based electrocatalysts have been developed and, in
some implementations, use physical vapour deposition and chemical etching processes,
which facilitates scalable fabrication of nanoporous Cu-Al catalysts. When manufactured
by vapour deposition and chemical etching processes, the method comprises the following
steps:
- producing a metallic material, i.e. a multi-metal material, comprising Cu and Al;
and
- subjecting the metallic material; i.e. a multi-metal material, to chemical etching
to remove a portion of the Al from a surface region of the metallic alloy to produce
a de-alloyed multi-metal Cu-Al material.
[0069] The step of producing a metallic material, i.e. a multi-metal material, comprising
Cu and Al preferably comprises vapour-phase deposition of Al onto a Cu surface; such
as evaporating solid Al and forming a deposited Al layer on the Cu surface to form
an evaporated Al-on-Cu material, wherein the deposited Al layer has a thickness ranging
from 20 to 200 nm as determined by cross-sectional scanning electron microscopy, preferably
from 50 to 150 nm, more preferably from 60 to 100 nm.
[0070] With preference, the step of evaporating of the solid Al is performed at an evaporation
rate ranging from 1 to 10 nm s
-1, preferably from 1 to 5 nm s
-1, more preferably from 1 to 2 nm s
-1.
[0071] More preferably, the step of evaporating of the solid Al is performed under a base
pressure ranging from 10
-5 to 10
-8 Torr i.e. 133.32 × 10
-5 to 133.32 × 10
-8 Pa.
[0072] According to the invention, the chemical etching comprises immersing the evaporated
Al-on-Cu material into an acidic solution to remove Al.
[0073] With preference, the acidic solution comprises hydrochloric acid solution; preferably,
the hydrochloric acid solution comprises from 1 to 20 wt% of hydrochloric acid based
on the total weight of the hydrochloric acid solution, preferably from 1 to 18 wt%,
more preferably from 1 to 15 wt%, even more preferably from 1 to 12 wt%, most preferably
from 1 to 10 wt%, even most preferably from 1 to 8 wt% or from 1 to 5 wt% of hydrochloric
acid.
[0074] Preferably, the method comprises, after chemical etching, washing with water to remove
the acidic solution; with preference, the method further comprises, after washing,
air drying to remove water.
[0075] In a preferred embodiment, the method further comprises, prior to producing the metallic
alloy comprising the Cu and Al, depositing Cu on a gas diffusion layer (GDL); with
preference, the Cu is deposited by thermal evaporation onto the GDL
[0076] Preferably, the Cu forms a deposited Cu layer on the GDL; wherein the deposited Cu
layer has a thickness ranging from 300 to 1000 nm as determined by cross-sectional
scanning electron microscopy, preferably from 350 to 800 nm, more preferably from
400 to 600 nm and even more preferably from 450 to 550 nm.
[0077] In an embodiment, the step of producing a multi-metal material comprising Cu and
Al comprises co-evaporation of Al and Cu to form a Cu-Al alloy; with preference the
multi-metal material comprising Cu and Al form a layer having a thickness ranging
from 200 to 1000 nm as determined by cross-sectional scanning electron microscopy,
preferably from 250 to 800 nm, more preferably from 300 to 500 nm.
[0078] With preference, the method further compris depositing a layer of the Cu-Al alloy
onto a gas diffusion layer (GDL) prior to the chemical etching; more preferably, the
method comprises cooling the deposited Cu-Al alloy prior to chemical etching.
[0079] With preference, the chemical etching comprises immersing the Cu-Al alloy in an acidic
solution to remove Al; with preference, the acidic solution comprises hydrochloric
acid solution. More preferably, after chemical etching, washing with water to remove
the acidic solution.
[0080] In another embodiment the method of manufacturing an electrocatalyst for reduction
of CO
2 to produce multi-carbon compounds, the method comprising ion-implanting Al into Cu.
That is, a Cu catalyst layer is made with a desired thickness on a gas diffusion layer
first, and then, Al is ion-implanted into Cu to make a Cu-Al surface.
[0081] In some implementations, the Cu-Al based electrocatalysts enable highly selective
production of ethylene with a record CO
2-to-C
2H
4 Faradaic efficiency of 80% at an unprecedently high applied current density of 600
mA cm
-2 (-1.8 to -2.1 V vs. RHE) in a flow cell system. This result vastly improves the CO
2-to-C
2H
4 selectivity and stability with a fairly high half-cell electricity-to-ethylene power
conversion efficiency of 30% which readily meets the requirements of practical operation.
Embodiments of the de-alloyed nanoporous Cu-Al catalysts achieve a CO
2-to-C
2H
4 Faradaic efficiency of 80% at an applied current density of 600 mA cm
-2 with an applied cathodic potential between -1.8 to -2.1 V vs. RHE (corresponding
to a full-cell voltage of 3.03 to 3.33 V in the ideal case considering a 1.23 V on
the OER side).
[0082] The rapid increase in global energy demand and the need to replace fossil fuels with
renewable sources necessitate vast chemical storage of intermittent solar and wind
electricity. The electrochemical reduction of CO
2 to valuable chemical feedstocks represents a promising means of utilizing CO
2 and renewable energy combined. Until now, copper has been the predominant electrocatalyst
for the production of multi-carbon products, but it has certain drawbacks.
[0083] Accelerated discovery of potential catalysts was performed. The results suggested
that copper-rich Cu-Al alloys provide multiple sites and surface orientations that
exhibit optimal CO adsorption energies near the top of the activity volcano plot for
CO
2 reduction. Experimentally, the invention showed that incorporating, e.g., 4-28%,
of Al on Cu surfaces increases their Faradaic efficiency (FE) in C
2H
4 electroproduction from about 35% (with pure Cu) to over 60% (with Al incorporated
Cu).
[0084] The invention further developed a scalable physical vapour deposition and chemical
etching process to fabricate nanoporous Cu-Al catalysts that electrochemically reduced
CO
2 to C
2H
4 with a record FE of 80% at a current density of 600 mA cm
-2 (-1.8 to -2.1 V vs. RHE) in 1 M KOH electrolyte in a flow cell system. An average
C
2H
4 FE of 75% ± 4% was obtained over 17 de-alloyed distinct Cu-Al samples under the same
current density of 600 mA cm
-2.
[0085] In situ X-ray absorption revealed how Cu and Al enable a favourable Cu coordination
environment that enhances C-C dimerization. The findings suggest new avenues by which
multi-metallic systems can be devised that go beyond the limitations of conventional
single-metal electrocatalysts.
[0086] It will be appreciated from the overall description and the experimentation section
in particular that the catalyst materials, as well as the associated methods described
herein, can have a number of optional features, variations, and applications.
EXAMPLES & EXPERIMENTATION
[0087] The present invention enabled accelerated discovery of Cu-Al motifs for highly active
CO
2 electroreduction to ethylene.
[0088] While copper has been the predominant electrocatalyst for the production of multi-carbon
products, analyses using Density Functional Theory (DFT) screened potential catalytic
materials and suggested that copper-rich Cu-Al alloys provide multiple sites and surface
orientations that exhibit optimal CO adsorption energies near the top of the activity
volcano plot for CO
2 reduction. Experimentally, the invention shows that incorporating 4-28% of Al on
Cu surfaces increases their Faradaic efficiency in C
2H
4 electroproduction. The invention further developed a simple and scalable physical
vapour deposition and chemical etching process to fabricate nanoporous Cu-Al catalysts
that electrochemically reduced CO
2 to C
2H
4 with a record Faradaic efficiency of 80% at a current density of 600 mA cm
-2 (-1.8 to -2.1 V vs. RHE) in 1 M KOH electrolyte in a flow cell system.
In situ X-ray absorption reveals how Cu and Al enable a favourable Cu coordination environment
that enhances C-C dimerization. The findings also suggest new avenues by which multi-metallic
systems can be devised that go beyond the limitations of conventional single-metal
electrocatalysts.
[0089] The invention prepared experimentally a suite of model catalysts to implement these
recommended directions: ion-implanted Al-on-Cu and evaporated-etched Al-on-Cu (see
Methods section and Fig. 8). Each catalyst shows a morphology similar to that of an
evaporated pure Cu catalyst (see Fig. 9-11).
[0090] Compared with the pure Cu catalyst, which attained a C
2H
4 Faradaic efficiency (FE) of 35% at a current density of 600 mA cm
-2 in a 1 M KOH electrolyte in a flow-cell configuration (see Fig. 12), both ion-implanted
and evaporated-etched Al-on-Cu catalysts exhibited higher C
2H
4 FEs of ~60% under the same testing conditions. The CO FEs on both Cu-Al catalysts
were suppressed to ~10%, one-third of that obtained using pure Cu (see Fig. 13). Incorporating
Al on Cu thus increased selectivity toward C
2H
4. Tafel slopes of C
2H
4 production (see Fig. 13) for pure Cu, ion-implanted, and evaporated-etched Al-on-Cu
are 180, 147 and 145 mV dec
-1, respectively, further highlighting the faster C-C dimerization kinetics with Al-on-Cu
catalysts.
[0091] To estimate quantitatively the amount of Al incorporated near the Cu surface, the
invention used surface-sensitive Auger electron spectroscopic (AES) analysis (see
Fig. 14, 15). AES typically provides compositional information on the top 1-3 nm of
the samples and does so over a relatively large area (100 µm
2 in the experiments). The invention estimated Al concentrations on surfaces of 4.5%
and 25% for the ion-implanted and evaporated-etched Al-on-Cu, respectively.
[0092] Pourbaix diagrams (see Fig. 16) show that both Cu and Al are cathodically protected
at potentials more negative than their oxidation potentials of -1.4 V vs. RHE in a
pH 14 electrolyte. This should enable their stable use as electrocatalysts in alkaline
electrolytes.
[0093] The invention performed CO
2 electrolysis and achieved a remarkably high current density of 600 mA cm
-2 at a cathodic potential of -1.8 vs. RHE. The C
2H
4 FEs of the ion-implanted and evaporated-etched Al-on-Cu catalysts were stable at
~60% over operating periods of 5 hours before the failure of the gas diffusion electrode
due to mechanical flooding. SEM and EDX analyses confirmed no major change of morphologies
and Al concentrations before and after 5 hours of reaction (see Fig. 10, 11, 17-20;
and Fig. 21-24).
[0094] The invention then sought to develop an optimized and robust catalyst combining Cu
and Al. The invention explored vapour phase deposition followed by chemical etching
wherein the inventors would synthesize de-alloyed nanoporous Cu-Al catalysts. As shown
in the scanning electron spectroscopy (SEM) and high angle angular dark field-scanning
transmission electron microscopy (HAADF-STEM) images in Fig. 2b and Fig. 25, a nanoporous
structure with pore diameters of 5-20 nm was formed. Compared to ion-implanted and
evaporated-etched Al-on-Cu catalysts, the de-alloyed nanoporous Cu-Al catalysts may
offer more catalytically active sites for adsorption and electroreduction of CO
2 Following 5 hours CO
2 electroreduction at a current density of 600 mA cm
-2, the morphology remained similar indicating a stable catalyst and structure (Fig.
2b). The grain size of the catalyst increased following reaction, potentially due
to the surface reconstruction of Cu and Al in the electrolyte during the reaction.
Energy-dispersive X-ray spectroscopy (EDX) analyses in TEM and SEM, electron energy
loss spectroscopy (EELS) spectra, and elemental mapping in STEM, all confirmed a homogeneous
distribution of Al and Cu in de-alloyed catalysts before and following 5 hours reaction
(Fig. 2c and Fig. 26-28). The invention performed HAADF-STEM analysis and found that
Cu (111) and (200) facets were observed with interplanar spacings of 0.211 and 0.182
nm (Fig. 29). AES analysis further revealed ~9% Al on the surface following the reaction
respectively (Fig. 30, 31).
[0095] Given the presence of Cu (111) and (100) surfaces, the invention further analyzed
how the ratio of Al to Cu on these surfaces affects ΔE
co (Fig. 1). The resulting distributions (Fig. 3a and 3b) show that adding ~12% Al to
the Cu (111) surface maximizes the density of sites with ΔE
co values near the optimum of -0.67 eV and that adding 4-12% Al maximizes the density
of optimal sites for the Cu (100) surface.
[0096] The invention performed density functional theory (DFT) calculations over the best
ML predicted structures to characterize the changes in energy barriers in the major
steps during CO
2 reduction. The reaction energy in the rate-determining step of C-C bond-making decreased
from 1.6 eV to 0.9 eV on Cu (111) and from 0.7 eV to 0.4 eV on Cu (100) with the benefit
of Al incorporation (see Fig. 32 to Fig. 33). This is consistent with ML predictions
of increased C2+ production with Al-containing Cu.
[0097] The DFT results further showed that the reaction energy barrier for forming HO(CH)CH,
an intermediate of ethanol, is higher than that for forming CCH, an intermediate of
C
2H
4 with Al-containing Cu. Water near the Al atoms may act as a proton donor for the
electrochemical dehydration reduction of HOCCH to CCH instead of hydrogenation of
HOCCH to HO(CH)CH. Thus, oft-produced alcohol is suppressed and the C
2H
4 production is promoted.
[0098] The invention tested the CO
2 electroreduction activity of de-alloyed Cu-Al catalysts with different Al concentrations
on the surfaces. A high C2+/C1 ratio of ~30 was obtained with ~10% Al on the surface
which is in line with the ML and DFT predictions (Fig. 34).
[0099] The invention then evaluated the CO
2 electroreduction performance of the de-alloyed Cu-Al catalysts with ~10% Al at the
surfaces at current densities from 200 to 800 mA cm
-2 in 1 M KOH in flow cells (Fig. 4a and 4b). To quantify FEs for each product, the
invention carried out CO
2 electroreduction in a chronopotentiometry mode. As shown In Fig. 4a, the invention
achieved C
2H
4 FE of 80% at a current density of 600 mA cm
-2. This is a 2-fold increase compared to the 35% FE of pure Cu measured under the same
conditions. An electricity-to-ethylene half-cell power conversion efficiency (PCE)
of 30% was achieved (Fig. 35), which is similar to the previously published highest
half-cell PCE of ~30% using a plasma-activated copper electrocatalyst with a C
2H
4 FE of 60% obtained at an applied current density of ~12 mA cm
-2.
[0100] An average C
2H
4 FE of 75% ± 4% was obtained over 17 de-alloyed distinct Cu-Al samples (~10% Al on
the surfaces) under the same current density of 600 mA cm
-2. The overall C2+ product was 85%-90% when the invention used the de-alloyed Al-based
catalyst, appreciably higher than that the 55-60% using the flat Cu catalyst (Fig.
4b and Fig. 13).
[0101] The best Cu-Al catalysts exhibited stable potentials between -1.8 and -2.1 V vs.
RHE and a C
2H
4 FE of 75% over 5 hours of continuous operation at 600 mA cm
-2 (Fig. 4e).
[0102] To acquire local coordination information during CO
2 electroreduction, the invention performed
in situ synchrotron X-ray absorption near-edge structure (XANES) analysis under these same
testing conditions. Cu-O bonding was observable via both
ex-situ and
in situ XANES analyses with the de-alloyed Cu-Al catalyst before, during and after the reaction.
The intensity of the
in situ Cu-O peak is smaller than that of the ex
situ ones, indicating Cu-O in the de-alloyed Cu-AI catalyst was partially reduced to Cu
during the reaction. In contrast, no obvious Cu-O bonding was observed for the pure
Cu during the
ex-situ and
in situ analyses under the same testing conditions (see Fig. 7). It is proposed that a mixture
of Cu-Cu and Cu-O was formed in the de-alloyed Cu-Al catalysts during the reaction.
This may contribute to the favourable coordination environment that accelerates C-C
dimerization, as predicted via DFT.
[0103] The invention designed control catalysts-nanoporous Cu with a very limited amount
of Al on the surface and having similar nanoporosity to that of the de-alloyed Cu-Al
catalyst-to clarify the role of morphology (Fig. 36). AES analysis revealed that surface
Al was decreased from 10% to 2-3% (Fig. 37). Considering the penetration depth of
1-3 nm in the AES, the surface Al concentration on nanoporous Cu should be lower than
2-3%. The C
2H
4 FE was decreased to 53% at the same current of 600 mA cm
-2 (Fig. 4a and Fig. 38). Linear sweep voltammetry (LSV) curves for evaporated Cu, nanoporous
Cu and de-alloyed Cu showed no obvious reduction peaks (Fig. 4c), indicating that
all catalysts were stable and not reduced to other species at negative potentials.
Tafel analysis of evaporated Cu and nanoporous Cu gave slopes of 180 mV dec
-1 and 175 mV dec
-1 for C
2H
4 production, respectively, which were both larger than that of 120 mV dec
-1 with the de-alloyed Cu-Al (Fig. 4d). It can be concluded from the invention that
incorporating Al on the Cu surface is crucial to promote C
2H
4 production.
[0104] The invention thus developed a new de-alloyed Cu-Al catalyst for highly selective
CO
2 electroreduction to C
2H
4. The findings suggest avenues to multi-metal catalysts that outperform single-component
catalysts by utilizing an intermediate-binding-optimization strategy for multi-carbon
production via CO
2 electroreduction.
Methods
[0105] DFT calculations. The DFT calculations were performed using a VASP package in the Generalized Gradient
Framework formulated by Perdew
et al., including the PBE flavour of DFT and the projector augmented wave (PAW) method to
account for core-valence interactions. The cutoff of kinetic energy for plane wave
expansions was set to 400 eV and the reciprocal space was sampled by the Γ- centred
Monkhorst-Pack scheme with a grid of 2 by 2 by 1. The Cu (111) and (100) surface slabs
were constructed with three Cu layers using ASE (Atomic Simulation Environment) using
the PBE-optimized lattice parameter with a vacuum layer of at least 15 Å.
[0106] Zero-point energies (ZPE), enthalpy and entropy contributions to free energies at
room temperature (298.15 K) were calculated from vibrational modes of surface species
using numerical six-point derivatives in VASP and ASE. Note that very low-frequency
modes were obtained in some cases because the explicit water molecules are not properly
constrained by the hydrogen bonding network presented in water bulk. Such low-frequency
modes can cause unphysically large entropy contributions, so they were reset to a
threshold value of 60 cm
-1 and excluded frequencies smaller than the threshold, corresponding to the acoustic
translational mode of the six-member rings in water bulk.
[0107] For the surface reaction (i.e.,
A∗ →
B∗), the change in Gibbs free energy at temperature T and 1 atmospheric pressure is
given by:
where ΔErxn is the calculated reaction energy of A∗ → B∗. ΔH0(T) and ΔS0(T, P0) are the enthalpy and entropy differences between the initial and final states. In
addition, ΔH0(T) gives the zero-point energy and the temperature dependence of enthalpy change at
a standard pressure of 1 atm for adsorption of molecule A (here, it is room temperature
of 298.15 K), which is given by:


where

and

is the enthalpy at the temperature T and a standard pressure of 1 atm for the translational,
rotational, vibrational modes of the A.

and

are entropy contributions from the 3-D translational, 2-D rotational, vibrational
modes.
Examples
Example 1: Preparation of evaporated Cu on gas diffusion layers (GDLs).
[0108] Cu was evaporated on the GDL (Fuel Cell Store, Sigracet 39 BC) by a thermal evaporation
process. GDL is made of an air-brushed polytetrafluoroethylene (PTFE) on carbon nanoparticles
layer as a conductive and hydrophobic layer atop a carbon fibre layer as a conductive
and supporting layer. 0.5 g Cu foils were placed in a crucible inside the evaporation
chamber (Edwards AUTO 360 Thermal Evaporator). A thin Cu layer (~ 500 nm) was deposited
at an evaporation rate of approximately 1-2 nm s
-1 under a base pressure of 10
-6 Torr. GDLs were kept rotating at a slow speed of 50 rpm during evaporation.
Example 2: Preparation of ion-implanted Al-on-Cu on GDLs.
[0109] Evaporated Cu on GDL samples were used as substrates and placed in ion implantation
chamber (50keV Aluminum Implantation at Western University). A 99.999% purity aluminium
(Al) rod is installed in a copper target in the caesium (Cs) sputter source. A 100keV
Al
2- molecules are produced in the sputter source injector, selected by the injector magnet
and injected into the Tandetron accelerator. Al
2- is preferred because it has six times the flux of Al
- . For ion implants below 100keV, the Tandetron terminal pump and stripper gas are
turned off. The Tandetron is used as a large lens to focus a negative beam to target
in the implant chamber. The high energy magnet steers the Al
2- down the beamline with the implant chamber. As the beam travels down the beamline
it passes through NEC Electrostatic Raster/Scanner which sweeps the beam in the X
direction at 517Hz and 64Hz in the Y direction over an aperture which defines the
implant area on the implant stage. The Al
2- molecule breaks into Al each having an energy of 50keV after the collisions with
the sample. The implant stage has 4 sides. Each side can be rotated to face the beam
for implantation. The implant stage in the Implant Chamber is suspended in a Faraday
cage to suppress the secondary electrons. The ion charge is collected from the implant
stage and fed to an Ortec 439 current integrator. The charge is converted into pulses
which are counted by a computer to determine the dose. To avoid substantial ion-beam
induced damage and over-heating to the samples, the inventors ion implanted 2 w% Al
(a concentration compared to overall Cu) into Cu which corresponded to 6 × 10
15 ions cm
-2. It took 112 minutes to finish this experiment. Auger electron spectroscopic analysis
determined that the AI/(AI+Cu) molar concentration on the surface is ~4.5%. The inventors
implanted 5 wt% and 10 wt% Al into Cu and it took 180 and 360 minutes, respectively.
Surface Al concentrations are determined to be 5% and 5.5 %, indicating making more
Al on Cu surface is difficult by the ion implantation method. This may be due to the
ion-beam-induced damage and heating effect. Al may gradually migrate into the bulk
at a large implantation dose.
Example 3: Preparation of evaporated-etched AI-on-Cu on GDLs.
[0110] Evaporated-etched Al-on-Cu was synthesized via a two-step process of evaporation
and etching. First, 0.3 g Al foils were placed in a crucible inside the evaporation
chamber. A thin Al layer (~ 100 nm) was deposited on evaporated Cu-on-GDL samples
at an evaporation rate of approximately 1-2 nm s
-1 under a base pressure of 10
-6 Torr. The evaporated Al-on-Cu sample was then immersed in a 5 wt% hydrochloric acid
solution to remove the excessive Al. The solution was kept stirring at a low speed
of 250 rpm during the 5 minutes etching. Deionized water was used to wash off remained
hydrochloric acid and other residual ions from the sample surface. An airbrush was
used to dry the samples.
Example 4: Preparation of de-alloyed Cu-AI and nanoporous Cu on GDLs.
[0111] De-alloyed Cu-Al was synthesized via an evaporation and etching process. First, 0.5
g Cu foils and 0.25 g Al foils were placed in a crucible inside the deposition chamber.
They were melted under a base pressure of 10
-6 Torr for 2 minutes to form greyish Cu-Al alloys. Then, a thin layer of Cu-Al alloy
(~ 500 nm) was deposited on GDLs at an evaporation rate of approximately 1-2 nm s
-1 under a base pressure of 10
-6 Torr. After cooling down to room temperature naturally, the evaporated Cu-Al alloy
on GDL samples were transferred to a 5 wt% hydrochloric acid solution to fabricate
de-alloyed Cu-Al catalyst at a mild stirring speed of 250 rpm. Deionized water was
used to wash off remained hydrochloric acid and other residual ions from the sample
surface. An airbrush was used to carefully dry the samples.
[0112] Nanoporous Cu samples were prepared by immersing de-alloyed Cu-Al catalysts into
10 mM CuCl
2 solution for 10 minutes with a mild stirring speed of 50 rpm. Then, the samples were
washed with deionized water and dried by an airbrush carefully.
[0113] Characterizations. The morphologies of the prepared samples were investigated using scanning electron
microscope (SEM) on a Hitachi SU 5000 VPSEM, transmission electron microscope (TEM)
on a Hitachi HF-3300 instrument with an acceleration voltage of 200kV and high-angle
annular dark-field scanning transmission electron microscopy (HAADF-STEM) in a Cs-corrected
STEM (JEOL, JEM-ARM200F) at an accelerating voltage of 200 kV. Compositions of the
prepared samples were studied using Energy-dispersive X-ray spectroscopy (EDX) on
a Bruker Quantax EDX in SEM and TEM, respectively, and electron energy loss spectroscopy
(EELS) elemental analysis by GIF Quantum 965. Al concentrations on surfaces of the
prepared samples were measured using Auger electron spectroscopy (AES) on a 710 Scanning
Auger Nanoprobe instrument (Ulvac-PHI, Chigasaki, Japan). The beam settings used for
the acquisition are 10keV and 10nA. AES analyses were performed at different locations
on the surface for each sample to trace the Al concentrations and homogeneity. The
inventors found that ion implantation gave rather uniform distributions of Al on the
surfaces. In contrast, Al concentrations on those chemical etched samples may vary
± 5-10% especially for those samples with high Al concentrations, indicating that
the chemical etching condition using HCl solutions might be further optimized.
[0114] Ex situ and
in situ X-ray absorption spectra at Cu K-edge on catalysts and standard references were collected
at the beamline of 1W1B from Beijing synchrotron radiation facility, China. The electron
storage ring was operated at 2.5 GeV with an average current of 200 mA. A Si (111)
double crystal was used as a monochromator and the data of absorption were collected
in fluorescence mode. The energy of the absorption spectra was calibrated by measuring
the X-ray absorption near edge spectroscopy (XANES) of a Cu metal foil. The obtained
data were processed by established methods with the ATHENA software package. The normalized
Extended X-ray absorption fine-structure spectroscopy (EXAFS) was converted from energy
to k-space and weighted by
k3. These data were then Fourier transformed to R-space.
[0115] For
in situ measurements, a self-built flow cell consisting of two chambers for CO
2 diffusion (chamber I) and holding the reaction liquid (chamber II) was used. The
sample is sandwiched between the two chambers with pressed the Teflon spacers (sample
size: 1.2 × 1.2 cm
2; thickness: ~500 nm). CO
2 gas is introduced into the chamber I with the gas controller and diffuses and passes
through the samples and finally reaches the liquid to participate in the reaction.
The thickness of the liquid can be controlled from 1000 to 200 µm. After the liquid
cell filled with 1.0 M aqueous KOH, 30 mL KOH solution with the same concentration
is flowed into the liquid cell at 0.5 mL/min by using an automatic pump syringe. The
measurement of the Cu K-edge is started simultaneously with the stop of the flowing.
Example 5: Electrochemical reduction of CO2.
[0116] All CO
2 electrolysis experiments were performed using a three-electrode set-up in a flow-cell
configuration connected to an electrochemical workstation (Autolab PGSTAT302N). An
Ag/AgCI (in saturated KCl solution) and a platinum wire were used as reference and
counter electrodes, respectively. 1M KOH was used as the electrolyte. To quantify
FEs for each product, CO
2 electrolysis was performed in a chronopotentiometry mode. For Tafel analysis, CO
2 electrolysis was performed in a Chronoamperometry mode. For linear sweep voltammogram
(LSV) analyses, the LSV was cycled until it was stable.
[0117] The cathodic chamber was separated from the gas chamber by a 1.5 cm × 1.5 cm gas
diffusion electrode (GDE). GDEs were made of catalysts on GDLs as discussed in detail
above. A plastic plate with a 1cm × 1cm window is placed between the GDE and cathode
chamber. The cathodic chamber was separated from the anodic chamber by an anion exchange
membrane (Fumasep FAA-3-PK-130). Rubber spacers were placed in between different chambers
to avoid mixture of electrolytes or gaseous products.
[0118] CO
2 gas was delivered into the gas chamber at a rate of 56 standard cubic centimetres
per minute (s.c.c.m.) and was routed into a gas chromatograph (Perkin Elmer Clarus
680) to quantify the gaseous products. The liquid products were quantified by NMR
(600 MHz Agilent DD2 spectrometer), in which electrolyte was mixed with D2O (deuterated
water) and dimethyl sulfoxide (DMSO, Sigma, 99.99%) was used as an internal standard.
[0119] Faradaic efficiencies (FEs) for different products can be calculated as follows:
FE = F × m × n / Q = F × m × n / (l × t), where F is the Faraday constant, m is the
electron numbers needed for one CO
2 molecule reduction to the desired product and n is the amount of the desired product
(in moles).
Example 6: The stability of Al for CO2 electroreduction under our testing condition
[0120] To further test the electrochemical stability of Al, the invention performed a control
experiment of electroreducing CO
2 using a pure Cu catalyst in 1 M KOH solution in the presence of 1 mM Al(OH)
4- anions. Energy-dispersive X-ray spectroscopy (EDX) analysis showed ~4% Al after 30
minutes of CO
2 electroreduction at 600 mA cm
-2 (Fig. 21). AES analysis confirmed over 80% Al on the surface, indicating electrodeposition
of Al (Fig. 22). Thus, the reverse reaction of dissolving Al into the solution to
form Al(OH)
4- anions was avoided. However, C
2H
4 production activity suffered at the expense of dramatically increased H
2 production (Fig. 23), highlighting the importance of realizing a homogeneous distribution
of Al on Cu surface. As another control, a pure Cu electrode was immersed in the same
solution of 1 M KOH and 1 mM Al(OH)
4- for half hour without applying electrical bias. Al concentration was below EDX detection
limit (Fig. 24).
Example 7: In situ and ex situ X-ray absorption studies.
[0121] A large amount of Cu-O bonding was visible continuously in the ex
situ and
in situ XANES analyses with the de-alloyed Cu-Al catalyst before, during and after the reaction
(Fig. 7).
In situ Fourier transform extended X-ray absorption fine structure (FT EXAFS) spectra of
the de-alloyed Cu-Al catalysts, together with
ex-situ reference spectra of Cu foil, Cu
2O and CuO, gave precise coordination information. The invention observed a prominent
peak at ~2.2 Å from Cu-Cu contribution, which agrees with the prominent peak of Cu-Cu
in Cu foils, and a weak peak at ~1.5 Å, which agrees with the prominent peak of Cu-O
in Cu
2O and CuO. Moreover, the Cu-O peak intensity remained almost the same during
in situ synchrotron measurement. It is smaller than that obtained with the same sample without
CO
2 electroreduction (Fig. 7), indicating Cu-O in de-alloyed Cu-AI catalysts was partially
reduced to Cu. A stable balance of Cu-Cu and Cu-O in the de-alloyed catalyst was established
within a short time right after starting CO
2 electroreduction. As a control, the invention measured
in situ XANES with a pure Cu on GDL under the same condition. No obvious oxidation state
of Cu was observed (Fig. 7).
[0122] Data, findings and information from the present invention are also presented in the
Figures and in the following tables:
Table 1: Zero-point energy and specific heat of different reactants, intermediates
and products on the Al incorporated Cu (111) surface.
| Structure |
E_ZPE(eV) |
Cv_trans(0->T)(eV) |
Cv_rot(0->T)(eV) |
Cv_vib(0->T)(eV) |
H(eV) |
| Intial |
2.17E+00 |
3.90E-02 |
3.90E-02 |
3.30E-01 |
2.61E+00 |
| Finala |
2.62E+00 |
3.90E-02 |
3.90E-02 |
4.30E-01 |
3.16E+00 |
| Finalb |
2.15E+00 |
3.90E-02 |
3.90E-02 |
3.77E-01 |
2.63E+00 |
Table 2: Entropy and Gibbs free energy of different reactants, intermediates and products
on the Al incorporated Cu (111) surface.
| Structure |
S_trans(eV/K) |
S_rot(eV/K) |
S_vib(eV/K) |
S(eV/K) |
TS(eV) |
| Intial |
2.19E-03 |
2.04E-03 |
2.08E-03 |
6.32E-03 |
1.88E+00 |
| Finala |
2.19E-03 |
2.00E-03 |
2.78E-03 |
6.97E-03 |
2.08E+00 |
| Finalb |
2.19E-03 |
2.03E-03 |
6.68E-03 |
6.68E-03 |
1.99E+00 |
Table 3: Zero-point energy and specific heat of different reactants, intermediates
and products on the Al incorporated Cu (100) surface.
| Structure |
E_ZPE(eV) |
Cv_trans(0->T)(eV) |
Cv_rot(0->T)(eV) |
Cv_vib(0->T)(eV) |
H(eV) |
| Intial |
2.15E+00 |
3.90E-02 |
3.90E-02 |
1.88E-01 |
2.44E+00 |
| Finala |
2.43E+00 |
3.90E-02 |
3.90E-02 |
1.82E-01 |
2.71E+00 |
| Finalb |
1.97E+00 |
3.90E-02 |
3.90E-02 |
1.76E-01 |
2.25E+00 |
Table 4: Entropy and Gibbs free energy of different reactants, intermediates and products
on the Al incorporated Cu (100) surface.
| Structure |
S_trans(eV/K) |
S_rot(eV/K) |
S_vib(eV/K) |
S(eV/K) |
TS(eV) |
| Intial |
2.17E-03 |
1.87E-03 |
1.17E-03 |
5.21E-03 |
1.55E+00 |
| Finala |
2.17E-03 |
1.87E-03 |
1.11E-03 |
5.14E-03 |
1.53E+00 |
| Finalb |
2.17E-03 |
1.87E-03 |
1.08E-03 |
5.12E-03 |
1.53E+00 |
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