(19)
(11) EP 4 333 053 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
20.03.2024 Bulletin 2024/12

(43) Date of publication A2:
06.03.2024 Bulletin 2024/10

(21) Application number: 23187423.1

(22) Date of filing: 25.07.2023
(51) International Patent Classification (IPC): 
H01L 23/498(2006.01)
(52) Cooperative Patent Classification (CPC):
H01L 23/498
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 02.09.2022 US 202217929471

(71) Applicant: INTEL Corporation
Santa Clara, CA 95054 (US)

(72) Inventors:
  • Marin, Brandon
    Gilbert, 85234 (US)
  • Ndukum, Tchefor
    Chandler, 85286 (US)
  • Darmawikarta, Kristof
    Chandler, 85249 (US)
  • Li, Sheng
    Gilbert, 85295 (US)
  • Pietambaram, Srinivas
    Chandler, 85249 (US)
  • Duan, Gang
    Chandler, 85248 (US)
  • Nad, Suddhasattwa
    Chandler, 85249 (US)
  • Ecton, Jeremy
    Gilbert, 85298 (US)

(74) Representative: Goddar, Heinz J. 
Boehmert & Boehmert Anwaltspartnerschaft mbB Pettenkoferstrasse 22
80336 München
80336 München (DE)

   


(54) MICROELECTRONIC ASSEMBLIES HAVING POWER DELIVERY ROUTED THROUGH A BRIDGE DIE


(57) Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a conductive pad having a first surface, an opposing second surface, and lateral surfaces extending between the first and second surfaces; a conductive via coupled to the first surface of the conductive pad; a liner on the second surface and on the lateral surfaces of the conductive pad, wherein a material of the liner includes nickel, palladium, or gold; a microelectronic component having a conductive contact; and an interconnect electrically coupling the conductive contact of the microelectronic component and the liner on the second surface of the conductive pad, wherein a material of the interconnect includes nickel or tin.







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