TECHNICAL FIELD
[0001] The present invention relates to a power supply unit for an aerosol generating device.
BACKGROUND ART
[0002] Patent Literatures 1 and 2 describe a power supply unit for an aerosol generating
device, the power supply unit being equipped with a voltage conversion IC which steps
up and/or steps down a power. In the power supply unit for the aerosol generating
device, a power supply voltage is converted by the voltage conversion IC and then
supplied to a heater in order to improve an efficiency of aerosol generating. A ground
of an element connected to an input and output line of the voltage conversion IC is
preferably separated from another ground for a signal because voltage fluctuation
or noise occurs.
[0003] When a ground for a power supply and a ground for a signal are separated, it is considered
to provide a common ground to eliminate a potential deviation between these grounds.
CITATION LIST
PATENT LITERATURE
SUMMARY OF INVENTION
TECHNICAL PROBLEM
[0005] However, in a case where a common ground is provided, heat and noise are generated
due to elimination of a potential deviation, and thus there is room for consideration
of how to dispose electronic components on a circuit board.
[0006] The present invention provides a power supply unit for an aerosol generating device
in which electronic components are appropriately disposed on a circuit board.
SOLUTION TO PROBLEM
[0007] A power supply unit for an aerosol generating device according to the present invention
includes:
a power supply;
a heater connector connected to a heater configured to heat an aerosol source by consuming
power supplied from the power supply;
a voltage conversion IC connected to the heater connector and including an output
terminal configured to convert and output an input voltage and a detection terminal
configured to detect a voltage output from the output terminal;
a circuit board including a first surface on which the voltage conversion IC is disposed
and a second surface which is a back surface of the first surface;
a capacitor having one end connected to the output terminal;
a first ground provided inside the circuit board and connected to an other end of
the capacitor;
a second ground provided inside the circuit board, insulated from the first ground
inside the circuit board, and connected to the detection terminal; and
a common ground configured to electrically connect the first ground and the second
ground, in which
on the second surface, no electronic component is provided in a common ground projection
region overlapping with the common ground when viewed from a direction orthogonal
to the circuit board.
ADVANTAGEOUS EFFECTS OF INVENTION
[0008] According to the present invention, the electronic components can be appropriately
disposed on the circuit board, and the operation of the power supply unit for an aerosol
generating device is stabilized.
BRIEF DESCRIPTION OF DRAWINGS
[0009]
[Fig. 1] Fig. 1 is a perspective view of a non-combustion inhaler.
[Fig. 2] Fig. 2 is a perspective view of the non-combustion inhaler with a rod attached.
[Fig. 3] Fig. 3 is another perspective view of the non-combustion inhaler.
[Fig. 4] Fig. 4 is an exploded perspective view of the non-combustion inhaler.
[Fig. 5] Fig. 5 is a perspective view of an internal unit of the non-combustion inhaler.
[Fig. 6] Fig. 6 is an exploded perspective view of the internal unit in Fig. 5.
[Fig. 7] Fig. 7 is a perspective view of the internal unit with a power supply and
a chassis removed.
[Fig. 8] Fig. 8 is another perspective view of the internal unit with the power supply
and the chassis removed.
[Fig. 9] Fig. 9 is a schematic diagram for illustrating operation modes of the inhaler.
[Fig. 10] Fig. 10 is a diagram illustrating a schematic configuration of an electric
circuit of the internal unit.
[Fig. 11] Fig. 11 is a diagram illustrating a schematic configuration of the electric
circuit of the internal unit.
[Fig. 12] Fig. 12 is a diagram illustrating a schematic configuration of the electric
circuit of the internal unit.
[Fig. 13] Fig. 13 is a diagram for illustrating an operation of the electric circuit
in a sleep mode.
[Fig. 14] Fig. 14 is a diagram for illustrating an operation of the electric circuit
in an active mode.
[Fig. 15] Fig. 15 is a diagram for illustrating an operation of the electric circuit
in a heating initial setting mode.
[Fig. 16] Fig. 16 is a diagram for illustrating an operation of the electric circuit
at the time of heating the heater in a heating mode.
[Fig. 17] Fig. 17 is a diagram for illustrating an operation of the electric circuit
at the time of detecting a temperature of the heater in the heating mode.
[Fig. 18] Fig. 18 is a diagram for illustrating an operation of the electric circuit
in a charging mode.
[Fig. 19] Fig. 19 is a diagram for illustrating an operation of the electric circuit
at the time of resetting (restarting) an MCU.
[Fig. 20] Fig. 20 is a circuit diagram of essential parts more specifically illustrating
peripheral circuits of a step-up DC/DC converter.
[Fig. 21] Fig. 21 is a cross-sectional view of the non-combustion inhaler.
[Fig. 22] Fig. 22 is a view illustrating a main surface of a receptacle-mounted board.
[Fig. 23] Fig. 23 is a view illustrating a secondary surface of the receptacle-mounted
board.
[Fig. 24] Fig. 24 is a view illustrating an inner structure of the receptacle-mounted
board.
[Fig. 25] Fig. 25 is a view illustrating a main surface of an MCU-mounted board.
[Fig. 26] Fig. 26 is a view illustrating a secondary surface of the MCU-mounted board.
DESCRIPTION OF EMBODIMENTS
[0010] Hereinafter, an inhaling system as an embodiment of an aerosol generating device
according to the present invention will be described with reference to the drawings.
The inhaling system includes a non-combustion inhaler 100 (hereinafter, also simply
referred to as "inhaler 100") which is an embodiment of a power supply unit according
to the present invention, and a rod 500 heated by the inhaler 100. In the following
description, a configuration in which the inhaler 100 accommodates a heating unit
in an undetachable manner will be described as an example. However, the heating unit
may be attachable to and detachable from the inhaler 100. For example, the rod 500
and the heating unit may be integrated and attachable to and detachable from the inhaler
100. That is, the power supply unit for the aerosol generating device may have a configuration
that does not include the heating unit as a component. The term "undetachable" refers
to an aspect in which detachment cannot be performed as long as in an assumed application.
Alternatively, an induction heating coil provided in the inhaler 100 and a susceptor
built in the rod 500 may cooperate to constitute the heating unit.
[0011] Fig. 1 is a perspective view illustrating an overall configuration of the inhaler
100. Fig. 2 is a perspective view of the inhaler 100 with the rod 500 attached. Fig.
3 is another perspective view of the inhaler 100. Fig. 4 is an exploded perspective
view of the inhaler 100. In addition, in the following description, for convenience,
an orthogonal coordinate system in a three-dimensional space in which three directions
orthogonal to one another are defined as a front-rear direction, a left-right direction,
and an up-down direction will be described. In the drawings, a front side is denoted
by Fr, a rear side is denoted by Rr, a right side is denoted by R, a left side is
denoted by L, an upper side is denoted by U, and a lower side is denoted by D.
[0012] The inhaler 100 is configured to generate an aerosol containing a flavor by heating
the rod 500 which is elongated and substantially columnar (see Fig. 2) as an example
of a flavor component generating base material having a filler containing an aerosol
source and a flavor source.
<Flavor Component Generating Base Material (Rod)>
[0013] The rod 500 includes a filler containing an aerosol source which is heated at a predetermined
temperature to generate aerosol.
[0014] The type of the aerosol source is not particularly limited, and an extract substance
from various natural products and/or a constituent component thereof can be selected
according to a purpose. The aerosol source may be a solid, or may be, for example,
a polyhydric alcohol such as glycerin or propylene glycol, or a liquid such as water.
The aerosol source may include a flavor source such as a tobacco raw material which
releases a flavor component by heating, or an extract originated from a tobacco raw
material. The gas to which the flavor component is added is not limited to the aerosol,
and for example, invisible steam may be generated.
[0015] The filler of the rod 500 may contain cut tobacco as the flavor source. A material
of the cut tobacco is not specifically limited, and publicly known material such as
a lamina and a stem may be used as the material. The filler may contain one kind or
two or more kinds of flavors. The kinds of flavors are not specifically limited, however,
in view of provision of satisfactory smoke flavor, a flavor is menthol, preferably.
The flavor source may contain plants other than tobacco(for example, mints, herbal
medicines, or herbs). The rod 500 may not contain a flavor source depending on the
purpose.
<Overall Configuration of Non-combustion Inhaler>
[0016] Next, an overall configuration of the inhaler 100 will be described with reference
to Figs. 1 to 4.
[0017] The inhaler 100 includes a substantially rectangular case 110 having a front surface,
a rear surface, a left surface, a right surface, an upper surface, and a lower surface.
The case 110 includes a bottomed tubular case main body 112 in which the front surface,
the rear surface, the upper surface, the lower surface, and the right surface are
integrally formed, an outer panel 115 and an inner panel 118 which seal an opening
portion 114 (see Fig. 4) of the case main body 112 and constitute the left surface,
and a slider 119.
[0018] The inner panel 118 is fixed to the case main body 112 by bolts 120. The outer panel
115 is fixed to the case main body 112 by magnets 124 held by an insulating chassis
150 (see Fig. 5) to be described later accommodated in the case main body 112, so
as to cover an outer surface of the inner panel 118. The outer panel 115 is fixed
by the magnets 124, so that a user may replace the outer panel 115 as desired.
[0019] The inner panel 118 is provided with two through holes 126 through which the magnets
124 pass. The inner panel 118 is further provided with a vertically long hole 127
and a circular round hole 128 between the two through holes 126 disposed vertically.
The long hole 127 is used to transmit light emitted from eight light emitting diodes
(LEDs) L1 to L8 built in the case main body 112. A button-type operation switch OPS
built in the case main body 112 passes through the round hole 128. Accordingly, the
user can detect the light emitted from the eight LEDs L1 to L8 through a LED window
116 of the outer panel 115. In addition, the user can press down the operation switch
OPS via a pressing portion 117 of the outer panel 115.
[0020] As illustrated in Fig. 2, an opening 132 into which the rod 500 may be inserted is
provided in the upper surface of the case main body 112. The slider 119 is coupled
to the case main body 112 between a position where the opening 132 is closed (see
Fig. 1) and a position where the opening 132 is opened (see Fig. 2), so as to be movable
in the front-rear direction.
[0021] The operation switch OPS is used to perform various operations of the inhaler 100.
For example, the user operates the operation switch OPS via the pressing portion 117
in a state where the rod 500 is inserted into the opening 132 and mounted as illustrated
in Fig. 2. Accordingly, the rod 500 is heated by the heating unit 170 (see Fig. 5)
without combustion. In a case where the rod 500 is heated, aerosol is generated from
the aerosol source contained in the rod 500, and the flavor of the flavor source contained
in the rod 500 is added to the aerosol. The user can inhale the aerosol containing
the flavor by holding in the mouth an inhaling port 502 of the rod 500 protruding
from the opening 132 to perform inhaling.
[0022] As illustrated in Fig. 3, a charging terminal 134 which is electrically connected
to an external power supply such as an outlet or a mobile battery and receives supply
of power is provided on the lower surface of the case main body 112. In the present
embodiment, the charging terminal 134 is a universal serial bus (USB) Type-C receptacle,
but is not limited thereto. The charging terminal 134 is hereinafter also referred
to as a receptacle RCP.
[0023] The charging terminal 134 may include, for example, a power receiving coil, and may
receive power transmitted from the external power supply in a non-contact manner.
A method of wireless power transfer in this case may be an electromagnetic induction
type, a magnetic resonance type, or a combination of the electromagnetic induction
type and the magnetic resonance type. As another example, the charging terminal 134
may be connectable to various USB terminals or the like, and may include the above-described
power receiving coil.
[0024] A configuration of the inhaler 100 illustrated in Figs. 1 to 4 is merely an example.
The inhaler 100 can be configured in various forms in which the rod 500 is held and
applied with an action such as heating to generate a gas to which a flavor component
is added from the rod 500, and a user can inhale the generated gas.
<Internal Configuration of Non-combustion Inhaler>
[0025] An internal unit 140 of the inhaler 100 will be described with reference to Figs.
5 to 8.
[0026] Fig. 5 is a perspective view of the internal unit 140 of the inhaler 100. Fig. 6
is an exploded perspective view of the internal unit 140 in Fig. 5. Fig. 7 is a perspective
view of the internal unit 140 from which a power supply BAT and the chassis 150 are
removed. Fig. 8 is another perspective view of the internal unit 140 from which the
power supply BAT and the chassis 150 are removed.
[0027] The internal unit 140 accommodated in an internal space of the case 110 includes
the chassis 150, the power supply BAT, a circuit unit 160, a heating unit 170, a notification
unit 180, and various sensors.
[0028] The chassis 150 is made of an insulating material, such as a resin, which has a property
that does not allow heat to pass through easily. The chassis 150 includes a plate-shaped
chassis main body 151 which is disposed substantially in a center of the internal
space of the case 110 in the front-rear direction and which extends in the up-down
direction and the front-rear direction, a plate-shaped front-rear dividing wall 152
which is disposed substantially in the center of the internal space of the case 110
in the front-rear direction and which extends in the up-down direction and the left-right
direction, a plate-shaped up-down dividing wall 153 which extends forward from substantially
a center of the front-rear dividing wall 152 in the up-down direction, a plate-shaped
chassis upper wall 154 which extends rearward from upper edge portions of the front-rear
dividing wall 152 and the chassis main body 151, and a plate-shaped chassis lower
wall 155 which extends rearward from lower edge portions of the front-rear dividing
wall 152 and the chassis main body 151. A left surface of the chassis main body 151
is covered with the inner panel 118 and the outer panel 115 of the case 110 described
above.
[0029] By the chassis 150, a heating unit accommodation region 142 is defined and formed
in an upper front portion of the internal space of the case 110, a board accommodation
region 144 is defined and formed in a lower front portion thereof, and a power supply
accommodation space 146 is defined and formed in a rear portion thereof over the up-down
direction.
[0030] The heating unit 170 accommodated in the heating unit accommodation region 142 is
constituted by a plurality of tubular members, and the tubular members are concentrically
disposed to form a tubular body as a whole. The heating unit 170 includes a rod accommodation
portion 172 capable of accommodating a part of the rod 500 therein, and a heater HTR
(see Figs. 10 to 19) which heats the rod 500 from an outer periphery or a center It
is preferable that a surface of the rod accommodation portion 172 and the heater HTR
are thermally insulated by forming the rod accommodation portion 172 with a heat insulating
material or providing a heat insulating material inside the rod accommodation portion
172. The heater HTR may be an element capable of heating the rod 500. The heater HTR
is, for example, a heating element. Examples of the heating element include a heating
resistor, a ceramic heater, and an induction-heating-type heater. As the heater HTR,
for example, a heater having a positive temperature coefficient (PTC) characteristic
in which a resistance value increases with an increase in temperature is preferably
used. Alternatively, a heater HTR having a negative temperature coefficient (NTC)
characteristic in which the resistance value decreases with an increase in temperature
may be used. The heating unit 170 has a function of defining a flow path of air supplied
to the rod 500 and a function of heating the rod 500. The case 110 is formed with
a vent hole (not illustrated) for allowing air to flow in so that air can flow into
the heating unit 170.
[0031] The power supply BAT accommodated in the power supply accommodation space 146 is
a rechargeable secondary battery, an electric double layer capacitor, or the like,
and is preferably a lithium ion secondary battery. An electrolyte of the power supply
BAT may be constituted by one or a combination of a gel electrolyte, an electrolytic
solution, a solid electrolyte, and an ionic liquid.
[0032] The notification unit 180 notifies various types of information such as a state of
charge (SOC) indicating a charging state of the power supply BAT, a preheating time
at the time of inhaling, and an inhaling available period. The notification unit 180
according to the present embodiment includes the eight LEDs L1 to L8 and a vibration
motor M. The notification unit 180 may be constituted by a light emitting element
such as the LEDs L1 to L8, a vibration element such as the vibration motor M, or a
sound output element. The notification unit 180 may be a combination of two or more
elements among a light emitting element, a vibration element, and a sound output element.
[0033] The various sensors include an intake sensor which detects a puff operation (inhaling
operation) of the user, a power supply temperature sensor which detects a temperature
of the power supply BAT, a heater temperature sensor which detects a temperature of
the heater HTR, a case temperature sensor which detects a temperature of the case
110, a cover position sensor which detects a position of the slider 119, a panel detection
sensor which detects attachment and detachment of the outer panel 115, and the like.
[0034] The intake sensor mainly includes, for example, a thermistor T2 disposed in the vicinity
of the opening 132. The power supply temperature sensor mainly includes, for example,
a thermistor T1 disposed in the vicinity of the power supply BAT. The heater temperature
sensor mainly includes, for example, a thermistor T3 disposed in the vicinity of the
heater HTR. As described above, the rod accommodation portion 172 is preferably thermally
insulated from the heater HTR. In this case, the thermistor T3 is preferably in contact
with or close to the heater HTR inside the rod accommodation portion 172. In a case
where the heater HTR has the PTC characteristic or the NTC characteristic, the heater
HTR may be used for the heater temperature sensor. The case temperature sensor mainly
includes, for example, a thermistor T4 disposed in the vicinity of the left surface
of the case 110. The cover position sensor mainly includes a Hall IC 14 including
a Hall element disposed in the vicinity of the slider 119. The panel detection sensor
mainly includes a Hall IC 13 including a Hall element disposed in the vicinity of
an inner surface of the inner panel 118.
[0035] The circuit unit 160 includes four circuit boards, a plurality of integrate circuits
(ICs), and a plurality of elements. The four circuit boards include an MCU-mounted
board 161 to be described later on which a micro controller unit (MCU) 1 and a charging
IC 2 are mainly disposed, a receptacle-mounted board 162 on which the charging terminal
134 is mainly disposed, an LED-mounted board 163 on which the operation switch OPS,
the LEDs L1 to L8, and a communication IC 15 to be described later are disposed, and
a Hall IC-mounted board 164 on which the Hall IC 14 to be described later including
a Hall element constituting the cover position sensor is disposed.
[0036] The MCU-mounted board 161 and the receptacle-mounted board 162 are disposed in parallel
with each other in the board accommodation region 144. Specifically, the MCU-mounted
board 161 and the receptacle-mounted board 162 are disposed such that element disposition
surfaces thereof extend in the left-right direction and the up-down direction, and
the MCU-mounted board 161 is disposed in front of the receptacle-mounted board 162.
Each of the MCU-mounted board 161 and the receptacle-mounted board 162 is provided
with an opening portion. The MCU-mounted board 161 and the receptacle-mounted board
162 are fastened, by a bolt 136, to a board fixing portion 156 of the front-rear dividing
wall 152 in a state where a cylindrical spacer 173 is interposed between peripheral
portions of the respective opening portions. That is, the spacer 173, together with
the chassis 150, fixes positions of the MCU-mounted board 161 and the receptacle-mounted
board 162 inside the case 110, and mechanically connects the MCU-mounted board 161
and the receptacle-mounted board 162. Accordingly, the MCU-mounted board 161 and the
receptacle-mounted board 162 come into contact with each other, and it is possible
to prevent the occurrence of a short-circuit current therebetween. The spacer 173
may have conductivity, and a ground of the MCU-mounted board 161 and a ground of the
receptacle-mounted board 162 may be connected via the spacer 173.
[0037] For convenience, assuming that the surfaces of the MCU-mounted board 161 and the
receptacle-mounted board 162 facing the front are main surfaces 161a and 162a, respectively,
and surfaces opposite to the main surfaces 161a and 162a are secondary surfaces 161b
and 162b, respectively, the secondary surface 161b of the MCU-mounted board 161 and
the main surface 162a of the receptacle-mounted board 162 face each other with a predetermined
gap therebetween. The main surface 161a of the MCU-mounted board 161 faces the front
surface of the case 110, and the secondary surface 162b of the receptacle-mounted
board 162 faces the front-rear dividing wall 152 of the chassis 150. The MCU-mounted
board 161 and the receptacle-mounted board 162 are electrically connected via a flexible
wiring board 165. A thermal diffusion member 300 to be described later is provided
on the secondary surface 162b of the receptacle-mounted board 162.
[0038] The LED-mounted board 163 is disposed on a left side surface of the chassis main
body 151 and between the two magnets 124 disposed vertically. An element disposition
surface of the LED-mounted board 163 is disposed along the up-down direction and the
front-rear direction. In other words, element disposition surfaces of the MCU-mounted
board 161 and the receptacle-mounted board 162 are orthogonal to the element disposition
surface of the LED-mounted board 163. In this way, the element disposition surfaces
of the MCU-mounted board 161 and the receptacle-mounted board 162 and the element
disposition surface of the LED-mounted board 163 are not limited to being orthogonal
to one another, and preferably intersect with one another (not parallel with one another).
The vibration motor M constituting the notification unit 180 together with the LEDs
L1 to L8 is fixed to a lower surface of the chassis lower wall 155 and is electrically
connected to the MCU-mounted board 161.
[0039] The Hall IC-mounted board 164 is disposed on the upper surface of the chassis upper
wall 154.
<Operation Modes of Inhaler>
[0040] Fig. 9 is a schematic diagram for illustrating operation modes of the inhaler 100.
As illustrated in Fig. 9, the operation modes of the inhaler 100 include a charging
mode, a sleep mode, an active mode, a heating initial setting mode, a heating mode,
and a heating completion mode.
[0041] The sleep mode is a mode in which supply of power to electronic components mainly
required for heating control of the heater HTR is stopped to save power
The active mode is a mode in which most of the functions excluding the heating control
of the heater HTR are enabled. The inhaler 100 switches the operation mode to the
active mode in a case where the slider 119 is opened in a state of operating in the
sleep mode. The inhaler 100 switches the operation mode to the sleep mode in a case
where the slider 119 is closed or a non-operation time of the operation switch OPS
reaches a predetermined time in a state of operating in the active mode.
[0042] The heating initial setting mode is a mode for performing initial setting of control
parameters and the like for starting the heating control of the heater HTR. The inhaler
100 switches the operation mode to the heating initial setting mode in a case where
the operation of the operation switch OPS is detected in a state of operating in the
active mode, and switches the operation mode to the heating mode in a case where the
initial setting is completed.
[0043] The heating mode is a mode in which the heating control of the heater HTR (heating
control for aerosol generating and heating control for temperature detection) is executed.
The inhaler 100 starts the heating control of the heater HTR in a case where the operation
mode is switched to the heating mode.
[0044] The heating completion mode is a mode in which a completion process (storage process
of heating history or the like) of the heating control of the heater HTR is executed.
The inhaler 100 switches the operation mode to the heating completion mode in a case
where an energization time to the heater HTR or the number of times of inhaling by
the user reaches an upper limit or the slider 119 is closed in a state of operating
in the heating mode, and switches the operation mode to the active mode in a case
where the completion process is completed. The inhaler 100 switches the operation
mode to the heating completion mode in a case where a USB connection is established
in a state of operating in the heating mode, and switches the operation mode to the
charging mode in a case where the completion process is completed. As illustrated
in Fig. 9, in this case, the operation mode may be switched to the active mode before
the operation mode is switched to the charging mode. In other words, the inhaler 100
may switch the operation mode in the order of the heating completion mode, the active
mode, and the charging mode in a case where the USB connection is established in a
state of operating in the heating mode.
[0045] The charging mode is a mode in which the power supply BAT is charged by power supplied
from the external power supply connected to the receptacle RCP. The inhaler 100 switches
the operation mode to the charging mode in a case where an external power supply is
connected (USB connected) to the receptacle RCP in a state of operating in the sleep
mode or the active mode. The inhaler 100 switches the operation mode to the sleep
mode in a case where the charging of the power supply BAT is completed or the connection
between the receptacle RCP and the external power supply is released in a state of
operating in the charging mode.
<Outline of Circuit of Internal Unit>
[0046] Figs. 10, 11, and 12 are diagrams illustrating a schematic configuration of an electric
circuit of the internal unit 140. Fig. 11 is the same as Fig. 10 except that a range
161A (range surrounded by a thick broken line) mounted on the MCU-mounted board 161
and a range 163A (range surrounded by a thick solid line) mounted on the LED-mounted
board 163 are added in the electric circuit illustrated in Fig. 10. Fig. 12 is the
same as Fig. 10 except that a range 162A mounted on the receptacle-mounted board 162
and a range 164A mounted on the Hall IC-mounted board 164 are added in the electric
circuit illustrated in Fig. 10.
[0047] A wiring indicated by a thick solid line in Fig. 10 is a wiring having the same potential
as a reference potential (ground potential) of the internal unit 140 (wiring connected
to a ground provided in the internal unit 140), and this wiring is hereinafter referred
to as a ground line. In Fig. 10, an electronic component in which a plurality of circuit
elements are formed into a chip is indicated by a rectangle, and reference numerals
of various terminals are described inside the rectangle. A power supply terminal VCC
and a power supply terminal VDD mounted on the chip each indicate a power supply terminal
on a high potential side. A power supply terminal VSS and a ground terminal GND mounted
on the chip each indicate a power supply terminal on a low potential side (reference
potential side). In the electronic component formed into a chip, a difference between
a potential of the power supply terminal on the high potential side and a potential
of the power supply terminal on the low potential side becomes a power supply voltage.
The electronic component formed into a chip executes various functions using the power
supply voltage.
[0048] As illustrated in Fig. 11, the MCU-mounted board 161 (range 161A) is provided with,
as main electronic components, the MCU 1 which performs overall control of the inhaler
100, the charging IC 2 which performs charging control of the power supply BAT, load
switches (hereinafter, LSW) 3, 4, and 5 configured by combining a capacitor, a resistor,
a transistor, and the like, a read only memory (ROM) 6, a switch driver 7, a step-up/step-down
DC/DC converter 8 (described as step-up/step-down DC/DC 8 in the drawing), an operational
amplifier OP2, an operational amplifier OP3, flip-flops (hereinafter, FF) 16 and 17,
a connector Cn (t2) electrically connected to the thermistor T2 constituting the intake
sensor (described as the thermistor T2 connected to the connector in the drawing),
a connector Cn (t3) electrically connected to the thermistor T3 constituting the heater
temperature sensor (described as the thermistor T3 connected to the connector in the
drawing), a connector Cn (t4) electrically connected to the thermistor T4 constituting
the case temperature sensor (described as the thermistor T4 connected to the connector
in the drawing), and a voltage divider circuit Pc for USB connection detection.
[0049] The ground terminal GND of each of the charging IC 2, LSW 3, LSW 4, LSW 5, the switch
driver 7, the step-up/step-down DC/DC converter 8, the FF 16, and the FF 17 is connected
to the ground line. The power supply terminal VSS of the ROM 6 is connected to the
ground line. Negative power supply terminals of the operational amplifiers OP2 and
the operational amplifier OP3 are connected to the ground line.
[0050] As illustrated in Fig. 11, the LED-mounted board 163 (range 163A) is provided with,
as main electronic components, the Hall IC 13 including the Hall element constituting
the panel detection sensor, the LEDs L1 to L8, the operation switch OPS, and the communication
IC 15. The communication IC 15 is a communication module for communicating with an
electronic device such as a smartphone. Each of the power supply terminal VSS of the
Hall IC 13 and the ground terminal GND of the communication IC 15 is connected to
the ground line. The communication IC 15 and the MCU 1 can communicate with each other
via a communication line LN. One end of the operation switch OPS is connected to the
ground line, and the other end of the operation switch OPS is connected to a terminal
P4 of the MCU 1.
[0051] As illustrated in Fig. 12, the receptacle-mounted board 162 (range 162A) is provided
with, as main electronic components, a power supply connector electrically connected
to the power supply BAT (described as the power supply BAT connected to the power
supply connector in the drawing), a connector electrically connected to the thermistor
T1 constituting the power supply temperature sensor (described as the thermistor T1
connected to the connector in the drawing), the step-up DC/DC converter 9 (described
as the step-up DC/DC 9 in the drawing), a protection IC 10, an overvoltage protection
IC 11, a remaining amount meter IC 12, the receptacle RCP, the switch S3 to the switch
S6 each constituted by a MOSFET, the operational amplifier OP1, and a pair of heater
connectors Cn (positive electrode side and negative electrode side) electrically connected
to the heater HTR.
[0052] The two ground terminals GND of the receptacle RCP, the ground terminal GND of the
step-up DC/DC converter 9, the power supply terminal VSS of the protection IC 10,
the power supply terminal VSS of the remaining amount meter IC 12, the ground terminal
GND of the overvoltage protection IC 11, and the negative power supply terminal of
the operational amplifier OP1 are each connected to the ground line.
[0053] As illustrated in Fig. 12, the Hall IC-mounted board 164 (range 164A) is provided
with the Hall IC 14 including the Hall element constituting the cover position sensor.
The power supply terminal VSS of the Hall IC 14 is connected to the ground line. An
output terminal OUT of the Hall IC 14 is connected to a terminal P8 of the MCU 1.
The MCU 1 detects opening and closing of the slider 119 based on a signal input to
the terminal P8.
[0054] As illustrated in Fig. 11, a connector electrically connected to the vibration motor
M is provided on the MCU-mounted board 161.
<Details of Circuit of Internal Unit>
[0055] A connection relation among the electronic components will be described below with
reference to Fig. 10.
[0056] Two power supply input terminals V
BUS of the receptacle RCP are each connected to an input terminal IN of the overvoltage
protection IC 11 via a fuse Fs. In a case where a USB plug is connected to the receptacle
RCP and a USB cable including the USB plug is connected to an external power supply,
a USB voltage V
USB is supplied to the two power supply input terminals V
BUS of the receptacle RCP.
[0057] One end of a voltage divider circuit Pa including a series circuit of two resistors
is connected to the input terminal IN of the overvoltage protection IC 11. The other
end of the voltage divider circuit Pa is connected to the ground line. A connection
point of the two resistors constituting the voltage divider circuit Pa is connected
to a voltage detection terminal OVLo of the overvoltage protection IC 11. In a state
where a voltage input to the voltage detection terminal OVLo is less than a threshold,
the overvoltage protection IC 11 outputs the voltage input to the input terminal IN
from the output terminal OUT. In a case where the voltage input to the voltage detection
terminal OVLo is equal to or higher than a threshold (overvoltage), the overvoltage
protection IC 11 stops the voltage output from the output terminal OUT (cuts off an
electrical connection between the LSW 3 and the receptacle RCP) to protect the electronic
components downstream of the overvoltage protection IC 11. The output terminal OUT
of the overvoltage protection IC 11 is connected to an input terminal VIN of the LSW
3 and one end of the voltage divider circuit Pc (series circuit of two resistors)
connected to the MCU 1. The other end of the voltage divider circuit Pc is connected
to the ground line. A connection point of the two resistors constituting the voltage
divider circuit Pc is connected to a terminal P17 of the MCU 1.
[0058] One end of a voltage divider circuit Pf including a series circuit of two resistors
is connected to the input terminal VIN of the LSW 3. The other end of the voltage
divider circuit Pf is connected to the ground line. A connection point of the two
resistors constituting the voltage divider circuit Pf is connected to a control terminal
ON of the LSW 3. A collector terminal of a bipolar transistor S2 is connected to the
control terminal ON of the LSW 3. An emitter terminal of the bipolar transistor S2
is connected to the ground line. A base terminal of the bipolar transistor S2 is connected
to a terminal P19 of the MCU 1. The LSW 3 outputs a voltage input to the input terminal
VIN from an output terminal VOUT in a case where a signal input to the control terminal
ON becomes a high level. The output terminal VOUT of the LSW 3 is connected to an
input terminal VBUS of the charging IC 2.
[0059] The MCU 1 turns on the bipolar transistor S2 while the USB connection is not established.
Accordingly, since the control terminal ON of the LSW 3 is connected to the ground
line via the bipolar transistor S2, a low-level signal is input to the control terminal
ON of the LSW 3.
[0060] The bipolar transistor S2 connected to the LSW 3 is turned off by the MCU 1 in a
case where the USB connection is established. By turning off the bipolar transistor
S2, the USB voltage V
USB divided by the voltage divider circuit Pf is input to the control terminal ON of
the LSW 3. Therefore, in a case where the USB connection is established and the bipolar
transistor S2 is turned off, a high-level signal is input to the control terminal
ON of the LSW 3. Accordingly, the LSW 3 outputs, from the output terminal VOUT, the
USB voltage V
USB supplied from the USB cable. Even when the USB connection is established in a state
where the bipolar transistor S2 is not turned off, the control terminal ON of the
LSW 3 is connected to the ground line via the bipolar transistor S2. Therefore, it
should be noted that a low-level signal continues to be input to the control terminal
ON of the LSW 3 unless the MCU 1 turns off the bipolar transistor S2.
[0061] A positive electrode terminal of the power supply BAT is connected to the power supply
terminal VDD of the protection IC 10, an input terminal VIN of the step-up DC/DC converter
9, and a charging terminal bat of the charging IC 2. Therefore, the power supply voltage
V
BAT of the power supply BAT is supplied to the protection IC 10, the charging IC 2, and
the step-up DC/DC converter 9. A resistor Ra, a switch Sa constituted by a MOSFET,
a switch Sb constituted by a MOSFET, and a resistor Rb are connected in series to
a negative electrode terminal of the power supply BAT in this order. A current detection
terminal CS of the protection IC 10 is connected to a connection point between the
resistor Ra and the switch Sa. Each of control terminals of the switch Sa and the
switch Sb is connected to the protection IC 10. Both ends of the resistor Rb are connected
to the remaining amount meter IC 12.
[0062] The protection IC 10 acquires, based on a voltage input to the current detection
terminal CS (a voltage applied to both ends of the resistor Ra), a current value flowing
through the resistor Ra during charging and discharging of the power supply BAT, and
performs, when the current value is excessive (overcurrent), opening and closing control
of the switch Sa and the switch Sb to stop the charging or the discharging of the
power supply BAT, thereby protecting the power supply BAT. More specifically, in a
case where an excessively large current value is acquired at the time of charging
the power supply BAT, the protection IC 10 turns off the switch Sb to stop the charging
of the power supply BAT. In a case where an excessively large current value is acquired
at the time of discharging the power supply BAT, the protection IC 10 turns off the
switch Sa to stop the discharging of the power supply BAT. In addition, in a case
where a voltage value of the power supply BAT becomes abnormal based on the voltage
input to the power supply terminal VDD (in a case of overcharge or overvoltage), the
protection IC 10 performs opening and closing control of the switch Sa and the switch
Sb to stop charging or discharging of the power supply BAT, thereby protecting the
power supply BAT. More specifically, in a case where the overcharge of the power supply
BAT is detected, the protection IC 10 turns off the switch Sb to stop the charging
of the power supply BAT. In a case where the overdischarge of the power supply BAT
is detected, the protection IC 10 turns off the switch Sa to stop the discharging
of the power supply BAT.
[0063] A resistor Rt1 is connected to the connector which is connected to the thermistor
T1 disposed in the vicinity of the power supply BAT. A series circuit of the resistor
Rt1 and the thermistor T1 is connected to the ground line and a regulator terminal
TREG of the remaining amount meter IC 12. A connection point between the thermistor
T1 and the resistor Rt1 is connected to a thermistor terminal THM of the remaining
amount meter IC 12. The thermistor T1 may be a positive temperature coefficient (PTC)
thermistor whose resistance value increases as the temperature increases, or may be
a negative temperature coefficient (NTC) thermistor whose resistance value decreases
as the temperature increases.
[0064] The remaining amount meter IC 12 detects a current flowing through the resistor Rb
and derives battery information such as a remaining capacity of the power supply BAT,
a state of charge (SOC) indicating a charging state, and a state of health (SOH) indicating
a health state based on the detected current value. The remaining amount meter IC
12 supplies a voltage from a built-in regulator connected to the regulator terminal
TREG to a voltage divider circuit of the thermistor T1 and the resistor Rt1. The remaining
amount meter IC 12 acquires a voltage divided by the voltage divider circuit from
the thermistor terminal THM, and acquires temperature information related to the temperature
of the power supply BAT based on the voltage. The remaining amount meter IC 12 is
connected to the MCU 1 via the communication line LN for serial communication, and
is configured to be able to communicate with the MCU 1. The remaining amount meter
IC 12 transmits the derived battery information and the acquired temperature information
of the power supply BAT to the MCU 1 in response to a request from the MCU 1. The
MCU 1 controls the discharging from the power supply BAT to the heater HTR based on
a remaining capacity of the power supply BAT acquired by the remaining amount meter
IC 12. That is, when the remaining capacity of the power supply BAT is equal to or
less than a predetermined value, the MCU 1 performs a display for prohibiting the
discharging to the heater HTR and prompting the charging. A plurality of signal lines
such as a data line for data transmission and a clock line for synchronization are
required to perform serial communication. It should be noted that only one signal
line is illustrated in Figs. 10 to 19 for simplification.
[0065] The remaining amount meter IC 12 includes a notification terminal 12a. The notification
terminal 12a is connected to a terminal P6 of the MCU 1 and a cathode of a diode D2
to be described later. In a case where an abnormality such as an excessively high
temperature of the power supply BAT is detected, the remaining amount meter IC 12
outputs a low-level signal from the notification terminal 12a to notify the MCU 1
of the occurrence of the abnormality. The low-level signal is also input to a CLR(
) terminal of the FF 17 via the diode D2.
[0066] One end of a reactor Lc is connected to a switching terminal SW of the step-up DC/DC
converter 9. The other end of the reactor Lc is connected to the input terminal VIN
of the step-up DC/DC converter 9. The step-up DC/DC converter 9 performs ON/OFF control
of a built-in transistor connected to the switching terminal SW, thereby performing
voltage conversion control of stepping up an input voltage and outputs the stepped-up
voltage from an output terminal VOUT thereof. The input terminal VIN of the step-up
DC/DC converter 9 is connected to the power supply BAT and constitutes a power supply
terminal on a high potential side of the step-up DC/DC converter 9. The step-up DC/DC
converter 9 performs a step-up operation in a case where a signal input to an enable
terminal EN is at a high level. In the USB-connected state, the signal input to the
enable terminal EN of the step-up DC/DC converter 9 may be controlled to a low level
by the MCU 1. Alternatively, in the USB-connected state, the MCU 1 may not control
the signal input to the enable terminal EN of the step-up DC/DC converter 9 to make
a potential of the enable terminal EN unstable.
[0067] A source terminal of a switch S4 constituted by a P-channel MOSFET is connected to
the output terminal VOUT of the step-up DC/DC converter 9. A gate terminal of the
switch S4 is connected to a terminal P15 of the MCU 1. One end of a resistor Rs is
connected to a drain terminal of the switch S4. The other end of the resistor Rs is
connected to the heater connector Cn on the positive electrode side connected to one
end of the heater HTR. A voltage divider circuit Pb including two resistors is connected
to a connection point between the switch S4 and the resistor Rs. A connection point
of the two resistors constituting the voltage divider circuit Pb is connected to a
terminal P18 of the MCU 1. A connection point between the switch S4 and the resistor
Rs is further connected to a positive power supply terminal of the operational amplifier
OP1 .
[0068] A connection line between the output terminal VOUT of the step-up DC/DC converter
9 and the source terminal of the switch S4 is connected to a source terminal of the
switch S3 constituted by a P-channel MOSFET. A gate terminal of the switch S3 is connected
to the terminal P16 of the MCU 1. A drain terminal of the switch S3 is connected to
a connection line between the resistor Rs and the heater connector Cn on the positive
electrode side. In this way, a circuit including the switch S3 and a circuit including
the switch S4 and the resistor Rs are connected in parallel between the output terminal
VOUT of the step-up DC/DC converter 9 and the positive electrode side of the heater
connector Cn. The circuit including the switch S3 does not include a resistor, and
thus is a circuit having a lower resistance than the circuit including the switch
S4 and the resistor Rs.
[0069] A non-inverting input terminal of the operational amplifier OP1 is connected to the
connection line between the resistor Rs and the heater connector Cn on the positive
electrode side. An inverting input terminal of the operational amplifier OP1 is connected
to the heater connector Cn on the negative electrode side and a drain terminal of
the switch S6, the heater connector Cn being connected to the other end of the heater
HTR, the drain terminal of the switch S6 being constituted by an N-channel MOSFET.
A source terminal of the switch S6 is connected to the ground line. A gate terminal
of the switch S6 is connected to a terminal P14 of the MCU 1, an anode of the diode
D4, and the enable terminal EN of the step-up DC/DC converter 9. A cathode of the
diode D4 is connected to a Q terminal of the FF 17. One end of a resistor R4 is connected
to an output terminal of the operational amplifier OP1. The other end of the resistor
R4 is connected to a terminal P9 of the MCU 1 and a drain terminal of the switch S5
constituted by an N-channel MOSFET. A source terminal of the switch S5 is connected
to the ground line. A gate terminal of the switch S5 is connected to the connection
line between the resistor Rs and the heater connector Cn on the positive electrode
side.
[0070] The input terminal VBUS of the charging IC 2 is connected to an anode of each of
the LEDs L1 to L8. Cathodes of the LEDs L1 to L8 are connected to control terminals
PD1 to PD8 of the MCU 1 via resistors for current limitation, respectively. That is,
the LEDs L1 to L8 are connected in parallel with the input terminal VBUS. The LEDs
L1 to L8 are configured to be able to be operated by the USB voltage V
USB supplied from the USB cable connected to the receptacle RCP and a voltage supplied
from the power supply BAT via the charging IC 2. Transistors (switching elements)
connected to the control terminals PD1 to PD8 and the ground terminal GND are built
in the MCU 1. The MCU 1 turns on the transistor connected to the control terminal
PD1 to energize the LED L1 and turn on the LED L1. The MCU 1 turns off the transistor
connected to the control terminal PD1 to turn off the LED L1. By switching ON and
OFF of the transistor connected to the control terminal PD1 at a high speed, the luminance
and the light emission pattern of the LED L1 can be dynamically controlled. Similarly,
the LEDs L2 to L8 are controlled to be turned on and turned off by the MCU 1.
[0071] The charging IC 2 has a charging function of charging the power supply BAT based
on the USB voltage V
USB input to the input terminal VBUS. The charging IC 2 acquires a charging current or
a charging voltage of the power supply BAT from a terminal or wiring (not illustrated),
and performs charging control of the power supply BAT (control on supply of power
from the charging terminal bat to the power supply BAT) based on the acquired charging
current or charging voltage. In addition, the charging IC 2 may acquire, from the
MCU 1, the temperature information of the power supply BAT transmitted from the remaining
amount meter IC 12 to the MCU 1 through serial communication using the communication
line LN and use the temperature information for charging control.
[0072] The charging IC 2 further includes a V
BAT power path function and an OTG function. The V
BAT power path function is a function of outputting, from an output terminal SYS, a system
power supply voltage Vcc0 which is substantially equal to the power supply voltage
V
BAT input to the charging terminal bat. The OTG function is a function of outputting
a system power supply voltage Vcc4 obtained by stepping up the power supply voltage
V
BAT input to the charging terminal bat from the input terminal VBUS. ON/OFF of the OTG
function of the charging IC 2 is controlled by the MCU 1 through serial communication
using the communication line LN. In the OTG function, the power supply voltage V
BAT input to the charging terminal bat may be output as it is from the input terminal
VBUS. In this case, the power supply voltage V
BAT is substantially equal to the system power supply voltage Vcc4.
[0073] The output terminal SYS of the charging IC 2 is connected to an input terminal VIN
of the step-up/step-down DC/DC converter 8. One end of a reactor La is connected to
the switching terminal SW of the charging IC 2. The other end of the reactor La is
connected to the output terminal SYS of the charging IC 2. A charge enable terminal
CE( ) of the charging IC 2 is connected to a terminal P22 of the MCU 1 via a resistor.
Further, a collector terminal of the bipolar transistor S1 is connected to the charge
enable terminal CE( ) of the charging IC 2. An emitter terminal of the bipolar transistor
S 1 is connected to an output terminal VOUT of the LSW 4 to be described later. A
base terminal of the bipolar transistor S1 is connected to the Q terminal of the FF
17. Further, one end of a resistor Rc is connected to the charge enable terminal CE(
) of the charging IC 2. The other end of the resistor Rc is connected to the output
terminal VOUT of the LSW 4.
[0074] A resistor is connected to the input terminal VIN and an enable terminal EN of the
step-up/step-down DC/DC converter 8. By inputting the system power supply voltage
Vcc0 from the output terminal SYS of the charging IC 2 to the input terminal VIN of
the step-up/step-down DC/DC converter 8, a signal input to the enable terminal EN
of the step-up/step-down DC/DC converter 8 becomes a high level, and the step-up/step-down
DC/DC converter 8 starts a step-up operation or a step-down operation. The step-up/step-down
DC/DC converter 8 steps up or steps down the system power supply voltage Vcc0 input
to the input terminal VIN by switching control of a built-in transistor connected
to a reactor Lb to generate a system power supply voltage Vcc1, and outputs the system
power supply voltage Vcc1 from the output terminal VOUT. The output terminal VOUT
of the step-up/step-down DC/DC converter 8 is connected to a feedback terminal FB
of the step-up/step-down DC/DC converter 8, an input terminal VIN of the LSW 4, an
input terminal VIN of the switch driver 7, and the power supply terminal VCC and a
D terminal of the FF 16. A wiring to which the system power supply voltage Vcc1 output
from the output terminal VOUT of the step-up/step-down DC/DC converter 8 is supplied
is referred to as a power supply line PL1.
[0075] In a case where the signal input to a control terminal ON becomes a high level, the
LSW 4 outputs, from the output terminal VOUT, the system power supply voltage Vcc1
input to the input terminal VIN. The control terminal ON of the LSW 4 and the power
supply line PL1 are connected via a resistor. Therefore, by supplying the system power
supply voltage Vcc1 to the power supply line PL1, the high-level signal is input to
the control terminal ON of the LSW 4. The voltage output by the LSW 4 is the same
as the system power supply voltage Vcc1 when a wiring resistance or the like is ignored,
but in order to distinguish from the system power supply voltage Vcc1, the voltage
output from the output terminal VOUT of the LSW 4 is hereinafter referred to as a
system power supply voltage Vcc2.
[0076] The output terminal VOUT of the LSW 4 is connected to the power supply terminal VDD
of the MCU 1, an input terminal VIN of the LSW 5, the power supply terminal VDD of
the remaining amount meter IC 12, the power supply terminal VCC of the ROM 6, the
emitter terminal of the bipolar transistor S1, the resistor Rc, and the power supply
terminal VCC of the FF 17. A wiring to which the system power supply voltage Vcc2
output from the output terminal VOUT of the LSW 4 is supplied is referred to as a
power supply line PL2.
[0077] When a signal input to a control terminal ON is at a high level, the LSW 5 outputs,
from an output terminal VOUT, the system power supply voltage Vcc2 input to the input
terminal VIN. The control terminal ON of the LSW 5 is connected to a terminal P23
of the MCU 1. A voltage output by the LSW 5 is the same as the system power supply
voltage Vcc2 when a wiring resistance or the like is ignored, but in order to distinguish
from the system power supply voltage Vcc2, the voltage output from the output terminal
VOUT of the LSW 5 is hereinafter referred to as a system power supply voltage Vcc3.
A wiring to which the system power supply voltage Vcc3 output from the output terminal
VOUT of the LSW 5 is supplied is referred to as a power supply line PL3.
[0078] A series circuit of the thermistor T2 and a resistor Rt2 is connected to the power
supply line PL3, and the resistor Rt2 is connected to the ground line. The thermistor
T2 and the resistor Rt2 constitute a voltage divider circuit, and a connection point
thereof is connected to a terminal P21 of the MCU 1. The MCU 1 detects a temperature
variation (resistance value variation) of the thermistor T2 based on the voltage input
to the terminal P21, and determines presence or absence of a puff operation based
on a temperature variation amount.
[0079] A series circuit of the thermistor T3 and a resistor Rt3 is connected to the power
supply line PL3, and the resistor Rt3 is connected to the ground line. The thermistor
T3 and the resistor Rt3 constitute a voltage divider circuit, and a connection point
thereof is connected to a terminal P13 of the MCU 1 and an inverting input terminal
of the operational amplifier OP2. The MCU 1 detects a temperature of the thermistor
T3 (corresponding to the temperature of the heater HTR) based on the voltage input
to the terminal P13.
[0080] A series circuit of the thermistor T4 and a resistor Rt4 is connected to the power
supply line PL3, and the resistor Rt4 is connected to the ground line. The thermistor
T4 and the resistor Rt4 constitute a voltage divider circuit, and a connection point
thereof is connected to a terminal P12 of the MCU 1 and an inverting input terminal
of the operational amplifier OP3. The MCU 1 detects a temperature of the thermistor
T4 (corresponding to the temperature of the case 110) based on the voltage input to
the terminal P12.
[0081] A source terminal of a switch S7 implemented by a MOSFET is connected to the power
supply line PL2. A gate terminal of the switch S7 is connected to a terminal P20 of
the MCU 1. A drain terminal of the switch S7 is connected to one of a pair of connectors
to which the vibration motor M is connected. The other of the pair of connectors is
connected to the ground line. The MCU 1 can control opening and closing of the switch
S7 by operating a potential of the terminal P20 to vibrate the vibration motor M in
a specific pattern. A dedicated driver IC may be used instead of the switch S7.
[0082] A positive power supply terminal of the operational amplifier OP2 and a voltage divider
circuit Pd (series circuit of two resistors) connected to a non-inverting input terminal
of the operational amplifier OP2 are connected to the power supply line PL2. A connection
point of the two resistors constituting the voltage divider circuit Pd is connected
to the non-inverting input terminal of the operational amplifier OP2. The operational
amplifier OP2 outputs a signal corresponding to the temperature of the heater HTR
(signal corresponding to a resistance value of the thermistor T3). In the present
embodiment, since a thermistor having the NTC characteristic is used as the thermistor
T3, an output voltage of the operational amplifier OP2 decreases as the temperature
of the heater HTR (temperature of the thermistor T3) increases. A reason is that a
negative power supply terminal of the operational amplifier OP2 is connected to the
ground line, and the value of the output voltage of the operational amplifier OP2
becomes substantially equal to the value of the ground potential in a case where the
voltage value (divided value by the thermistor T3 and the resistor Rt3) input to the
inverting input terminal of the operational amplifier OP2 becomes higher than the
voltage value (divided value by the voltage divider circuit Pd) input to the non-inverting
input terminal of the operational amplifier OP2. That is, in a case where the temperature
of the heater HTR (temperature of the thermistor T3) becomes high, the output voltage
of the operational amplifier OP2 becomes a low level.
[0083] In a case where a thermistor having the PTC characteristic is used as the thermistor
T3, outputs of voltage divider circuits of the thermistor T3 and the resistor Rt3
may be connected to the non-inverting input terminal of the operational amplifier
OP2, and an output of the voltage divider circuit Pd may be connected to the inverting
input terminal of the operational amplifier OP2.
[0084] A positive power supply terminal of the operational amplifier OP3 and a voltage divider
circuit Pe (series circuit of two resistors) connected to a non-inverting input terminal
of the operational amplifier OP3 are connected to the power supply line PL2. A connection
point of the two resistors constituting the voltage divider circuit Pe is connected
to the non-inverting input terminal of the operational amplifier OP3. The operational
amplifier OP3 outputs a signal corresponding to the temperature of the case 110 (signal
corresponding to a resistance value of the thermistor T4). In the present embodiment,
since a thermistor having the NTC characteristic is used as the thermistor T4, the
output voltage of the operational amplifier OP3 decreases as the temperature of the
case 110 increases. A reason is that a negative power supply terminal of the operational
amplifier OP3 is connected to the ground line, and the value of the output voltage
of the operational amplifier OP3 becomes substantially equal to the value of the ground
potential in a case where the voltage value (divided value by the thermistor T4 and
the resistor Rt4) input to the inverting input terminal of the operational amplifier
OP3 becomes higher than the voltage value (divided value by the voltage divider circuit
Pe) input to the non-inverting input terminal of the operational amplifier OP3. That
is, in a case where the temperature of the thermistor T4 becomes high, the output
voltage of the operational amplifier OP3 becomes a low level.
[0085] In a case where a thermistor having the PTC characteristic is used as the thermistor
T4, outputs of voltage divider circuits of the thermistor T4 and the resistor Rt4
may be connected to the non-inverting input terminal of the operational amplifier
OP3, and an output of the voltage divider circuit Pe may be connected to the inverting
input terminal of the operational amplifier OP3.
[0086] A resistor R1 is connected to an output terminal of the operational amplifier OP2.
A cathode of a diode D1 is connected to the resistor R1. An anode of the diode D1
is connected to an output terminal of the operational amplifier OP3, a D terminal
of the FF 17, and a CLR( ) terminal of the FF 17. A resistor R2 connected to the power
supply line PL1 is connected to a connection line between the resistor R1 and the
diode D1. In addition, a CLR( ) terminal of the FF 16 is connected to the connection
line.
[0087] One end of a resistor R3 is connected to a connection line between the D terminal
of the FF 17 and a connection point between the anode of the diode D1 and the output
terminal of the operational amplifier OP3. The other end of the resistor R3 is connected
to the power supply line PL2. Further, an anode of the diode D2 connected to the notification
terminal 12a of the remaining amount meter IC 12, an anode of a diode D3, and the
CLR( ) terminal of the FF 17 are connected to the connection line. A cathode of the
diode D3 is connected to a terminal P5 of the MCU 1.
[0088] In a case where the temperature of the heater HTR becomes excessively high, the signal
output from the operational amplifier OP2 becomes small, and the signal input to the
CLR( ) terminal becomes a low level, the FF 16 inputs a high-level signal from a Q(
) terminal to a terminal P11 of the MCU 1. A high-level system power supply voltage
Vcc1 is supplied from the power supply line PL1 to the D terminal of the FF 16. Therefore,
in the FF 16, a low-level signal is continuously output from the QC) terminal unless
the signal input to the CLR( ) terminal operating with a negative logic becomes a
low level.
[0089] The signal input to the CLR( ) terminal of the FF 17 becomes a low level in a case
where the temperature of the heater HTR becomes excessively high, in a case where
the temperature of the case 110 becomes excessively high, or in a case where a low-level
signal indicating abnormality detection is output from the notification terminal 12a
of the remaining amount meter IC 12. The FF 17 outputs a low-level signal from the
Q terminal in a case where the signal input to the CLR( ) terminal becomes a low level.
The low-level signal is input to a terminal P10 of the MCU 1, the gate terminal of
the switch S6, the enable terminal EN of the step-up DC/DC converter 9, and the base
terminal of the bipolar transistor S1 connected to the charging IC 2. In a case where
a low-level signal is input to the gate terminal of the switch S6, a gate-source voltage
of the N-channel MOSFET constituting the switch S6 becomes lower than a threshold
voltage, and thus the switch S6 is turned off. In a case where a low-level signal
is input to the enable terminal EN of the step-up DC/DC converter 9, the enable terminal
EN of the step-up DC/DC converter 9 is a positive logic, and thus the step-up operation
is stopped. In a case where a low-level signal is input to the base terminal of the
bipolar transistor S1, the bipolar transistor S1 is turned on (an amplified current
is output from the collector terminal). In a case where the bipolar transistor S1
is turned on, a high-level system power supply voltage Vcc2 is input to a CE( ) terminal
of the charging IC 2 via the bipolar transistor S1. Since the CE( ) terminal of the
charging IC 2 is a negative logic, the charging of the power supply BAT is stopped.
Accordingly, the heating of the heater HTR and the charging of the power supply BAT
are stopped. Even when the MCU 1 outputs a low-level enable signal from the terminal
P22 to the charge enable terminal CE( ) of the charging IC 2, an amplified current
is input from the collector terminal to the terminal P22 of the MCU 1 and the charge
enable terminal CE( ) of the charging IC 2 in a case where the bipolar transistor
S1 is turned on. Accordingly, it should be noted that a high-level signal is input
to the charge enable terminal CE( ) of the charging IC 2.
[0090] A high-level system power supply voltage Vcc2 is supplied from the power supply line
PL2 to the D terminal of the FF 17. Therefore, in the FF 17, a high-level signal continues
to be output from the Q terminal unless a signal input to the CLR( ) terminal operating
in a negative logic becomes a low level. In a case where a low-level signal is output
from the output terminal of the operational amplifier OP3, the low-level signal is
input to the CLR( ) terminal of the FF 17 regardless of the level of the signal output
from the output terminal of the operational amplifier OP2. It should be noted that
in a case where a high-level signal is output from the output terminal of the operational
amplifier OP2, the low-level signal output from the output terminal of the operational
amplifier OP3 is not affected by the high-level signal by the diode D1. In addition,
in a case where a low-level signal is output from the output terminal of the operational
amplifier OP2, even when a high-level signal is output from the output terminal of
the operational amplifier OP3, the high-level signal is replaced with a low-level
signal via the diode D1.
[0091] The power supply line PL2 further branches from the MCU-mounted board 161 toward
the LED-mounted board 163 and the Hall IC-mounted board 164. A power supply terminal
VDD of the Hall IC 13, a power supply terminal VCC of the communication IC 15, and
a power supply terminal VDD of the Hall IC 14 are connected to the power supply line
PL2 which branches.
[0092] An output terminal OUT of the Hall IC 13 is connected to a terminal P3 of the MCU
1 and a terminal SW2 of the switch driver 7. In a case where the outer panel 115 is
detached, a low-level signal is output from the output terminal OUT of the Hall IC
13. The MCU 1 determines whether the outer panel 115 is attached based on the signal
input to the terminal P3.
[0093] The LED-mounted board 163 is provided with the series circuit (series circuit of
a resistor and a capacitor) connected to the operation switch OPS. The series circuit
is connected to the power supply line PL2. A connection point between the resistor
and the capacitor of the series circuit is connected to the terminal P4 of the MCU
1, the operation switch OPS, and a terminal SW1 of the switch driver 7. In a state
where the operation switch OPS is not pressed, the operation switch OPS is not conducted,
and the signals input to the terminal P4 of the MCU 1 and the terminal SW1 of the
switch driver 7 become a high level by the system power supply voltage Vcc2. In a
case where the operation switch OPS is pressed and the operation switch OPS is brought
into a conductive state, the signals input to the terminal P4 of the MCU 1 and the
terminal SW1 of the switch driver 7 become a low level because of connection to the
ground line. The MCU 1 detects the operation of the operation switch OPS based on
the signal input to the terminal P4.
[0094] The switch driver 7 is provided with a reset input terminal RSTB. The reset input
terminal RSTB is connected to the control terminal ON of the LSW 4. In a case where
both the levels of the signals input to the terminal SW1 and the terminal SW2 become
a low level (a state where the outer panel 115 is detached and the operation switch
OPS is pressed), the switch driver 7 outputs a low-level signal from the reset input
terminal RSTB, thereby stopping the output operation of the LSW 4. That is, in a case
where the operation switch OPS, which is originally pressed down via the pressing
portion 117 of the outer panel 115, is directly pressed down by the user in a state
where the outer panel 115 is detached, both the levels of the signals input to the
terminal SW1 and the terminal SW2 of the switch driver 7 become a low level.
<Operation in Each Operation Mode of Inhaler>
[0095] Hereinafter, operations of the electric circuit illustrated in Fig. 10 will be described
with reference to Figs. 13 to 19. Fig. 13 is a diagram for illustrating an operation
of the electric circuit in the sleep mode. Fig. 14 is a diagram for illustrating an
operation of the electric circuit in the active mode. Fig. 15 is a diagram for illustrating
an operation of the electric circuit in the heating initial setting mode. Fig. 16
is a diagram for illustrating an operation of the electric circuit at the time of
heating the heater HTR in the heating mode. Fig. 17 is a diagram for illustrating
an operation of the electric circuit at the time of detecting the temperature of the
heater HTR in the heating mode. Fig. 18 is a diagram for illustrating an operation
of the electric circuit in the charging mode. Fig. 19 is a diagram for illustrating
an operation of the electric circuit at the time of resetting (restarting) the MCU
1. In each of Figs. 13 to 19, terminals surrounded by a broken ellipse, among the
terminals of the electronic components formed into chips, indicate terminals to which
the power supply voltage V
BAT, the USB voltage V
USB, the system power supply voltage, and the like are input or output.
[0096] In any operation mode, the power supply voltage V
BAT is input to the power supply terminal VDD of the protection IC 10, the input terminal
VIN of the step-up DC/DC converter 9, and the charging terminal bat of the charging
IC 2.
<Sleep Mode: Fig. 13>
[0097] The MCU 1 enables the V
BAT power path function of the charging IC 2 and disables the OTG function and the charging
function. The USB voltage Vusa is not input to the input terminal VBUS of the charging
IC 2, whereby the V
BAT power path function of the charging IC 2 is enabled. Since a signal for enabling
the OTG function from the communication line LN is not output from the MCU 1 to the
charging IC 2, the OTG function is disabled. Therefore, the charging IC 2 generates
the system power supply voltage Vcc0 from the power supply voltage V
BAT input to the charging terminal bat, and outputs the system power supply voltage Vcc0
from the output terminal SYS. The system power supply voltage Vcc0 output from the
output terminal SYS is input to the input terminal VIN and the enable terminal EN
of the step-up/step-down DC/DC converter 8. The step-up/step-down DC/DC converter
8 is enabled by inputting the high-level system power supply voltage Vcc0 to the enable
terminal EN which is a positive logic, generates the system power supply voltage Vcc1
from the system power supply voltage Vcc0, and outputs the system power supply voltage
Vcc1 from the output terminal VOUT. The system power supply voltage Vcc1 output from
the output terminal VOUT of the step-up/step-down DC/DC converter 8 is supplied to
the input terminal VIN of the LSW 4, the control terminal ON of the LSW 4, the input
terminal VIN of the switch driver 7, and the power supply terminal VCC and the D terminal
of the FF 16.
[0098] By inputting the system power supply voltage Vcc1 to the control terminal ON, the
LSW 4 outputs, from the output terminal VOUT, the system power supply voltage Vcc1
input to the input terminal VIN as the system power supply voltage Vcc2. The system
power supply voltage Vcc2 output from the LSW 4 is input to the power supply terminal
VDD of the MCU 1, the input terminal VIN of the LSW 5, the power supply terminal VDD
of the Hall IC 13, the power supply terminal VCC of the communication IC 15, and the
power supply terminal VDD of the Hall IC 14. Further, the system power supply voltage
Vcc2 is supplied to the power supply terminal VDD of the remaining amount meter IC
12, the power supply terminal VCC of the ROM 6, the resistor Rc and the bipolar transistor
S1 connected to the charge enable terminal CE( ) of the charging IC 2, the power supply
terminal VCC of the FF 17, the positive power supply terminal of the operational amplifier
OP3, the voltage divider circuit Pe, the positive power supply terminal of the operational
amplifier OP2, and the voltage divider circuit Pd. The bipolar transistor S1 connected
to the charging IC 2 is turned off unless a low-level signal is output from the Q
terminal of the FF 17. Therefore, the system power supply voltage Vcc2 generated by
the LSW 4 is also input to the charge enable terminal CE( ) of the charging IC 2.
Since the charge enable terminal CE( ) of the charging IC 2 is a negative logic, the
charging function by the charging IC 2 is turned off in this state.
[0099] In this manner, since the LSW 5 stops outputting the system power supply voltage
Vcc3 in the sleep mode, the supply of power to the electronic components connected
to the power supply line PL3 is stopped. In addition, since the OTG function of the
charging IC 2 is stopped in the sleep mode, the supply of power to the LEDs L1 to
L8 is stopped.
<Active Mode: Fig. 14>
[0100] When the MCU 1 detects that the signal input to the terminal P8 becomes a high level
and the slider 119 is opened from the sleep mode state in Fig. 13, the MCU 1 inputs
a high-level signal to the control terminal ON of the LSW 5 from the terminal P23.
Accordingly, the LSW 5 outputs, from the output terminal VOUT, the system power supply
voltage Vcc2 input to the input terminal VIN as the system power supply voltage Vcc3.
The system power supply voltage Vcc3 output from the output terminal VOUT of the LSW
5 is supplied to the thermistor T2, the thermistor T3, and the thermistor T4.
[0101] Further, when the MCU 1 detects that the slider 119 is opened, the MCU 1 enables
the OTG function of the charging IC 2 via the communication line LN. Accordingly,
the charging IC 2 outputs, from the input terminal VBUS, the system power supply voltage
Vcc4 obtained by stepping up the power supply voltage V
BAT input from the charging terminal bat. The system power supply voltage Vcc4 output
from the input terminal VBUS is supplied to the LEDs L1 to L8.
<Heating Initial Setting Mode: Fig. 15>
[0102] In a case where the signal input to the terminal P4 becomes a low level (the operation
switch OPS is pressed) from the state in Fig. 14, the MCU 1 performs various settings
necessary for heating, and then inputs a high-level enable signal from the terminal
P14 to the enable terminal EN of the step-up DC/DC converter 9. Accordingly, the step-up
DC/DC converter 9 outputs, from the output terminal VOUT, the drive voltage V
bst obtained by stepping up the power supply voltage V
BAT. The drive voltage V
bst is supplied to the switch S3 and the switch S4. In this state, the switch S3 and
the switch S4 are turned off. In addition, the switch S6 is turned on by a high-level
enable signal output from the terminal P14. Accordingly, a negative electrode-side
terminal of the heater HTR is connected to the ground line, and the heater HTR is
brought into a state of being heated by turning on the switch S3. After the enable
signal of the high-level signal is output from the terminal P14 of the MCU 1, the
operation mode shifts to the heating mode.
<Heater Heating in Heating Mode: Fig. 16>
[0103] In the state of Fig. 15, the MCU 1 starts switching control of the switch S3 connected
to the terminal P16 and switching control of the switch S4 connected to the terminal
P15. The switching control may be automatically started when the heating initial setting
mode described above is completed, or may be started by further pressing the operation
switch OPS. Specifically, the MCU 1 performs, as illustrated in Fig. 16, heating control
in which the switch S3 is turned on, the switch S4 is turned off, the drive voltage
V
bst is supplied to the heater HTR, and the heater HTR is heated for generating aerosol,
and performs, as illustrated in Fig. 17, temperature detection control in which the
switch S3 is turned off, the switch S4 is turned on, and the temperature of the heater
HTR is detected.
[0104] As illustrated in Fig. 16, during the heating control, the drive voltage V
bst is also supplied to a gate of the switch S5, and the switch S5 is turned on. In addition,
during the heating control, the drive voltage V
bst passing through the switch S3 is also input to the positive power supply terminal
of the operational amplifier OP1 via the resistor Rs. A resistance value of the resistor
Rs is small enough to be negligible as compared with an internal resistance value
of the operational amplifier OP1. Therefore, during the heating control, the voltage
input to the positive power supply terminal of the operational amplifier OP1 is substantially
equal to the drive voltage V
bst.
[0105] A resistance value of the resistor R4 is larger than an on-resistance value of the
switch S5. The operational amplifier OP1 also operates during the heating control,
but the switch S5 is turned on during the heating control. In a state where the switch
S5 is turned on, the output voltage of the operational amplifier OP1 is divided by
a voltage divider circuit of the resistor R4 and the switch S5 and is input to the
terminal P9 of the MCU 1. The resistance value of the resistor R4 is larger than the
on-resistance value of the switch S5, whereby the voltage input to the terminal P9
of the MCU 1 becomes sufficiently small. Accordingly, a large voltage may be prevented
from being input from the operational amplifier OP1 to the MCU 1.
<Heater Temperature Detection in Heating Mode: Fig. 17>
[0106] As illustrated in Fig. 17, during the temperature detection control, the drive voltage
V
bst is input to the positive power supply terminal of the operational amplifier OP1 and
is input to the voltage divider circuit Pb. The voltage divided by the voltage divider
circuit Pb is input to the terminal P18 of the MCU 1. The MCU 1 acquires a reference
voltage V
temp applied to a series circuit of the resistor Rs and the heater HTR during the temperature
detection control based on the voltage input to the terminal P18.
[0107] In addition, during the temperature detection control, the drive voltage V
bst (reference voltage V
temp) is supplied to the series circuit of the resistor Rs and the heater HTR. Further,
a voltage V
heat obtained by dividing the drive voltage V
bst (reference voltage V
temp) by the resistor Rs and the heater HTR is input to the non-inverting input terminal
of the operational amplifier OP1. Since the resistance value of the resistor Rs is
sufficiently larger than a resistance value of the heater HTR, the voltage V
heat is a value sufficiently lower than the drive voltage V
bst. During the temperature detection control, the low voltage V
heat is also supplied to the gate terminal of the switch S5, whereby the switch S5 is
turned off. The operational amplifier OP1 amplifies a difference between the voltage
input to the inverting input terminal and the voltage V
heat input to the non-inverting input terminal and outputs the amplified difference.
[0108] An output signal of the operational amplifier OP1 is input to the terminal P9 of
the MCU 1. The MCU 1 acquires the temperature of the heater HTR based on the signal
input to the terminal P9, the reference voltage V
temp acquired based on the input voltage of the terminal P18, and a known electric resistance
value of the resistor Rs. The MCU 1 performs the heating control of the heater HTR
based on the acquired temperature of the heater HTR. The heating control of the heater
HTR includes control of discharge from the power supply BAT to the heater HTR, control
such that the temperature of the heater HTR is a target temperature, and the like.
[0109] The MCU 1 can also acquire the temperature of the heater HTR even in a period in
which the switch S3 and the switch S4 are turned off (a period in which the heater
HTR is not energized). Specifically, the MCU 1 acquires the temperature of the heater
HTR based on the voltage input to the terminal P13 (output voltage of the voltage
divider circuit including the thermistor T3 and the resistor Rt3).
[0110] In addition, the MCU 1 may also acquire the temperature of the case 110 at any timing.
Specifically, the MCU 1 acquires the temperature of the case 110 based on the voltage
input to the terminal P12 (output voltage of the voltage divider circuit including
the thermistor T4 and the resistor Rt4).
<Charging Mode: Fig. 18>
[0111] Fig. 18 illustrates a case where the USB connection is established in the sleep mode.
In a case where the USB connection is established, the USB voltage V
USB is input to the input terminal VIN of the LSW 3 via the overvoltage protection IC
11. The USB voltage V
USB is also supplied to the voltage divider circuit Pf connected to the input terminal
VIN of the LSW 3. Since the bipolar transistor S2 is turned on immediately after the
USB connection is established, the signal input to the control terminal ON of the
LSW 3 remains at a low level. The USB voltage V
USB is also supplied to the voltage divider circuit Pc connected to the terminal P17
of the MCU 1, and a voltage divided by the voltage divider circuit Pc is input to
the terminal P17. The MCU 1 detects that the USB connection is established based on
the voltage input to the terminal P17.
[0112] When the MCU 1 detects that the USB connection is established, the MCU 1 turns off
the bipolar transistor S2 connected to the terminal P19. When a low-level signal is
input to a gate terminal of the bipolar transistor S2, the USB voltage V
USB divided by the voltage divider circuit Pf is input to the control terminal ON of
the LSW 3. Accordingly, a high-level signal is input to the control terminal ON of
the LSW 3, and the LSW 3 outputs the USB voltage V
USB from the output terminal VOUT. The USB voltage V
USB output from the LSW 3 is input to the input terminal VBUS of the charging IC 2. In
addition, the USB voltage V
USB output from the LSW 3 is supplied to the LEDs L1 to L8 as the system power supply
voltage Vcc4.
[0113] When the MCU 1 detects that the USB connection is established, the MCU 1 further
outputs a low-level enable signal from the terminal P22 to the charge enable terminal
CE( ) of the charging IC 2. Accordingly, the charging IC 2 enables the charging function
of the power supply BAT and starts charging the power supply BAT by the USB voltage
V
USB input to the input terminal VBUS. At this time, the MCU 1 does not perform the heating
of the heater HTR for aerosol generating while keeping the switches S3 and S4 off.
In other words, when the MCU 1 detects that the USB connection is established based
on the voltage input to the terminal P17, the MCU 1 prohibits a supply of a power
from the power supply BAT to the heater connector Cn. Therefore, the receptacle RCP
and the overvoltage protection IC 11, which are electronic components that function
only during the charging, are electronic components that function when the voltage
conversion control associated with the heating control is not performed.
[0114] In a case where the USB connection is established in the active mode, when the MCU
1 detects that the USB connection is established, the MCU 1 turns off the bipolar
transistor S2 connected to the terminal P19, outputs a low-level enable signal from
the terminal P22 to the charge enable terminal CE( ) of the charging IC 2, and turns
off the OTG function of the charging IC 2 by serial communication using the communication
line LN. Accordingly, the system power supply voltage Vcc4 supplied to the LEDs L1
to L8 is switched from the voltage generated by the OTG function of the charging IC
2 (voltage based on the power supply voltage V
BAT) to the USB voltage V
USB output from the LSW 3. The LEDs L1 to L8 is not operated unless ON control of the
built-in transistor is not performed by the MCU 1. Therefore, the unstable voltage
in a transition period from ON to OFF of the OTG function is prevented from being
supplied to the LEDs L1 to L8.
<Resetting of MCU: Fig. 19>
[0115] In a case where the outer panel 115 is detached, the output of the Hall IC 13 becomes
a low level, an ON operation of the operation switch OPS is performed, and the signal
input to the terminal P4 of the MCU 1 becomes a low level, the terminal SW1 and the
terminal SW2 of the switch driver 7 both become a low level. Accordingly, the switch
driver 7 outputs a low-level signal from the reset input terminal RSTB. The low-level
signal output from the reset input terminal RSTB is input to the control terminal
ON of the LSW 4. Accordingly, the LSW 4 stops the output of the system power supply
voltage Vcc2 from the output terminal VOUT. By stopping the output of the system power
supply voltage Vcc2, the system power supply voltage Vcc2 is not input to the power
supply terminal VDD of the MCU 1, and thus the MCU 1 is stopped.
[0116] The switch driver 7 returns the signal output from the reset input terminal RSTB
to a high level in a case where a time during which the low-level signal is output
from the reset input terminal RSTB reaches a predetermined time or in a case where
the signal input to either the terminal SW1 or the terminal SW2 becomes a high level.
Accordingly, the control terminal ON of the LSW 4 becomes a high level, and the system
power supply voltage Vcc2 returns to a state of being supplied to each unit.
<Peripheral Circuit of Step-up DC/DC Converter>
[0117] Fig. 20 is a circuit diagram of a main part more specifically illustrating a peripheral
circuit of the step-up DC/DC converter 9 in the electric circuit illustrated in Fig.
10.
[0118] Fig. 20 illustrates capacitors C1 to C12, resistors R11 to R14, and nodes N1 and
N2 as electronic components or nodes which are not illustrated or whose reference
numerals are omitted in Fig. 10.
[0119] In addition, Fig. 20 illustrates, as terminals of the step-up DC/DC converter 9,
a first control terminal P31, a second control terminal P32, a third control terminal
P33, and a feedback terminal FB, and illustrates a plurality of switching terminals
SW, to which one end of the reactor Lc is connected, and a plurality of output terminals
VOUT, which are connected to the heater connector Cn.
[0120] Further, Fig. 20 illustrates, as the ground terminal GND, a power ground terminal
PGP connected to a power ground PGND to be described later and a signal ground terminal
AGP connected to a signal ground AGND to be described later. The ground terminal GND
and the ground line illustrated in Fig. 10 are the power ground terminal PGP and the
power ground PGND, and the receptacle-mounted board 162 is provided with the signal
ground AGND in addition to the power ground PGND.
[0121] The node N1 connects the input terminal VIN and one end of the reactor Lc. The node
N1 is connected to the power supply connector electrically connected to the power
supply BAT (illustrated as the power supply BAT connected to this power supply connector
in the drawing). One ends of the capacitors C1 and C2 are connected in parallel between
the node N1 and the input terminal VIN, and the other ends of the capacitors C1 and
C2 are connected to the signal ground AGND. The capacitors C1 and C2 including one
ends of which are connected to the input terminal VIN, are bypass capacitors (so-called
pass capacitors) which prevent a ripple current, a ripple voltage, and the like from
being input to the input terminal VIN. Hereinafter, the capacitors C1 and C2 may be
referred to as bypass capacitors C1 and C2, the capacitor C1 may be referred to as
a first bypass capacitor C1, and the capacitor C2 may be referred to as a second bypass
capacitor C2.
[0122] One ends of the capacitors C3 to C5 are connected in parallel between the node N1
and one end of the reactor Lc, and the other ends of the capacitors C3 to C5 are connected
to the power ground PGND. The capacitors C3 to C5 including one ends of which are
connected to the reactor Lc are reactor capacitors which prevent a ripple current,
a ripple voltage, or the like from being input to the reactor Lc. Hereinafter, the
capacitors C3 to C5 may be referred to as reactor capacitors.
[0123] The node N2 connects the source terminal of the switch S3 and the source terminal
of the switch S4. The node N2 is connected to the output terminal VOUT of the step-up
DC/DC converter 9. One ends of the capacitors C8 to C12 are connected in parallel
between the output terminal VOUT and the node N2, and the other ends of the capacitors
C8 to C12 are connected to the power ground PGND. The capacitors C8 to C12 including
one ends of which are connected to the output terminal VOUT are output capacitors
which remove a ripple of a current or a voltage output from the output terminal VOUT.
Hereinafter, the capacitors C8 to C12 may be referred to as output capacitors.
[0124] One end of a voltage divider circuit Pg including a series circuit of two resistors
R12 and R13 is connected between the output terminal VOUT and the output capacitors
C8 to C12. The other end of the voltage divider circuit Pg is connected to the signal
ground AGND. A connection point of the two resistors R12 and R13 constituting the
voltage divider circuit Pg is connected to the feedback terminal FB. The step-up DC/DC
converter 9 executes voltage conversion control of converting a voltage input to the
input terminal VIN and outputting the converted voltage from the output terminal VOUT
based on a voltage input to the feedback terminal FB. That is, the step-up DC/DC converter
9 performs control to step up the power supply voltage V
BAT based on the voltage input to the feedback terminal FB so that the drive voltage
V
bst becomes a target voltage.
[0125] One end of the capacitor C6 is connected to the first control terminal P31, and the
other end of the capacitor C6 is connected to the signal ground AGND. The first control
terminal P31 is, for example, a soft start control terminal, and performs soft start
of the step-up DC/DC converter 9 according to a capacitance of the capacitor C6.
[0126] One end of the resistor R11 is connected to the second control terminal P32, and
the other end of the resistor R11 is connected to the signal ground AGND. The second
control terminal P32 is, for example, an output current limiting programming terminal,
and programs a limiting value of an output current according to a resistance value
of the resistor R11.
[0127] One end of a series circuit of the resistor R14 and the capacitor C7 is connected
to the third control terminal P33, and the other end of the series circuit of the
resistor R14 and the capacitor C7 is connected to the signal ground AGND. The third
control terminal P33 is, for example, a phase compensation connection terminal, and
the series circuit of the resistor R14 and the capacitor C7 is a component for phase
compensation.
<Thermal Diffusion Member>
[0128] As illustrated in Fig. 21, the thermal diffusion member 300 is provided on the secondary
surface 162b of the receptacle-mounted board 162 between the secondary surface 162b
and the chassis 150. Since the secondary surface 162b of the receptacle-mounted board
162 on which the thermal diffusion member 300 is disposed faces the front-rear dividing
wall 152 of the chassis 150, the thermal diffusion member 300 is located between the
step-up DC/DC converter 9 and the chassis 150.
[0129] The thermal diffusion member 300 is made of a material having a thermal diffusivity
higher than that of air, for example, a thermal diffusion material such as metal,
ceramic, graphite, or clay. A heat dissipation sheet may be used for the thermal diffusion
member 300. At least a part of the heat dissipation sheet used for the thermal diffusion
member 300 may be in a gel form. The thermal diffusion member 300 entirely or partially
covers the plurality of electronic components disposed on the secondary surface 162b
of the receptacle-mounted board 162, and diffuses heat into the air. Therefore, the
temperature of the electronic component covered with the thermal diffusion member
300 is less likely to increase. In addition, the electronic component covered with
the thermal diffusion member 300 is less likely to be affected by heat from the power
supply BAT by the chassis 150, and thus the operation is stabilized. On the other
hand, the heat diffused by the thermal diffusion member 300 is prevented from being
transferred to other components by the chassis 150, and thus the durability of the
inhaler 100 is improved.
[0130] A shape of the thermal diffusion member 300 is not particularly limited, but is preferably
a simple shape such as a square shape, a rectangular shape, a circular shape, or an
elliptical shape in a plan view from the viewpoint of cost. Two or more thermal diffusion
members 300 may be provided. In the present embodiment, one thermal diffusion member
300 having a substantially rectangular shape is provided. The electronic components
covered with the thermal diffusion member 300 will be described later together with
elements and ICs mounted on the MCU-mounted board 161 and the receptacle-mounted board
162.
[0131] As illustrated in Fig. 21, by providing the thermal diffusion member 300 on the secondary
surface 162b of the receptacle-mounted board 162, the MCU-mounted board 161, the receptacle-mounted
board 162, the thermal diffusion member 300, the chassis 150, and the power supply
BAT are disposed in this order from the front in the front-rear direction in the internal
space of the case 110. Therefore, local heat in the receptacle-mounted board 162 is
dissipated by the thermal diffusion member 300, and the dissipated heat is prevented
from being transferred to the power supply BAT by the insulating chassis 150. In addition,
since the heat generated in the power supply BAT is not transmitted to the receptacle-mounted
board 162 by the insulating chassis 150, the temperatures of the power supply BAT
and the receptacle-mounted board 162 are less likely to increase, and the operation
of the inhaler 100 is stabilized.
[0132] The thermal diffusion member 300 is disposed on the secondary surface 162b of the
receptacle-mounted board 162 by sticking, adhesion, welding, or the like. A predetermined
gap is preferably formed between the thermal diffusion member 300 and the chassis
150.
<Detailed Description of Board>
[0133] Next, disposition of the ICs and the elements disposed on the MCU-mounted board 161
and the receptacle-mounted board 162 will be described.
[Receptacle-mounted Board]
[0134] Fig. 22 is a diagram illustrating the main surface 162a of the receptacle-mounted
board 162. On the main surface 162a of the receptacle-mounted board 162 extending
in the up-down direction, the heater connector Cn is disposed in the vicinity of an
upper end portion thereof, the receptacle RCP is disposed at a lower end portion thereof,
and the reactor Lc and the reactor capacitors C3 to C5 of the step-up DC/DC converter
9 is disposed between the heater connector Cn and the receptacle RCP.
[0135] In the vicinity of the receptacle RCP, a battery connector 222 on the positive electrode
side (hereinafter, referred to as positive-electrode-side battery connector 222) is
disposed on the right side, and the opening portion 176 for fixing the spacer 173
is disposed on the left side. Further, a battery connector 224 on the negative electrode
side (hereinafter, referred to as a negative-electrode-side battery connector 224)
and a power supply temperature detecting connector Cn (t1) connected to the thermistor
T1 constituting a power supply temperature sensor are disposed on a left side of the
reactor Lc. A positive-electrode-side power supply bus bar 236 (see Figs. 7 and 8)
extending from the positive electrode terminal of the power supply BAT is connected
to the positive-electrode-side battery connector 222, and a negative-electrode-side
power supply bus bar 238 (see Figs. 7 and 8) extending from the negative electrode
terminal of the power supply BAT is connected to the negative-electrode-side battery
connector 224.
[0136] Fig. 23 is a view illustrating the secondary surface 162b of the receptacle-mounted
board 162. The secondary surface 162b of the receptacle-mounted board 162 is provided
with a substantially rectangular IC-mounted region 191 in which a main IC or the like
is mounted at a substantially central portion in the up-down direction, and the step-up
DC/DC converter 9, the remaining amount meter IC 12, the operational amplifier OP1,
and the protection IC 10 are disposed in the IC-mounted region 191. In addition, the
resistors R11, R12, and R13 and the capacitors C1, C2, and C6, which are control elements,
are disposed in the IC-mounted region 191. Since these control elements are disposed
on the same surface as the step-up DC/DC converter 9, a wiring pattern can be simplified.
In the secondary surface 162b, a region other than the IC-mounted region 191 is referred
to as a residual region 192.
[0137] As described above, at least a part of the IC-mounted region 191 is covered with
the thermal diffusion member 300 having a thermal diffusivity higher than that of
air. In Fig. 23, a region covered with the thermal diffusion member 300 is indicated
by a thick dotted line.
[0138] The thermal diffusion member 300 covers only the IC-mounted region 191 of the IC-mounted
region 191 and the residual region 192 of the secondary surface 162b, and further
covers only a part of the IC-mounted region 191. Accordingly, even when the size and
the weight of the thermal diffusion member 300 are not excessively increased, concentration
of heat can be effectively eliminated, and thus the operation of the inhaler 100 can
be stabilized while preventing an increase in cost and weight of the inhaler 100.
[0139] More specifically, the thermal diffusion member 300 covers at least a part of the
step-up DC/DC converter 9, the remaining amount meter IC 12, the protection IC 10,
the resistor R11, the capacitors C2 and C6, and the operational amplifier OP1. In
Fig. 20, the electronic components covered with the thermal diffusion member 300 are
illustrated inside the thick dotted line. The electronic component is a concept including
an integrated circuit (IC), an element (active element, passive element), and a receptacle.
[0140] The thermal diffusion member 300 partially covers at least the operational amplifier
OP1, the remaining amount meter IC 12, and the protection IC 10, whereby the electronic
components are less likely to be affected by heat, and thus the operation of the inhaler
100 is stabilized.
[0141] The thermal diffusion member 300 covers at least a part of the step-up DC/DC converter
9, whereby the temperature of the step-up DC/DC converter 9 is less likely to increase
due to the thermal diffusion member 300, and the operation of the step-up DC/DC converter
9 is stabilized. Accordingly, the amount and the fragrance of the generated aerosol
can be stabilized. The thermal diffusion member 300 preferably covers the entire step-up
DC/DC converter 9. The thermal diffusion member 300 having a large area can effectively
dissipate the heat generated by the step-up DC/DC converter 9 and the like, and can
prevent local heating of the chassis 150, and thus the durability of the inhaler 100
can be improved.
[0142] On the other hand, the thermal diffusion member 300 does not cover the resistors
R12 and R13 connected to detection terminals. The resistors R12 and R13 are used for
the feedback terminal FB to detect a voltage as described above, and the step-up DC/DC
converter 9 executes voltage conversion control of outputting from the output terminal
VOUT based on the voltage input to the feedback terminal FB. Although the resistors
R12 and R13 are fixed resistors whose electric resistance values hardly change depending
on the temperature, the electric resistance values may slightly change when the temperature
becomes high. Since the thermal diffusion member 300 does not cover the resistors
R12 and R13, the resistors R12 and R13 are less likely to be affected by heat, and
the output voltages detected by the resistors R12 and R13 are stabilized.
[0143] The thermal diffusion member 300 partially covers at least half of the plurality
of control elements connected to the plurality of control terminals different from
the feedback terminal FB of the step-up DC/DC converter 9. In the present embodiment,
as illustrated in Fig. 20, the step-up DC/DC converter 9 includes the first to third
control terminals P31, P32, and P33 as main control terminals, and the capacitor C6,
the resistor R11, the resistor R14, and the capacitor C7 are provided as control elements
connected to the control terminals. The thermal diffusion member 300 partially covers
at least the resistor R11 and the capacitor C6 among the four control elements. By
covering half of the control elements in this way, the area of the thermal diffusion
member 300 can be increased, and the effect of thermal diffusion can be enhanced.
The thermal diffusion member 300 may partially cover at least a part of the resistor
R14 and the capacitor C7. In this way, since over half of the control elements are
covered, the area of the thermal diffusion member 300 can be further increased, and
the effect of thermal diffusion can be further enhanced.
[0144] The thermal diffusion member 300 does not cover the reactor Lc of the step-up DC/DC
converter 9. As described above, the reactor Lc of the step-up DC/DC converter 9 is
disposed on the main surface 162a of the receptacle-mounted board 162. The size of
the reactor Lc connected to the step-up DC/DC converter 9 increases according to the
current output by the step-up DC/DC converter 9. Since the heater HTR in the inhaler
100 is a component having the largest current consumption and the largest power consumption,
the reactor Lc is likely to be larger than the step-up DC/DC converter 9. In addition,
the reactor Lc generates less heat than the step-up DC/DC converter 9 built with a
switch which is switched at the time of stepping up. Therefore, since the thermal
diffusion member 300 does not cover the reactor Lc, it is possible to prevent the
size of the thermal diffusion member 300 from becoming extremely large or the shape
thereof from becoming complicated. By protecting an appropriate electronic component
using the thermal diffusion member 300 having a simple shape in this way, the operation
of the inhaler 100 can be stabilized. As compared with a case where the step-up DC/DC
converter 9 and the reactor Lc occupying a large area on the board are disposed on
the same surface of the circuit board, the size of the board can be reduced, and thus
the cost and the size of the inhaler 100 can be reduced.
[0145] The thermal diffusion member 300 does not cover the reactor capacitors C3 to C5,
and similarly to the reactor Lc, the reactor capacitors C3 to C5 are also disposed
on the main surface 162a of the receptacle-mounted board 162. The thermal diffusion
member 300 does not cover the reactor capacitors C3 to C5 which generate a relatively
small amount of heat, whereby it is possible to prevent the size of the thermal diffusion
member 300 from becoming extremely large or the shape thereof from becoming complicated.
By protecting an appropriate electronic component using the thermal diffusion member
300 having a simple shape, the operation of the inhaler 100 can be stabilized. As
compared with a case where the step-up DC/DC converter 9 and the reactor capacitors
C3 to C5 occupying a large area on the board are disposed on the same surface, the
size of the board can be reduced, and thus the cost and the size of the inhaler 100
can be reduced.
[0146] In addition, the thermal diffusion member 300 does not cover the output capacitors
C8 to C12. The output capacitors C8 to C12 generally have large capacitances to be
able to sufficiently remove a ripple current and a ripple voltage. The size of the
capacitor roughly depends on its capacitance. When the output capacitors C8 to C12
are covered, the size of the thermal diffusion member 300 is increased. In addition,
the output capacitors C8 to C12 generate heat when a ripple of a current or a voltage
is removed. Such output capacitors C8 to C12 are not covered with the thermal diffusion
member 300, whereby the heat generated by the step-up DC/DC converter 9 can be effectively
diffused, and the cost of the inhaler 100 can be reduced.
[0147] The output capacitors C9 to C12 are electronic components having the highest height
among the electronic components disposed on the secondary surface 162b. The output
capacitors C9 to C12 are disposed in the residual region 192 where the thermal diffusion
member 300 is not disposed, and are not covered with the thermal diffusion member
300. The thermal diffusion member 300 does not cover the electronic component having
the largest height, whereby it is possible to prevent the size of the thermal diffusion
member 300 from becoming extremely large or the shape thereof from becoming complicated.
As illustrated in Fig. 23, in addition to the output capacitors C9 to C12, the capacitor
C7, the output capacitor C8, the resistor R14, the overvoltage protection IC 11, and
the like are disposed in the residual region 192.
[0148] The thermal diffusion member 300 partially covers the bypass capacitors C1 and C2.
More specifically, of the plurality of bypass capacitors C1 and C2, the thermal diffusion
member 300 covers the second bypass capacitor C2 without covering the first bypass
capacitor C1. The bypass capacitors C1 and C2 prevent a ripple current or a ripple
voltage from being input to the input terminal VIN of the step-up DC/DC converter
9. It is preferable to provide a plurality of smoothing capacitors as bypass capacitors
for sufficient smoothing. However, when temperatures of the bypass capacitors C1 and
C2 become high, a ripple current or a ripple voltage may not be sufficiently removed.
On the other hand, when the thermal diffusion member 300 covers both the bypass capacitors
C1 and C2, the size of the thermal diffusion member 300 becomes extremely large or
the shape thereof becomes complicated. Therefore, the thermal diffusion member 300
partially covers at least a part of the plurality of bypass capacitors C1 and C2 (in
the present embodiment, the second bypass capacitor C2), whereby the thermal diffusion
member 300 prevents the temperature of the second bypass capacitor C2 from becoming
high, and the step-up DC/DC converter 9 is less likely to fail or malfunction. Further,
by covering only the second bypass capacitor C2, it is possible to prevent the size
of the thermal diffusion member 300 from becoming extremely large or the shape thereof
from becoming complicated.
[0149] Here, the second bypass capacitor C2 is a capacitor having a smaller capacitance
than the first bypass capacitor C1. As described above, the size of the capacitor
roughly depends on its capacitance. That is, it can be said that a capacitor having
a smaller capacitance is more likely to generate heat locally. Therefore, it is preferable
to protect the second bypass capacitor C2 having a small capacitance in preference
to the thermal diffusion member 300. By protecting an appropriate electronic component
using the thermal diffusion member 300 having a simple shape in this way, the operation
of the inhaler 100 can be stabilized. Instead of the present embodiment, of the plurality
of bypass capacitors C1 and C2, the thermal diffusion member 300 may cover the first
bypass capacitor C1 without covering the second bypass capacitor C2. The thermal diffusion
member 300 may cover only a part of the first bypass capacitor C1 and/or a part of
the second bypass capacitor C2.
[Ground]
[0150] Next, the ground of the receptacle-mounted board 162 will be described with reference
to Fig. 24. Fig. 24 is a view illustrating an internal structure of the receptacle-mounted
board 162, and (A) is a cross-sectional view taken along a line A-A of (B). In addition,
(B) is a cross-sectional view of the receptacle-mounted board 162 taken along the
front-rear direction.
[0151] As illustrated in Fig. 24, the receptacle-mounted board 162 is a multilayer board
formed by laminating a plurality of layers. The receptacle-mounted board 162 includes
a main-surface-side surface layer 402 constituting the main surface 162a, a ground
layer 404 provided with two grounds PGND and AGND insulated from each other, a secondary-surface-side
surface layer 406 constituting the secondary surface 162b, a main-surface-side power
supply layer 403 provided between the main-surface-side surface layer 402 and the
ground layer 404, and a secondary-surface-side power supply layer 405 provided between
the secondary-surface-side surface layer 406 and the ground layer 404. A prepreg (not
illustrated) is provided between the layers, and the adjacent layers are maintained
in an insulated state.
[0152] The main-surface-side power supply layer 403 and the secondary-surface-side power
supply layer 405 are appropriately electrically connected to each other through a
via (through hole) (not illustrated), and constitute a circuit indicated by a thin
solid line indicated by the range 162A mounted on the receptacle-mounted board 162
in Fig. 12. In the periphery of the step-up DC/DC converter 9, the input terminal
VIN of the step-up DC/DC converter 9, the switching terminal SW, one ends of the bypass
capacitors C1 and C2, both ends of the reactor Lc, one ends of the reactor capacitors
C3 to C5, one ends of the output capacitors C8 to C12, and the output terminal VOUT
are connected to the main-surface-side power supply layer 403 and the secondary-surface-side
power supply layer 405.
[0153] The ground layer 404 is provided with two grounds of the power ground PGND connected
to a circuit through which a relatively large current flows and the signal ground
AGND connected to a circuit through which a relatively small current flows. A region
between the power ground PGND and the signal ground AGND in the ground layer 404 is
an insulating portion 194 made of an insulating material.
[0154] As illustrated in Fig. 20, the power ground PGND is connected to the power ground
terminal PGP of the step-up DC/DC converter 9 (ground terminal GND of the step-up
DC/DC converter 9 in Fig. 10), the other ends of the reactor capacitors C3 to C5,
one ends of which are connected to a wiring connecting the node N1 and the reactor
Lc, and the other ends of the output capacitors C8 to C12, one ends of which are connected
to a wiring connecting the output terminal VOUT and the node N2.
[0155] In addition, the power ground PGND is the ground line illustrated in Fig. 10 as described
above, and the power ground PGND is connected to the power supply terminal VSS and
the ground terminal GND of the protection IC 10, the overvoltage protection IC 11,
the remaining amount meter IC 12, and the receptacle RCP, which are included in the
range 162A mounted on the receptacle-mounted board 162 of Fig. 12.
[0156] Further, as illustrated in Fig. 10, the power ground PGND is connected to the switch
S6 which is a transistor connected to a negative electrode of the heater connector
Cn, and is further connected to the ground terminal GND of the receptacle RCP. The
output terminal VOUT of the step-up DC/DC converter 9, the other IC, the switch S6,
and the receptacle RCP are connected to the same ground, whereby these elements have
a common reference potential (= potential of power ground PGND). Therefore, the operation
of the inhaler 100 is stabilized, and a short circuit is less likely to occur therebetween,
thereby improving the safety of the inhaler 100.
[0157] In addition, the power ground PGND of the receptacle-mounted board 162 is connected
to the ground of the MCU-mounted board 161 via the spacer 173 as described above.
As a result, ground potentials of the MCU-mounted board 161 and the receptacle-mounted
board 162 can be equalized, and supply of charging power and operating power between
the MCU-mounted board 161 and the receptacle-mounted board 162 and communication therebetween
can be stabilized. On the other hand, the ground of the MCU-mounted board 161 is not
directly connected to the signal ground AGND. Therefore, the signal ground AGND is
less likely to be affected by heat or noise generated when potentials of the power
ground PGND and the ground of the MCU-mounted board 161 are combined.
[0158] The signal ground AGND is connected to the signal ground terminal AGP of the step-up
DC/DC converter 9, the other end of the resistor R11 of which one end is connected
to the second control terminal P32, the other ends of the bypass capacitors C1 and
C2 of which one ends are connected to a connection line between the node N1 and the
input terminal VIN, the other end of the series circuit of the resistor R14 and the
capacitor C7 of which one end is connected to the third control terminal P33, the
other end of the voltage divider circuit Pg of which one end is connected to a connection
line between the output terminal VOUT and the output capacitors C8 to C12 and having
a connection point connected to the feedback terminal FB, and the other end of the
capacitor C6 of which one end is connected to the first control terminal P31. That
is, the resistors R11 to R14, the capacitors C6 and C7, and the bypass capacitors
C1 and C2 are disposed on a power path between the step-up DC/DC converter 9 and the
signal ground AGND. These electronic components are electronic components that function
when the voltage conversion control is executed by the step-up DC/DC converter 9.
[0159] In this way, the signal ground AGND is connected to the electronic components that
function when the voltage conversion control is executed, and is more preferably connected
to only the electronic components that function when the voltage conversion control
is executed. The signal ground AGND is not connected to an electronic component having
low relevance to the step-up DC/DC converter 9, whereby the potential of the signal
ground AGND is stabilized, and a voltage value detected by the feedback terminal FB
is also stabilized. Therefore, the voltage applied to the heater HTR by the step-up
DC/DC converter 9 can be stabilized, and the amount and the fragrance of the generated
aerosol can be stabilized. On the other hand, among the electronic components disposed
on the receptacle-mounted board 162, the receptacle RCP and the overvoltage protection
IC 11, which are electronic components that function when the voltage conversion control
is not executed, are connected to the power ground PGND (see Fig. 10).
[0160] An electronic component having low relevance to the step-up DC/DC converter 9 may
be connected to the signal ground AGND. However, the number of the electronic components
that function when the voltage conversion control is executed by the step-up DC/DC
converter 9 and that are connected to the signal ground AGND is preferably larger
than the number of the electronic components that function when the voltage conversion
control is not executed and that are connected to the signal ground AGND. Accordingly,
the potential of the signal ground AGND is stabilized, the voltage value detected
by the feedback terminal FB is also stabilized, and thus the voltage applied to the
heater HTR by the step-up DC/DC converter 9 can be stabilized, and the amount and
the fragrance of the generated aerosol can be stabilized.
[0161] Among the resistors R11 to R14, the capacitors C6 and C7, and the bypass capacitors
C1 and C2, which are elements disposed on the power path between the step-up DC/DC
converter 9 and the signal ground AGND, it is preferable that the number of elements
disposed on the secondary surface 162b is larger than the number of elements disposed
on the main surface 162a, and it is more preferable that all the elements are disposed
on the secondary surface 162b. In the present embodiment, all of the resistors R11
to R14, the capacitors C6 and C7, and the bypass capacitors C1 and C2 are disposed
on the secondary surface 162b. Accordingly, it is possible to reduce a situation in
which the signal ground AGND is formed into a shape that connects the elements disposed
on the respective surfaces, and thus it is possible to reduce the size of the signal
ground AGND and to reduce the possibility that noise enters from other positions of
the board. In addition, it is possible to increase the area of the power ground PGND
and to stabilize the potential of the power ground PGND.
[0162] In addition, it is preferable that the resistors R11 to R14, the capacitors C6 and
C7, and the bypass capacitors C1 and C2 are collectively disposed. In the present
embodiment, as illustrated in Fig. 23, in a case where four regions on the circuit
board partitioned and formed by four diagonal lines starting from a center of the
step-up DC/DC converter 9 and extending so as to include the vertex of the step-up
DC/DC converter 9 when viewed from the direction orthogonal to the secondary surface
162b (front-rear direction in the present embodiment) are denoted by a first region
AR1 to a fourth region AR4, the bypass capacitors C1, C2 and the capacitor C6 are
disposed in the first region AR1, and the resistors R11, R12, R14 and the capacitor
C7 are disposed in the third region AR3. In addition, the resistor R13 is disposed
in the second region AR2, and none of the elements is disposed in the fourth region
AR4. By providing a region in which a plurality of elements are disposed on the power
path between the step-up DC/DC converter 9 and the signal ground AGND and a region
in which no element is disposed in this way and disposing elements connected to the
signal ground AGND in a concentrated manner on the board, it is possible to reduce
the area of the signal ground AGND and to reduce the possibility of noise entering
from other positions on the board. In addition, it is possible to increase the area
of the power ground PGND and to stabilize the potential of the power ground PGND.
[0163] As illustrated in Fig. 24, the area of the power ground PGND (region hatched with
dots in (A)) is larger than the area of the signal ground AGND (region hatched with
oblique lines in (A)). The power ground PGND has a large area, whereby the potential
of the power ground PGND is stabilized. Accordingly, a ripple of a current and a voltage
can be more effectively removed from a waveform output by the step-up DC/DC converter
9, and thus the waveform of the voltage output by the step-up DC/DC converter 9 becomes
close to an ideal stationary wave, and the amount and the fragrance of the generated
aerosol can be stabilized.
[0164] In addition, the signal ground AGND is partially surrounded by at least the power
ground PGND. In the present embodiment, the power ground PGND is disposed so as to
surround the entire circumference of the signal ground AGND. Accordingly, the signal
ground AGND is protected from external noise or the like by the power ground PGND.
[0165] In addition, in the present embodiment, the power ground PGND and the signal ground
AGND are provided in the same layer in the receptacle-mounted board 162, which is
a multilayer board, but without being limited thereto, may be provided in different
layers. By provision in the same layer, the number of layers of the multilayer board
can be reduced.
[0166] In addition, the power ground PGND and the signal ground AGND are electrically connected
to each other by a common ground CGND. Two grounds have a common potential by the
common ground CGND. The common ground CGND may be provided on the receptacle-mounted
board 162 or may be provided outside the receptacle-mounted board 162. By provision
outside the receptacle-mounted board 162, the power ground PGND and the signal ground
AGND are separated from the common ground CGND, and the power ground PGND and the
signal ground AGND are less likely to be affected by heat and noise derived from the
common ground. Accordingly, the electronic components connected to the power ground
PGND and the signal ground AGND are less likely to be affected by heat and noise generated
along with elimination of a potential deviation, and the operation of the inhaler
100 is likely to be stabilized. The common ground CGND according to the present embodiment
is provided on the bottom surface of the step-up DC/DC converter 9 as an example of
the outside of the receptacle-mounted board 162.
[0167] Here, on the main surface 162a of the receptacle-mounted board 162, no electronic
component is provided in a common ground projection region 167 overlapping with the
common ground CGND when viewed from the direction orthogonal to the main surface 162a
(front-rear direction in the present embodiment). Fig. 22 illustrates the common ground
projection region 167. Since the two grounds PGND and AGND are insulated in the circuit
board, the potentials are likely to be different. In the common ground CGND for eliminating
the potential deviation, heat and noise are generated along with the elimination of
the potential deviation. The heat and the noise may be transmitted to the vicinity
of the common ground CGND, for example, to the right back of the common ground CGND.
An electronic component is not disposed at such a position, whereby the electronic
component is less likely to be affected by the heat or the noise generated along with
the elimination of the potential deviation, and the operation of the inhaler 100 is
likely to be stabilized.
[0168] On the other hand, on the main surface 162a of the step-up DC/DC converter 9, electronic
components may be disposed in a residual portion projection region 168 overlapping
with a residual portion 90 (see Fig. 20) of the bottom surface of the step-up DC/DC
converter 9, which is not included in the common ground CGND, when viewed from the
direction orthogonal to the main surface 162a (front-rear direction in the present
embodiment). Fig. 22 illustrates the residual portion projection region 168 together
with the common ground projection region 167. In a case where electronic components
are disposed in the residual portion projection region 168, the degree of freedom
of disposition of the electronic components on the circuit board is improved as compared
with a case where the electronic components are not disposed in the entire region
overlapping with the bottom surface of the step-up DC/DC converter 9, and thus the
utilization efficiency of the circuit board is improved, and an increase in size of
the circuit board can be avoided. The electronic components may include an active
element such as an IC or a switch, and may include a passive element such as a resistor
or a capacitor, but among the electronic components, it is preferable that at least
one of a precise IC and a switch is not included, it is more preferable that neither
the IC nor the switch are included, and among the electronic components, a passive
element that is hardly affected by the noise or the heat is still more preferable.
Accordingly, the operation of the inhaler 100 is likely to be stabilized while improving
the utilization efficiency of the circuit board.
[0169] Further, the reactor Lc of the step-up DC/DC converter 9 disposed on the main surface
162a is preferably not disposed in the common ground projection region 167, and more
preferably not disposed in the common ground projection region 167 and the residual
portion projection region 168. The reactor Lc is not disposed in the common ground
projection region 167, whereby the reactor Lc is less likely to be affected by the
heat and the noise derived from the common ground CGND, and thus the voltage conversion
in the step-up DC/DC converter 9 is more likely to be stabilized, and as a result,
the amount and the fragrance of the generated aerosol are also stabilized.
[MCU-mounted Board]
[0170] Fig. 25 is a diagram illustrating the main surface 161a of the MCU-mounted board
161. On the main surface 161a of the MCU-mounted board 161 extending in the up-down
direction, the heater temperature detecting connector Cn (t3) to which the thermistor
T3 constituting a heater temperature sensor is connected via a conductive wire is
disposed at an upper end portion thereof, and the charging IC 2 is disposed at a lower
side thereof. In addition, an opening portion 175 for fixing the spacer 173 is disposed
at a position corresponding to the opening portion 176 of the receptacle-mounted board
162, and the MCU 1 is disposed in the vicinity of the opening portion 175.
[0171] By disposing the MCU 1 on the MCU-mounted board 161 with respect to the receptacle-mounted
board 162 on which the receptacle RCP is disposed, the MCU 1 is separated from the
receptacle RCP, and thus the MCU 1 is less likely to be affected by static electricity
or the like that may enter from the receptacle RCP. Accordingly, the operation of
the inhaler 100 can be further stabilized.
[0172] In addition, since the MCU 1 is disposed on the secondary surface 161b farther from
the secondary surface 162b of the receptacle-mounted board 162 than the main surface
161a, the MCU 1 can be separated as far as possible from the receptacle-mounted board
162 and the power supply BAT which may be a heat source, and the operation of the
inhaler 100 is stabilized.
[0173] Fig. 26 is a diagram illustrating the secondary surface 161b of the MCU-mounted board
161. On the secondary surface 161b of the MCU-mounted board 161, a motor connector
226 to which the vibration motor M is connected via a conductive wire is disposed
at an upper side of the opening portion 175, and a case temperature detecting connector
Cn (t4) to which the thermistor T4 constituting a case temperature sensor is connected
via a conductive wire and an intake detecting connector Cn (t2) to which the thermistor
T2 constituting an intake sensor is connected via a conductive wire are disposed at
an upper end portion thereof.
[0174] The flexible wiring board 165 electrically connecting the MCU-mounted board 161 and
the receptacle-mounted board 162 connects FPC connection portions 231 and 232 of the
MCU-mounted board 161 and the receptacle-mounted board 162. The FPC connection portions
231 and 232 are located at right end portions of the MCU-mounted board 161 and the
receptacle-mounted board 162, respectively, and at positions reaching the vicinity
of the opening portions 175 and 176 downward from a substantially central portion
in the up-down direction.
[0175] Although various embodiments have been described above with reference to the drawings,
it is needless to say that the present invention is not limited to these examples.
It is apparent to those skilled in the art that various changes and modifications
may be conceived within the scope described in the claims, and it is understood that
the changes and the modifications naturally fall within the technical scope of the
present invention. In addition, the components described in the above embodiments
may be optionally combined without departing from the spirit of the invention.
[0176] For example, in the above-described embodiment, the reactor capacitors C3 to C5 are
connected in parallel between the node N1 and one end of the reactor Lc, but may be
connected in parallel between the other end of the reactor Lc and the switching terminal
SW.
[0177] In the present description, at least the following matters are described. Corresponding
constituent components and the like in the above-mentioned embodiment are shown in
parentheses, but the present invention is not limited thereto.
- (1) A power supply unit (non-combustion inhaler 100) for an aerosol generating device,
including:
a power supply (power supply BAT);
a heater connector (heater connector Cn) connected to a heater (heater HTR) configured
to heat an aerosol source by consuming power supplied from the power supply;
a voltage conversion IC (step-up DC/DC converter 9) connected to the heater connector
and including an output terminal (output terminal VOUT) configured to convert and
output an input voltage and a detection terminal (feedback terminal FB) configured
to detect a voltage output from the output terminal;
a circuit board (receptacle-mounted board 162) including a first surface (secondary
surface 162b) on which the voltage conversion IC is disposed and a second surface
(main surface 162a) which is a back surface of the first surface;
a capacitor (output capacitors C8 to C12) having one end connected to the output terminal;
a first ground (power ground PGND) provided inside the circuit board and connected
to an other end of the capacitor;
a second ground (signal ground AGND) provided inside the circuit board, insulated
from the first ground inside the circuit board, and connected to the detection terminal;
and
a common ground (common ground CGND) configured to electrically connect the first
ground and the second ground, in which
on the second surface, no electronic component is provided in a common ground projection
region (common ground projection region 167) overlapping with the common ground when
viewed from a direction orthogonal to the circuit board.
[0178] Since the two grounds are insulated in the circuit board, the potentials may be different.
In the common ground for eliminating the potential deviation, heat and noise are generated
along with the elimination of the potential deviation. The heat and the noise may
be transmitted to the vicinity of the common ground, for example, to the right back
of the common ground. According to (1), an electronic component is not disposed at
such a position, whereby the electronic component is less likely to be affected by
the heat or the noise generated along with the elimination of the potential deviation,
and the operation of the power supply unit for an aerosol generating device is stabilized.
[0179] (2) The power supply unit for an aerosol generating device according to (1), in which
the common ground is provided on a bottom surface of the voltage conversion IC.
[0180] According to (2), by providing the common ground at a location separated from the
other electronic components, the other electronic components are less likely to be
affected by heat or noise derived from the common ground, and the operation of the
power supply unit for an aerosol generating device is more likely to be stabilized.
[0181] (3) The power supply unit for an aerosol generating device according to (2), in which
the common ground is provided on a part of a bottom surface of the voltage conversion
IC, and
on the second surface, a first electronic component is disposed in a residual portion
projection region (residual portion projection region 168) overlapping with a residual
portion (residual portion 90) not included in the part of the bottom surface of the
voltage conversion IC when viewed from the direction orthogonal to the circuit board.
[0182] According to (3), the degree of freedom of disposition of the electronic components
on the circuit board is improved as compared with a case where the electronic components
are not disposed in the entire region overlapping with the bottom surface of the voltage
conversion IC, and thus the utilization efficiency of the circuit board can be improved,
and an increase in size of the circuit board can be avoided.
[0183] (4) The power supply unit for an aerosol generating device according to (3), in which
the first electronic component does not include at least one of an IC and a switch.
[0184] According to (4), a precise IC or switch among the electronic components is not disposed
in the residual portion projection region that is not as large as the common ground
projection region but may be affected by noise or heat to some extent, whereby the
operation of the aerosol generating device is likely to be stabilized while avoiding
an increase in the size of the board.
[0185] (5) The power supply unit for an aerosol generating device according to (3), in which
the first electronic component is a passive element.
[0186] According to (5), the passive element that is less likely to be affected by noise
or heat among the electronic components is disposed in the residual portion projection
region that is not as large as the common ground projection region but may be affected
by noise or heat to some extent, whereby the operation of the aerosol generating device
is likely to be stabilized.
[0187] (6) The power supply unit for an aerosol generating device according to any one of
(1) to (5), further including:
a plurality of first elements (resistors R11 to R14 and capacitors C1, C2, C6, and
C7) disposed on a power path between the voltage conversion IC and the second ground,
in which
the number of elements disposed on the first surface among the plurality of first
elements is larger than the number of elements disposed on the second surface among
the first elements.
[0188] According to (6), it is possible to reduce a situation in which the second ground
is formed into a shape that connects the elements disposed on the respective surfaces,
and thus it is possible to reduce the size of the second ground, to reduce the possibility
of noise entering from other positions of the board, to increase the area of the first
ground, and to stabilize the potential of the first ground.
[0189] (7) The power supply unit for an aerosol generating device according to (6), in which
all of the first elements are disposed on the first surface.
[0190] According to (7), the second ground may not have a shape that connects the elements
disposed on the respective surfaces, and thus it is possible to reduce the size of
the second ground, to reduce the possibility of noise entering from other positions
of the board, to increase the area of the first ground, and to stabilize the potential
of the first ground.
[0191] (8) The power supply unit for an aerosol generating device according to (6), further
including:
a plurality of first elements (resistors R11 to R14 and capacitors C1, C2, C6, and
C7) disposed on a power path between the voltage conversion IC and the second ground,
and disposed on the circuit board, in which:
the voltage conversion IC has an N-sided polygonal shape when viewed from the direction
orthogonal to the circuit board; and
at least one (regions AR1 and AR3) of N regions (regions AR1 to AR4) on the circuit
board, which are defined and formed by N virtual lines starting from a center of the
voltage conversion IC and extending so as to include vertices of the voltage conversion
IC, includes a plurality of elements among the plurality of first elements.
[0192] According to (8), by disposing the elements connected to the second ground in a concentrated
manner on the board, it is possible to reduce the area of the second ground, and thus
it is possible to reduce the possibility of noise entering from other positions on
the board, to increase the area of the first ground, and to stabilize the potential
of the first ground.
[0193] (9) The power supply unit for an aerosol generating device according to (8), in which
at least one (region AR4) of the N regions does not include the first element.
[0194] According to (9), by disposing the elements connected to the second ground in a concentrated
manner on the board, it is possible to reduce the area of the second ground, and thus
it is possible to reduce the possibility of noise entering from other positions on
the board, to increase the area of the first ground, and to stabilize the potential
of the first ground.
[0195] (10) The power supply unit for an aerosol generating device according to any one
of (1) to (9), further including:
a reactor having one end connected to the power supply and an other end connected
to the voltage conversion IC, in which
the reactor is disposed on the second surface.
[0196] According to (10), the voltage conversion IC and the reactor are elements that generate
heat during voltage conversion, and by disposing these on different surfaces, concentration
of heat can be avoided, and thus the durability of the power supply unit for an aerosol
generating device can be improved.
[0197] (11) The power supply unit for an aerosol generating device according to (10), in
which
the reactor is disposed in a region not included in the common ground projection region
overlapping with the common ground when viewed from the direction orthogonal to the
circuit board.
[0198] According to (11), the reactor is less likely to be affected by heat and noise derived
from the common ground, and thus the voltage conversion in the voltage conversion
IC is more likely to be stabilized, and as a result, the amount and the fragrance
of the generated aerosol are also stabilized.
[0199] The present application is based on the Japanese patent application (No. 2021-079882)
filed on May 10, 2021, and contents thereof are incorporated herein by reference.
REFERENCE SIGNS LIST
[0200]
9: step-up DC/DC converter
90: residual portion
100: non-combustion inhaler (power supply unit for aerosol generating device)
162a: main surface (second surface)
162b: secondary surface (first surface)
162: receptacle-mounted board (circuit board)
167: common ground projection region
168: residual portion projection region
R 11: resistor (first element)
R12: resistor (first element)
R13: resistor (first element)
R14: resistor (first element)
C6: capacitor (first element)
C7: capacitor (first element)
C8: output capacitor
C9: output capacitor
C10: output capacitor
C11: output capacitor
C12: output capacitor
BAT: power supply
HTR: heater
Cn: heater connector
VOUT: output terminal
FB: feedback terminal (detection terminal)
PGND: power ground (first ground)
AGND: signal ground (second ground)
CGND: common ground