(19)
(11) EP 4 319 533 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
27.03.2024 Bulletin 2024/13

(43) Date of publication A2:
07.02.2024 Bulletin 2024/06

(21) Application number: 23185784.8

(22) Date of filing: 17.07.2023
(51) International Patent Classification (IPC): 
H10B 43/10(2023.01)
H10B 43/40(2023.01)
H10N 97/00(2023.01)
H10B 43/27(2023.01)
H10B 43/50(2023.01)
H10B 80/00(2023.01)
(52) Cooperative Patent Classification (CPC):
H10B 43/27; H10B 43/50; H10B 43/40; H10B 43/10; H01L 28/90; H10B 80/00
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 02.08.2022 KR 20220096105

(71) Applicant: Samsung Electronics Co., Ltd.
Suwon-si, Gyeonggi-do 16677 (KR)

(72) Inventors:
  • KANG, Inho
    16677 Suwon-si (KR)
  • KIM, Seungyeon
    16677 Suwon-si (KR)
  • KIM, Jiyoung
    16677 Suwon-si (KR)
  • YANG, Woosung
    16677 Suwon-si (KR)
  • LEE, Jaeeun
    16677 Suwon-si (KR)
  • SONG, Kiwhan
    16677 Suwon-si (KR)

(74) Representative: Marks & Clerk LLP 
15 Fetter Lane
London EC4A 1BW
London EC4A 1BW (GB)

   


(54) NONVOLATILE MEMORY DEVICES AND MEMORY SYSTEMS INCLUDING THE SAME


(57) Nonvolatile memory devices and memory systems including the same are disclosed. A vertically-integrated nonvolatile memory device includes a peripheral circuit structure with a peripheral circuit therein, and cell array structure that is bonded to the peripheral circuit structure, and has a cell area and a connection area therein. The cell area includes a plurality of gate electrodes and a plurality of insulating layers alternately stacked, in the connection area. The plurality of gate electrodes include a cell stack having a staircase shape, a plurality of capacitor core contact structures configured to pass through the cell stack in the cell area, and a plurality of capacitor gate contact structures connected to the plurality of gate electrodes in the connection area. Each of the plurality of capacitor core contact structures includes: (i) a first core conductor electrically connected to the peripheral circuit, and (ii) a first cover insulating layer extending between the first core conductor and the plurality of gate electrodes, and constitutes a capacitor in which the first core conductor, the first cover insulating layer, and the plurality of gate electrodes are connected to the peripheral circuit.







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