EP 0685857 A1 19951206 - Inductor chip device.
Title (en)
Inductor chip device.
Title (de)
Chip-induktivität Anordnung.
Title (fr)
Dispositif à inductance de puce.
Publication
Application
Priority
GB 9411107 A 19940603
Abstract (en)
An inductor chip device for mounting on multichip-module, direct-chip-attach or surface-mount assemblies comprises a dielectric substrate (12), a spiral metallisation structure (14) defined on one major surface of the substrate, and a plurality of solder bumps (18, 19) defined on the other major surface of the substrate, the spiral structure being electrically connected to the plurality of solder bumps by means of metal-filled vias. Single or multilayer inductors may be defined, the latter providing higher inductance values in the same chip area. The multilayer inductors are constructed using a multilayer metal-polyimide or similar dielectric structure. The chip inductor provides a very small, accurate, discrete device with high inductance, high Q-factor and high self-resonant frequency. <IMAGE>
IPC 1-7
IPC 8 full level
H01F 41/04 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01)
CPC (source: EP)
H01F 17/0006 (2013.01); H01F 27/292 (2013.01)
Citation (applicant)
GB 2226707 A 19900704 - MICRO STRATES INC [US]
Citation (search report)
- [A] DE 3927181 A1 19900301 - MURATA MANUFACTURING CO [JP]
- [A] EP 0398485 A1 19901122 - PLESSEY OVERSEAS [GB]
- [DA] GB 2226707 A 19900704 - MICRO STRATES INC [US]
- [A] EP 0497556 A1 19920805 - SHARP KK [JP]
- [A] PATENT ABSTRACTS OF JAPAN vol. 11, no. 182 (E - 515) 11 June 1987 (1987-06-11)
Designated contracting state (EPC)
AT DE ES FR IT
DOCDB simple family (publication)
EP 0685857 A1 19951206; EP 0685857 B1 19990908; AT E184419 T1 19990915; DE 69511940 D1 19991014; DE 69511940 T2 20000504; ES 2139841 T3 20000216; GB 2290171 A 19951213; GB 2290171 B 19980121; GB 9411107 D0 19940727; JP H07335439 A 19951222
DOCDB simple family (application)
EP 95303410 A 19950522; AT 95303410 T 19950522; DE 69511940 T 19950522; ES 95303410 T 19950522; GB 9411107 A 19940603; JP 14822295 A 19950523