EP 0694932 B1 20030226 - Inductor device
Title (en)
Inductor device
Title (de)
Drosselspuleanordnung
Title (fr)
Dispositif d'inductance
Publication
Application
Priority
GB 9415316 A 19940729
Abstract (en)
[origin: EP0694932A1] An inductor device for a multichip module, surface-mount or direct-chip attach asembly is formed on a chip or substrate of a dielectric material, high resistivity semiconductor or ferrite as a spiral metallisation, with solder bumps formed on the terminations of the spiral for connection to corresponding conductors on the underlying surface of the assembly. The use of the flip chip solder bonding technique ensures precise lateral alignment and vertical spacing of the chip with respect to the underlying surface. <MATH>
IPC 1-7
IPC 8 full level
H01F 27/06 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01)
CPC (source: EP)
H01F 17/0006 (2013.01); H01F 27/292 (2013.01)
Designated contracting state (EPC)
AT DE ES FR IT
DOCDB simple family (publication)
EP 0694932 A1 19960131; EP 0694932 B1 20030226; AT E233428 T1 20030315; DE 69529709 D1 20030403; GB 2292016 A 19960207; GB 2292016 B 19980722; GB 9415316 D0 19940921; JP H0864422 A 19960308
DOCDB simple family (application)
EP 95304759 A 19950707; AT 95304759 T 19950707; DE 69529709 T 19950707; GB 9415316 A 19940729; JP 20922295 A 19950725