EP 0711848 B1 20030212 - Process for copper electroless plating on iron or iron alloys surfaces
Title (en)
Process for copper electroless plating on iron or iron alloys surfaces
Title (de)
Verfahren zur stromlosen Abscheidung von Kupferüberzügen auf Eisen- und Eisenlegierungsoberflächen
Title (fr)
Procédé de dépôt chimique de cuivre sur des surfaces en fer ou alliage de fer
Publication
Application
Priority
DE 4440299 A 19941111
Abstract (en)
[origin: EP0711848A1] Electroless copper deposition on iron (alloy) surfaces involves contacting the surfaces with a soln. contg. 5-30 g/l Cu and 0.2-5 g/l Mg, the Cu:Mg wt. ratio being esp. 5-35:1. Also claimed is a solid concentrate for making up and replenishing the soln. used in the above process.
IPC 1-7
IPC 8 full level
C23C 18/38 (2006.01)
CPC (source: EP US)
C23C 18/38 (2013.01 - EP US)
Citation (examination)
- CLIFFORD A. HAMPEL: "Encyclopedia of Electrochemistry", 1964, ROBERT E. KRIEGER PUBLISHING COMPANY, HUNTINGTON, N.Y.
- LAWRENCE J. DURNEY: "Electroplating Engineering Handbook", 1984, VAN NOSTRAND REINHOLD COMPANY LTD, NEW YORK, N.Y.
Designated contracting state (EPC)
AT BE DE DK ES FR GB IT SE
DOCDB simple family (publication)
EP 0711848 A1 19960515; EP 0711848 B1 20030212; AT E232563 T1 20030215; DE 4440299 A1 19960515; DE 59510554 D1 20030320; ES 2192567 T3 20031016; US 5776231 A 19980707; US 6261644 B1 20010717
DOCDB simple family (application)
EP 95116255 A 19951016; AT 95116255 T 19951016; DE 4440299 A 19941111; DE 59510554 T 19951016; ES 95116255 T 19951016; US 55428895 A 19951106; US 80202997 A 19970218