Global patent index - EP 0968081 A4

EP 0968081 A4 2000-02-02 - FLATTENING PROCESS FOR BONDED SEMICONDUCTOR SUBSTRATES

Title (en)

FLATTENING PROCESS FOR BONDED SEMICONDUCTOR SUBSTRATES

Title (de)

PLANARISIERUNGSPROZESS FÜR VERBUNDENE HALBLEITERSUBSTRATE

Title (fr)

PROCEDE D'APLATISSEMENT POUR SUBSTRATS SEMI-CONDUCTEURS LIES

Publication

EP 0968081 A4 (EN)

Application

EP 97937023 A

Priority

  • US 9713069 W
  • US 71136096 A

Abstract (en)

[origin: WO9809804A1] Process for the preparation of a substrate having a semiconductor layer of a target thickness, Tt. In the process, two wafers are bonded face to face to form a substrate wherein one of the wafers has a known thickness, Tknown, and a total thickness variation of less than about 0.75 micrometers and the second wafer comprises a layer of semiconductor material. The substrate is thinned in a first stock removal step to reduce the thickness of the semiconductor layer. The distance between the front and back surfaces of the thinned substrate at discrete positions on said front surface is measured to generate thickness profile data. Additional stock is removed from the front surface of the thinned substrate in a second stock removal step to reduce the thickness of the semiconductor layer to the target thickness, Tt, with the amount of stock being removed at each of said discrete positions being determined after taking into account the thickness profile data, Tt, and Tknown.

IPC 1-7 (main, further and additional classification)

H01L 21/20

IPC 8 full level (invention and additional information)

H01L 21/02 (2006.01); H01L 21/20 (2006.01); H01L 21/304 (2006.01); H01L 21/66 (2006.01); H01L 27/12 (2006.01)

CPC (invention and additional information)

H01L 22/20 (2013.01); H01L 21/2007 (2013.01); H01L 21/304 (2013.01); H01L 22/12 (2013.01)

Citation (search report)

Designated contracting state (EPC)

DE FR GB IT

EPO simple patent family

WO 9809804 A1 19980312; EP 0968081 A1 20000105; EP 0968081 A4 20000202; JP 2001501368 A 20010130; KR 20010029456 A 20010406; TW 388078 B 20000421

INPADOC legal status

2003-12-03 [18D] DEEMED TO BE WITHDRAWN

- Ref Legal Event Code: 18D

- Effective date: 20030527

2003-03-05 [17Q] FIRST EXAMINATION REPORT

- Ref Legal Event Code: 17Q

- Effective date: 20030116

2000-02-02 [A4] SUPPLEMENTARY SEARCH REPORT

- Ref Legal Event Code: A4

- Effective date: 19991221

2000-02-02 [AK] DESIGNATED CONTRACTING STATES:

- Ref Legal Event Code: AK

- Designated State(s): DE FR GB IT

2000-02-02 [RIC1] CLASSIFICATION (CORRECTION)

- Ref Legal Event Code: RIC1

- Free Format Text: 7H 01L 21/20 A

2000-01-05 [17P] REQUEST FOR EXAMINATION FILED

- Ref Legal Event Code: 17P

- Effective date: 19990326

2000-01-05 [AK] DESIGNATED CONTRACTING STATES:

- Ref Legal Event Code: AK

- Designated State(s): DE FR GB IT