EP 1474251 A2 20041110 - INTEGRATED SYSTEM FOR PROCESSING SEMICONDUCTOR WAFERS
Title (en)
INTEGRATED SYSTEM FOR PROCESSING SEMICONDUCTOR WAFERS
Title (de)
INTEGRIERTES SYSTEM ZUR BEARBEITUNG VON HALBLEITERSCHEIBEN
Title (fr)
SYSTEME INTEGRE DE TRAITEMENT DE PLAQUETTES A SEMI-CONDUCTEURS
Publication
Application
Priority
- GB 0300695 W 20030217
- US 35714802 P 20020215
- US 39774002 P 20020720
Abstract (en)
[origin: WO03068421A2] An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.
IPC 1-7
IPC 8 full level
G05B 19/418 (2006.01); H01L 21/00 (2006.01); H01L 21/02 (2006.01); H01L 21/304 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01)
CPC (source: EP KR)
G05B 19/41865 (2013.01 - EP); H01L 21/304 (2013.01 - KR); H01L 21/67028 (2013.01 - EP); H01L 21/67051 (2013.01 - EP); H01L 21/67173 (2013.01 - EP); H01L 21/67745 (2013.01 - EP); H01L 21/68707 (2013.01 - EP); H01L 21/68728 (2013.01 - EP); G05B 2219/32272 (2013.01 - EP); G05B 2219/45031 (2013.01 - EP); Y02P 90/02 (2015.11 - EP)
Citation (search report)
See references of WO 03068421A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT SE SI SK TR
DOCDB simple family (publication)
WO 03068421 A2 20030821; WO 03068421 A3 20040422; AU 2003209984 A1 20030904; AU 2003209984 A8 20030904; EP 1474251 A2 20041110; JP 2005517308 A 20050609; KR 20040103935 A 20041209
DOCDB simple family (application)
GB 0300695 W 20030217; AU 2003209984 A 20030217; EP 03739583 A 20030217; JP 2003567597 A 20030217; KR 20047012719 A 20030217