EP 1603673 A1 20051214 - SUBSTRATE FOR WETTING PRE-DETERMINED WETTING POINTS IN A CONTROLLED MANNER WITH SMALL VOLUMES OF LIQUID, SUBSTRATE COVER AND FLOW CHAMBER
Title (en)
SUBSTRATE FOR WETTING PRE-DETERMINED WETTING POINTS IN A CONTROLLED MANNER WITH SMALL VOLUMES OF LIQUID, SUBSTRATE COVER AND FLOW CHAMBER
Title (de)
SUBSTRAT ZUR KONTROLLIERTEN BENETZUNG VORBESTIMMTER BENETZUNGSSTELLEN MIT KLEINEN FLÜSSIGKEITSVOLUMINA, SUBSTRATABDECKUNG UND FLUSSKAMMER
Title (fr)
PROCEDE POUR IMPREGNER, DE MANIERE CONTROLEE, DES ZONES PREDETERMINEES AVEC DE FAIBLES VOLUMES DE LIQUIDE, ELEMENT DE RECOUVREMENT DE SUBSTRAT ET CHAMBRE D'ECOULEMENT
Publication
Application
Priority
- EP 2004002978 W 20040322
- DE 10312670 A 20030321
Abstract (en)
[origin: WO2004082831A1] The invention relates to a substrate for wetting pre-determined wetting points in a controlled manner with small volumes of liquid. Said substrate comprises a carrier plate with a horizontal main surface for wetting pre-determined wetting points with a liquid, and a flat protective layer which is applied to the carrier plate and separates the main surface from the environment. Said protective layer comprises recesses extending vertically in relation to the main surface of the carrier plate, said recesses defining the pre-determined wetting points on the carrier points. The protective layer also contains at least one supply channel leading towards the vertical recesses, reducing the thickness of the flat protective layer and used to supply the wetting liquid to the pre-determined wetting points. In another form of embodiment, the protective layer contains at least one cavity, reducing the thickness of the flat protective layer and used to receive a supply volume of wetting liquids, and comprises vertical recesses which are arranged in the cavities and extend towards the main surface of the carrier plate, said recesses defining the wetting points on the carrier plate and receiving the wetting liquids of the respective cavities.
IPC 1-7
IPC 8 full level
B01J 19/00 (2006.01); B01L 99/00 (2010.01); C40B 40/06 (2006.01); C40B 40/10 (2006.01); C40B 60/14 (2006.01); G01N 35/10 (2006.01)
CPC (source: EP US)
B01J 19/0046 (2013.01 - EP US); B01J 2219/00286 (2013.01 - EP US); B01J 2219/00387 (2013.01 - EP US); B01J 2219/00497 (2013.01 - EP US); B01J 2219/00511 (2013.01 - EP US); B01J 2219/00576 (2013.01 - EP US); B01J 2219/00585 (2013.01 - EP US); B01J 2219/00596 (2013.01 - EP US); B01J 2219/00605 (2013.01 - EP US); B01J 2219/0061 (2013.01 - EP US); B01J 2219/00612 (2013.01 - EP US); B01J 2219/00626 (2013.01 - EP US); B01J 2219/0063 (2013.01 - EP US); B01J 2219/00657 (2013.01 - EP US); B01J 2219/00659 (2013.01 - EP US); B01J 2219/00677 (2013.01 - EP US); B01J 2219/00722 (2013.01 - EP US); B01J 2219/00725 (2013.01 - EP US); B01J 2219/00729 (2013.01 - EP US); B01L 3/0293 (2013.01 - EP US); C40B 40/06 (2013.01 - EP US); C40B 40/10 (2013.01 - EP US); C40B 60/14 (2013.01 - EP US); G01N 2035/1037 (2013.01 - EP US); Y10T 428/8305 (2015.04 - EP US)
Citation (search report)
See references of WO 2004082831A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2004082831 A1 20040930; DE 10312670 A1 20041007; EP 1603673 A1 20051214; US 2006246311 A1 20061102
DOCDB simple family (application)
EP 2004002978 W 20040322; DE 10312670 A 20030321; EP 04722249 A 20040322; US 55027704 A 20040322