EP 1756881 A4 20110309 - THIN FILM THERMOELECTRIC DEVICES FOR POWER CONVERSION AND COOLING
Title (en)
THIN FILM THERMOELECTRIC DEVICES FOR POWER CONVERSION AND COOLING
Title (de)
THERMOELEKTRISCHE DÜNNFILMBAUELEMENTE FÜR DIE STROMWANDLUNG UND KÜHLUNG
Title (fr)
DISPOSITIFS THERMOELECTRIQUES A FILM MINCE DESTINES A LA CONVERSION DE PUISSANCE ET AU REFROIDISSEMENT
Publication
Application
Priority
- US 2004041431 W 20041213
- US 52847903 P 20031211
Abstract (en)
[origin: WO2005074463A2] A thermoelectric device having at least one thermoelectric unit including at least one thermoelectric pair of n-type and p-type thermoelements, a first header couplet to one side of the thermoelectric pair, and a second header coupled to a second side of the thermoelectric pair. The thermoelectric pair has a termal conduction channel area smaller than an area of the first header or the second header such that the thermal conduction area is a fraction of the area of the first header or the second header.
IPC 8 full level
F25B 21/02 (2006.01); H10N 10/10 (2023.01); H10N 10/13 (2023.01); H10N 10/17 (2023.01); H10N 10/81 (2023.01); H10N 10/851 (2023.01)
CPC (source: EP)
H10N 10/13 (2023.02); H10N 10/17 (2023.02); H10N 10/81 (2023.02); H10N 19/101 (2023.02); H01L 23/38 (2013.01); H01L 2924/0002 (2013.01)
C-Set (source: EP)
Citation (search report)
- [XAY] US 6388185 B1 20020514 - FLEURIAL JEAN-PIERRE [US], et al
- [Y] US 5237821 A 19930824 - OKUMURA TAKUJI [JP], et al
- [Y] GB 989370 A 19650414 - PHILIPS ELECTRONIC ASSOCIATED
- [Y] US 4687879 A 19870818 - HENDRICKS TERRY J [US]
- [Y] US 2002062648 A1 20020530 - GHOSHAL UTTAM SHYAMALINDU [US]
- [A] US 4640977 A 19870203 - SHAKUN WALLACE [US]
- [A] JP H08316532 A 19961129 - HITACHI CHEMICAL CO LTD
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005074463 A2 20050818; WO 2005074463 A3 20090402; EP 1756881 A2 20070228; EP 1756881 A4 20110309; JP 2007535803 A 20071206
DOCDB simple family (application)
US 2004041431 W 20041213; EP 04821305 A 20041213; JP 2006544022 A 20041213