Global Patent Index - EP 1958480 A1

EP 1958480 A1 20080820 - MICROMECHANICAL STRUCTURE FOR RECEIVING AND/OR GENERATING ACOUSTIC SIGNALS, METHOD FOR PRODUCING A MICROMECHANICAL STRUCTURE, AND USE OF A MICROMECHANICAL STRUCTURE

Title (en)

MICROMECHANICAL STRUCTURE FOR RECEIVING AND/OR GENERATING ACOUSTIC SIGNALS, METHOD FOR PRODUCING A MICROMECHANICAL STRUCTURE, AND USE OF A MICROMECHANICAL STRUCTURE

Title (de)

MIKROMECHANISCHE STRUKTUR ZUM EMPFANG UND/ODER ZUR ERZEUGUNG VON AKUSTISCHEN SIGNALEN, VERFAHREN ZUR HERSTELLUNG EINER MIKROMECHANISCHEN STRUKTUR UND VERWENDUNG EINER MIKROMECHANISCHEN STRUKTUR

Title (fr)

STRUCTURE MICROMECANIQUE DESTINEE A RECEVOIR ET/OU A EMETTRE DES SIGNAUX ACOUSTIQUES, PROCEDE DE PRODUCTION ET UTILISATION ASSOCIES

Publication

EP 1958480 A1 20080820 (DE)

Application

EP 06807812 A 20061114

Priority

  • EP 2006068419 W 20061114
  • DE 102005056759 A 20051129

Abstract (en)

[origin: DE102005056759A1] The structure has openings (21) and counter units (20,40) that form the respective sides of the structure, where the counter units have respective electrodes. A closed diaphragm (30) is arranged between the counter units. Cavities are formed between the respective counter units and the diaphragm. The structure is monolithically integrated together with an electronic circuit. The counter units are made of a semiconductor material. An independent claim is also included for a method for manufacturing a micromechanical structure.

IPC 8 full level

H04R 19/00 (2006.01)

CPC (source: EP US)

H04R 19/005 (2013.01 - EP US)

Citation (search report)

See references of WO 2007062975A1

Citation (examination)

JP 2005323193 A 20051117 - UNIV NIHON

Designated contracting state (EPC)

DE FR IT

DOCDB simple family (publication)

DE 102005056759 A1 20070531; EP 1958480 A1 20080820; JP 2009517940 A 20090430; JP 5130225 B2 20130130; US 2010002543 A1 20100107; US 7902615 B2 20110308; WO 2007062975 A1 20070607

DOCDB simple family (application)

DE 102005056759 A 20051129; EP 06807812 A 20061114; EP 2006068419 W 20061114; JP 2008542704 A 20061114; US 8447706 A 20061114