EP 2018917 A1 20090128 - Injection molding methods for manufacturing components capable of transporting liquids
Title (en)
Injection molding methods for manufacturing components capable of transporting liquids
Title (de)
Spritzgießverfahren zur Herstellung von Komponenten zur Beförderung von Flüssigkeiten
Title (fr)
Procédés de moulage à injection pour fabriquer des composants capables de transporter des liquides
Publication
Application
Priority
US 77804807 A 20070715
Abstract (en)
Methods for manufacturing components capable of transporting a liquid including providing a mold, placing at least one core made from a core material into the mold, injecting a component material into the mold about the core to produce a green component, heating the green component to burn out the core and produce a brown component, and sintering the brown component to produce a finished component capable of transporting a liquid where the finished component is from 95% to 99% dense.
IPC 8 full level
B22F 5/10 (2006.01)
CPC (source: EP US)
B22F 3/1021 (2013.01 - EP US); B22F 3/225 (2013.01 - EP US); B22F 2998/00 (2013.01 - EP US); B22F 2998/10 (2013.01 - EP US)
C-Set (source: EP US)
Citation (applicant)
- EP 0065702 A2 19821201 - MTU MUENCHEN GMBH [DE]
- US 6274083 B1 20010814 - CLARK III ERNEST BURDELL [US]
Citation (search report)
- [XY] EP 0065702 A2 19821201 - MTU MUENCHEN GMBH [DE]
- [Y] US 6274083 B1 20010814 - CLARK III ERNEST BURDELL [US]
- [Y] WO 0160581 A1 20010823 - CERABIO LLC [US], et al
- [Y] US 5972269 A 19991026 - BARROS EDUARDO L [US], et al
- [A] US 2004126266 A1 20040701 - JACKSON MELVIN [US], et al
- [Y] GULSOY O ET AL: "A new technology in production of aerospace components: powder injection molding (PIM)", PROCEEDINGS OF INTERNATIONAL CONFERENCE ON RECENT ADVANCES IN SPACE TECHNOLOGIES - 20-22 NOV. 2003 - ISTANBUL, TURKEY,, 1 January 2003 (2003-01-01), pages 575 - 578, XP009106428
Designated contracting state (EPC)
DE FR GB IT
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
EP 2018917 A1 20090128; CA 2636745 A1 20090115; CN 101342593 A 20090114; JP 2009019275 A 20090129; MX 2008008376 A 20090304; US 2009014101 A1 20090115
DOCDB simple family (application)
EP 08160360 A 20080714; CA 2636745 A 20080703; CN 200810131632 A 20080715; JP 2008180836 A 20080711; MX 2008008376 A 20080624; US 77804807 A 20070715