EP 2033219 A1 20090311 - POWER HOUSING FOR SEMICONDUCTOR CHIPS AND THE ARRANGEMENT THEREOF FOR HEAT DISSIPATION
Title (en)
POWER HOUSING FOR SEMICONDUCTOR CHIPS AND THE ARRANGEMENT THEREOF FOR HEAT DISSIPATION
Title (de)
LEISTUNGSGEHÄUSE FÜR HALBLEITERCHIPS UND DEREN ANORDNUNG ZUR WÄRMEABFUHR
Title (fr)
BOÎTIER DE PUISSANCE POUR PUCES À SEMI-CONDUCTEUR ET CONFIGURATION DUDIT BOÎTIER POUR LA DISSIPATION DE CHALEUR
Publication
Application
Priority
- CH 2006000574 W 20061017
- CH 16852005 A 20051020
Abstract (en)
[origin: WO2007045112A1] The invention relates to a surface-mountable power housing (1) for semiconductor chips (10) and the arrangement thereof for heat dissipation at cooling media (15) in high-power components by reducing the constructionally dictated thermal resistances lying in series. The power housing is formed in such a way that the underside can be connected directly to the heat sink (15) through an opening (21) in the wiring plane (25), and the required wiring plane is not incorporated. The housing is embodied from a chip carrier substrate (12) and a housing carrier substrate (13), which are provided with electrical connections for contact-connecting the semiconductor chips (10) to the wiring plane (25). The power housing preferably comprises ceramic materials or silicon.
IPC 8 full level
H01L 23/367 (2006.01)
CPC (source: EP)
H01L 23/3677 (2013.01); H01L 23/3735 (2013.01); H05K 1/021 (2013.01); H01L 24/48 (2013.01); H01L 33/486 (2013.01); H01L 33/64 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/19107 (2013.01); H05K 1/182 (2013.01); H05K 3/0061 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10727 (2013.01)
Citation (search report)
See references of WO 2007045112A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
WO 2007045112 A1 20070426; EP 2033219 A1 20090311; TW 200729437 A 20070801
DOCDB simple family (application)
CH 2006000574 W 20061017; EP 06804809 A 20061017; TW 95138146 A 20061017