Global Patent Index - EP 2501870 A1

EP 2501870 A1 20120926 - SEEPAGE MODULE, AND SEEPAGE SYSTEM FORMED THEREWITH

Title (en)

SEEPAGE MODULE, AND SEEPAGE SYSTEM FORMED THEREWITH

Title (de)

VERSICKERUNGSMODUL SOWIE DAMIT GEBILDETES VERSICKERUNGSSYSTEM

Title (fr)

MODULE D'INFILTRATION AINSI QUE SYSTÈME D'INFILTRATION

Publication

EP 2501870 A1 20120926 (DE)

Application

EP 10798458 A 20101119

Priority

  • AT 18412009 A 20091119
  • AT 5492010 A 20100406
  • AT 2010000455 W 20101119

Abstract (en)

[origin: WO2011060475A1] The invention relates to a mold device (103) for an injection molding machine (102) used to produce an object (136) from an elastomer material. Said mold device (103) comprises a first basic mold piece (104) that is arranged at the nozzle end of the injection molding machine (102), and a second basic mold piece (108) that can be moved relative to the first basic mold piece (104) parallel to a longitudinal extruder axis (110). A supporting device (123) can be moved relative to one of the basic mold pieces (104, 108) within a first guiding arrangement (124) extending parallel to the longitudinal extruder axis (110). The basic mold pieces (104, 108) form an external mold (118) along with wall mold pieces (138) that can be moved perpendicular to the longitudinal extruder axis (110). The wall mold pieces (138) are designed as mold modules (139) including an adjusting drive (141), another guiding arrangement (140), and a mold segment (119, 120) that can be moved within said other guiding arrangement (140). At least two of the mold modules (139) are arranged on the supporting device (123), diametrically across from each other relative to the longitudinal extruder axis (110).

IPC 8 full level

E03F 1/00 (2006.01); B29C 45/33 (2006.01); B29C 45/36 (2006.01); B29C 45/17 (2006.01); B29K 21/00 (2006.01)

CPC (source: EP)

B29C 45/332 (2013.01); E03F 1/005 (2013.01); B29C 45/36 (2013.01); B29C 2045/1792 (2013.01); B29K 2021/00 (2013.01)

Citation (search report)

See references of WO 2011060476A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2011060475 A1 20110526; AT 509154 A1 20110615; AT 509154 B1 20111215; EP 2501534 A1 20120926; EP 2501870 A1 20120926; WO 2011060476 A1 20110526

DOCDB simple family (application)

AT 2010000454 W 20101119; AT 2010000455 W 20101119; AT 5492010 A 20100406; EP 10798457 A 20101119; EP 10798458 A 20101119