EP 2698590 B1 20161130 - PIPING STRUCTURE OF COOLING DEVICE, MANUFACTURING METHOD THEREOF, AND PIPE COUPLING METHOD.
Title (en)
PIPING STRUCTURE OF COOLING DEVICE, MANUFACTURING METHOD THEREOF, AND PIPE COUPLING METHOD.
Title (de)
ROHRSTRUKTUR FÜR EINE KÜHLVORRICHTUNG, HERSTELLUNGSVERFAHREN DAFÜR UND ROHRVERBINDUNGSVERFAHREN
Title (fr)
STRUCTURE DE TUYAUTERIE D'UN DISPOSITIF DE REFROIDISSEMENT, MÉTHODE DE FABRICATION DE CELLE-CI ET MÉTHODE D'ACCOUPLEMENT DE TUYAUX
Publication
Application
Priority
- JP 2011089347 A 20110413
- JP 2012060197 W 20120410
Abstract (en)
[origin: EP2698590A1] In a piping structure of a cooling device using an ebullient cooling system, the cooling performance of the cooling device is degraded if the pipe is provided with flexibility, therefore, a piping structure of a cooling device according to an exemplary aspect of the invention includes a first tubular part with a hollow portion through which a refrigerant used in the cooling device flows; wherein the first tubular part is made of metal materials; and the surface roughness of the inner surface of the first tubular part is less than or equal to the size of a condensation nucleus for the refrigerant.
IPC 8 full level
F28F 13/02 (2006.01); F28D 15/02 (2006.01); F28F 1/00 (2006.01); F28F 13/18 (2006.01); F28F 19/04 (2006.01); F28F 21/08 (2006.01)
CPC (source: EP US)
F28D 15/0266 (2013.01 - EP US); F28F 1/00 (2013.01 - US); F28F 13/187 (2013.01 - EP US); F28F 19/04 (2013.01 - EP US); F28F 21/084 (2013.01 - EP US); F28F 1/003 (2013.01 - EP US); F28F 2255/02 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2698590 A1 20140219; EP 2698590 A4 20141119; EP 2698590 B1 20161130; CN 103459969 A 20131218; JP 6156142 B2 20170705; JP WO2012141320 A1 20140728; US 2014027100 A1 20140130; WO 2012141320 A1 20121018
DOCDB simple family (application)
EP 12770839 A 20120410; CN 201280017740 A 20120410; JP 2012060197 W 20120410; JP 2013509998 A 20120410; US 201214110671 A 20120410