EP 2944219 A1 20151118 - DEVICE FOR NAIL APPLIQUE TRANSFER, SHEET OF NAIL APPLIQUES AND METHOD FOR NAIL APPLIQUE TRANSFER
Title (en)
DEVICE FOR NAIL APPLIQUE TRANSFER, SHEET OF NAIL APPLIQUES AND METHOD FOR NAIL APPLIQUE TRANSFER
Title (de)
VORRICHTUNG ZUR NAGELAUFLAGENÜBERTRAGUNG, NAGELAUFLAGENFILM UND VERFAHREN ZUR NAGELAUFLAGENÜBERTRAGUNG
Title (fr)
DISPOSITIF ET PROCÉDÉ DE TRANSFERT D'APPLIQUE D'ONGLE ET FEUILLES D'APPLIQUE
Publication
Application
Priority
KR 20140059123 A 20140516
Abstract (en)
Disclosed is a die-cut device for nail applique transfer. The device includes a thin film element having a proximal end, a distal end opposite the proximal end, and a lower surface and forming a nail applique. The device includes an adhesive layer disposed on the lower surface of the thin film element and an application tab detachably attached to a portion of the adhesive layer adjacent to the distal end of the thin film element. The adhesive layer has a first portion and a second portion. The first portion of the adhesive layer is adjacent to the distal end of the thin film element and is covered with the application tab. The second portion of the adhesive layer remains exposed for transfer of the nail applique to a fingernail or toenail. The application tab is suitable for a user to grasp when the nail applique is transferred to the fingernail or toenail.
IPC 8 full level
A45D 29/00 (2006.01)
CPC (source: BR EP KR US)
A45D 29/001 (2013.01 - BR EP KR US); A45D 29/18 (2013.01 - BR)
Citation (applicant)
US 2008283073 A1 20081120 - PARK FA YOUNG [US]
Citation (search report)
- [XI] US 4947876 A 19900814 - LARSEN JEAN [US]
- [A] EP 2486820 A1 20120815 - KISS NAIL PRODUCTS INC [US]
- [A] EP 2564724 A2 20130306 - CHANG SUNG YONG [US]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2944219 A1 20151118; BR 102015009759 A2 20180529; CA 2889093 A1 20151116; CN 105077963 A 20151125; JP 2015217300 A 20151207; KR 101457432 B1 20141112; US 2015327651 A1 20151119
DOCDB simple family (application)
EP 15165950 A 20150430; BR 102015009759 A 20150429; CA 2889093 A 20150420; CN 201510214129 A 20150429; JP 2015087522 A 20150422; KR 20140059123 A 20140516; US 201514712555 A 20150514